A light trapping optical cover employing an optically transparent layer with a plurality of light deflecting elements. The transparent layer is configured for an unimpeded light passage through its body and has a broad light input surface and an opposing broad light output surface. The light deflecting elements deflect light incident into the transparent layer at a sufficiently high bend angle with respect to a surface normal and direct the deflected light toward a light harvesting device adjacent to the light output surface. The deflected light is retained by means of at least TIR in the system formed by the optical cover and the light harvesting device which allows for longer light propagation paths through the photoabsorptive layer of the device and for an improved light absorption. The optical cover may further employ a focusing array of light collectors being pairwise associated with the respective light deflecting elements.

Photovoltaic devices including direct gap III-V absorber materials and operatively associated back structures enhance efficiency by enabling photon recycling. The back structures of the photovoltaic devices include wide bandgap III-V layers, highly doped (In)GaAs layers, patterned oxide layers and metal reflectors that directly contact the highly doped (In)GaAs layers through vias formed in the back structures. Localized ohmic contacts are formed in the back structures of the devices.

According to some aspects, an apparatus for converting electromagnetic radiation into electric power is provided, comprising a first layer comprising a first semiconductor material, an absorber in contact with the first layer, a second layer comprising a second semiconductor material, the second layer being in contact with the absorber, and a reflector to reflect at least a portion of electromagnetic radiation passing through the second layer. According to some aspects, a method of forming an apparatus for converting electromagnetic radiation into electric power is provided, comprising forming a reflector on a substrate, forming a first layer in contact with the reflector, the first layer comprising a first semiconductor material, forming an absorber in contact with the first layer, and forming a second layer in contact with the absorber, the second layer comprising a second semiconductor material.

An embodiment includes an apparatus comprising: a first photovoltaic cell; a first through silicon via (TSV) included in the first photovoltaic cell and passing through at least a portion of a doped silicon substrate, the first TSV comprising (a)(i) a first sidewall, which is doped oppositely to the doped silicon substrate, and (a)(ii) a first contact substantially filling the first TSV; and a second TSV included in the first photovoltaic cell and passing through at least another portion of the doped silicon substrate, the second TSV comprising (b)(i) a second sidewall, which comprises the doped silicon substrate, and (b)(ii) a second contact substantially filling the second TSV; wherein the first and second contacts each include a conductive material that is substantially transparent. Other embodiments are described herein.

Disclosed are embodiments of a thin-film photovoltaic technology including a single-junction crystalline silicon solar cell with a photonic-plasmonic back-reflector structure for lightweight, flexible energy conversion applications. The back-reflector enables high absorption for long-wavelength and near-infrared photons via diffraction and light-concentration, implemented by periodic texturing of the bottom-contact layer by nanoimprint lithography. The thin-film crystalline silicon solar cell is implemented in a heterojunction design with amorphous silicon, where plasma enhanced chemical vapor deposition (PECVD) is used for all device layers, including a low-temperature crystalline silicon deposition step. Excimer laser crystallization is used to integrate crystalline and amorphous silicon within a monolithic process, where a thin layer of amorphous silicon is converted to a crystalline silicon seed layer prior to deposition of a crystalline silicon absorber layer via PECVD. The crystalline nature of the absorber layer and the back-reflector enable efficiencies higher than what is achievable in other thin-film silicon devices.

An optoelectronic device having a textured layer is described. In an aspect, a method may be used to produce the optoelectronic device, where the method includes epitaxially growing a semiconductor layer of the optoelectronic device on a growth substrate, and exposing the semiconductor layer to an etching process to create at least one textured surface in the semiconductor layer. The textured semiconductor layer can be referred to as a textured layer. The etching process is performed without the use of a template layer, or similar layer, configured as a mask to generate the texturing. The etching process can be done by one or more of a liquid or solution-based chemical etchant, gas etching, laser etching, plasma etching, or ion etching. The method can also include lifting the semiconductor layer of the optoelectronic device from the growth substrate by, for example, the use of an epitaxial lift off (ELO) process.

An organic light emitting diode device can be formed by imprinting a material layer to form an array of non-planar features selected from protrusions and via cavities. The array of non-planar features can be imprinted by moving the material layer under a rolling press or under a rolling die that transfers a pattern thereupon. A layer stack including a transparent electrode layer, an organic light emitting material layer, and a backside electrode layer is formed over the array of non-planar features such that convex sidewalls of the organic light emitting material layer contact concave sidewalls of the backside electrode layer. The layer stack can be encapsulated with a passivation substrate. Additionally or alternatively, an array of convex lenses can be imprinted on a transparent material layer to decrease total internal reflection of an organic light emitting diode device.

This solar module has: a base member that is curved in the vertical direction and the horizontal direction; strings each constituted from a plurality of solar cells and first wiring members connecting adjacent solar cells in the vertical direction, wherein a plurality of the strings are arranged side by side on the base member; and a string group constituted from a plurality of the strings and second wiring members, which are disposed at both sides in the vertical direction of the strings and connected to the first wiring members, thereby connecting adjacent strings to one another in the horizontal direction. The string group is divided into at least two blocks that are side by side in the vertical direction. Second wiring members are disposed adjacent in the horizontal direction, or second wiring members are disposed adjacent in the vertical direction between the blocks, and are secured to one another.

Laser processing schemes are disclosed for producing various types of hetero-junction and homo-junction solar cells. The methods include base and emitter contact opening, selective doping, and metal ablation. Also, laser processing schemes are disclosed that are suitable for selective amorphous silicon ablation and selective doping for hetero-junction solar cells. These laser processing techniques may be applied to semiconductor substrates, including crystalline silicon substrates, and further including crystalline silicon substrates which are manufactured either through wire saw wafering methods or via epitaxial deposition processes, that are either planar or textured/three-dimensional. These techniques are highly suited to crystalline semiconductor, including crystalline silicon.

A photoelectric conversion device including a transparent substrate, a first electrode, at least a photoelectric conversion layer and a second electrode is provided. The first electrode is located on the transparent substrate. The transparent substrate means that at least some parts of the substrate area are transparent. At least a photoelectric conversion layer is located on the first electrode, wherein the optical light transmittance of the photoelectric conversion layer in at least a portion of the visible spectrum is higher than 20%. The second electrode is located on the photoelectric conversion layer.