A method for providing a piezoelectric device is described. The method includes providing a first electrode layer on a substrate and coating at least one layer of piezoelectric material. The coating using at least one of clot-die coating, dip coating, aerosol coating and R2R coating such that a layer of the at least one layer of piezoelectric material has a variation in thickness of not more than ten percent. The layer(s) of piezoelectric materials are also heat treated. Multiple layers of piezoelectric material may be slot-die coated and heat treated to provide a multilayer having the desired thickness. A second electrode layer is provided on the layer(s) of piezoelectric material.

A microphone device may include: a substrate wafer, a support member bonded to a front surface of the substrate wafer, a single-crystal piezoelectric film provided over the support member, a top electrode and a bottom electrode. The single-crystal piezoelectric film may have a first surface and an opposing second surface. The top electrode may be arranged adjacent to the first surface of the single-crystal piezoelectric film. The bottom electrode may be arranged adjacent to the second surface of the single-crystal piezoelectric film. The substrate wafer may have a through-hole formed therein. The through-hole of the substrate wafer may be at least substantially aligned with at least one of the top electrode and the bottom electrode.

Even with the occurrence of misalignment of inner electrodes in a ceramic collective board, a multilayer electronic component is made in which inner electrodes are disposed at suitable positions. Disclosed herein are descriptions of a first-stage ceramic collective board and a second-stage ceramic collective board used for manufacturing a multilayer electronic component. The present disclosure further describes a manufacturing method for the second-stage ceramic collective board and a manufacturing method for a multilayer electronic component.

A manufacturing method of miniature fluid actuator is disclosed and includes the following steps. A flow-channel main body manufactured by a CMOS process is provided, and an actuating unit is formed by a deposition process, a photolithography process and an etching process. Then, at least one flow channel is formed by etching, and a vibration layer and a central through hole are formed by a photolithography process and an etching process. After that, an orifice layer is provided to form at least one outflow opening by an etching process, and then a chamber is formed by rolling a dry film material on the orifice layer. Finally, the orifice layer and the flow-channel main body are flip-chip aligned and hot-pressed, and then the miniature fluid actuator is obtained by a flip-chip alignment process and a hot pressing process.

A multi-layer piezoelectric microactuator assembly has at least one poled and active piezoelectric layer and one poled but inactive piezoelectric layer. The poled but inactive layer acts as a constraining layer in resisting expansion or contract of the first piezoelectric layer.

Embodiments of the present disclosure provide a force touch display panel, a detection method thereof, and a display apparatus. The force touch display panel includes: a substrate; a display structure disposed in a display area on the substrate; and a force common electrode layer, a piezoelectric material layer, and a force sense electrode layer, which are stacked in sequence over the display structure. The force sense electrode layer includes a force sense electrode configured for identifying different forces, and the force sense electrode additionally serves as a touch detection electrode configured for identifying a touch operation.

A manufacturing method for an electrode of a high-temperature piezoelectric element, comprises: coating traditional conductive slurry on surfaces of a molded piezoelectric material (1); then polarizing the piezoelectric material (1); and then removing the coating of conductive slurry (2) on the surfaces there of, and connecting the piezoelectric material to outside electrode lead wires (3) to output a signal generated by piezoelectric effect thereof. A structure of a high-temperature piezoelectric element, comprises polarized piezoelectric material (1), wherein the coating of metallic conductive slurry (2) is removed from the surfaces of the polarized piezoelectric material (1) and the surfaces of the polarized piezoelectric material (1) is connected to electrode lead wires (3) to output a signal generated by piezoelectric effect thereof. By removing the traditional coating of slurry for electrode, it is avoided that the output resistance of the piezoelectric element is reduced because of the high temperature diffusion of electrode material at a high temperature, and the thermal performance of the piezoelectric element is improved. By adding diamond or graphite coating as electrode, the sensitivity of outputting charges of the piezoelectric element is improved.

An acoustic wave device includes a piezoelectric substrate including an electrode formation surface, and an IDT electrode provided on the electrode formation surface. The IDT electrode includes a close contact layer located on the electrode formation surface, and a main electrode layer located on the close contact layer. The close contact layer includes first and second layers that respectively include first and second lateral surfaces. An area of a surface of the second layer that is in close contact with the main electrode layer is smaller than an area of a surface of the first layer that is in close contact with the piezoelectric substrate. An inclination angle of the second lateral surface is smaller than an inclination angle of the first lateral surface.

The present invention relates to a energy conversion device (100) configured to convert a light signal into an electrical signal, comprising: an actuator element (50), substantially planar, having at least one activatable portion (30), said activatable portion comprising a photomobile polymeric material; a transducer element (60), substantially planar, having at least a portion of piezoelectric material; wherein said actuator element (50) is coupled to said transducer element (60) so that, at a light beam incident on said photomobile polymeric material, a movement of said transducer element (60) is activated through a movement of said activatable portion (30), said movement of said transducer element (60) providing the generation of a potential difference at the terminal ends of said portion of piezoelectric material.

The present invention also relates to a method of production of the aforesaid device.

A method of fabricating the semiconductor device includes the following steps. Forming a sacrificial portion at a first end of an upper electrode layer before a passivation layer is formed so that it supports a corresponding end portion of the passivation layer, making the passivation layer not suspended at all. In this way, the suspended portion of the passivation layer will not be damaged during the formation of a contact pad. In addition, subsequent to the formation of the contact pad, removing the sacrificial portion, freeing up a space under the end portion of the passivation layer so that the end portion itself becomes a suspended portion. This can ensure performance of the resulting semiconductor device.