Patent classifications
H10H20/8142
RGB monolithic integrated high purity microLED display device
A colour conversion resonator system, comprising: a first partially reflective region configured to transmit light of a first primary peak wavelength and to reflect light of a second primary peak wavelength; a second partially reflective region configured to at least partially transmit light of the first and second primary peak wavelengths and to reflect light of a third primary peak wavelength; a third partially reflective region configured to at least partially reflect light with the third primary peak wavelength; a first colour conversion resonator cavity arranged to receive input light with the first primary peak wavelength through the first partially reflective region and to convert at least some of the light of the first primary peak wavelength to provide light of the second primary peak wavelength, wherein the first colour conversion resonator cavity is arranged such that the second primary peak wavelength resonates in the first colour conversion resonator cavity and resonant light with the second primary peak wavelength is output through the second partially reflective region; and a second colour conversion resonator cavity arranged to receive input light comprising the second primary peak wavelength through the second partially reflective region and to convert at least some of the second primary peak wavelength to provide light of the third primary peak wavelength, wherein the second colour conversion resonator cavity is arranged such that the third primary peak wavelength resonates in the second colour conversion resonator cavity and resonant light with the third primary peak wavelength is output through the third partially reflective region, wherein the first colour conversion resonator cavity and the second resonator cavity are arranged partially to overlap to provide a non-overlapping portion and an overlapping portion thereby to define a first light emitting surface and a second light emitting surface respectively, wherein the first light emitting surface is arranged to provide resonant light of the second primary peak wavelength and the second light emitting surface is arranged to provide resonant light of the third primary peak wavelength.
LIGHT-EMITTING DEVICE
A light-emitting device includes a first nitride semiconductor structure; a stress relief structure on the first nitride semiconductor structure including a plurality of narrow band gap layers and a plurality of wide band gap layers alternately stacked, wherein one of the plurality of wide band gap layers includes a plurality of wide band gap sub-layers and one of the plurality of wide band gap sub-layers includes aluminum; an active structure on the stress relief structure including a plurality of quantum well layers and a plurality of barrier layers alternately stacked, wherein one of the plurality of barrier layers includes a plurality of barrier sub-layers and one of the plurality of barrier sub-layers includes aluminum, an aluminum composition of the wide band gap sub-layer is greater than or equal to that of the barrier sub-layer, and an average aluminum composition of the wide band gap layer is greater than that of the barrier layer; and an electron blocking structure on the active structure.
Device for generating single photons and entangled photon pairs
A device for generating photons includes a quantum box inserted into an optical cavity of micro-pillar type having at least one optical mode, the quantum box having at least one fundamental state and two states with one elementary excitation, the optical cavity having a bottom face and a top face, the bottom face bearing an electrical contact, the photon generation device advantageously comprises at least three electrical bonding pads electrically insulated from one another, arranged around the top face of the cavity.
Semiconductor light source and driving circuit thereof
Provided are a semiconductor light source and a driver circuit thereof. The semiconductor light source includes an active layer, a first semiconductor layer, a second semiconductor layer, a first electrode, a second electrode, and a third electrode. The first semiconductor layer and the second semiconductor layer are located on two opposite sides of the active layer. The first electrode is in ohmic contact with the first semiconductor layer. The third electrode is in ohmic contact with the second semiconductor layer. A first dielectric layer is disposed between the first electrode and the second electrode. The first semiconductor layer is a p-type semiconductor layer, and the second semiconductor layer is an n-type semiconductor layer. Alternatively, the first semiconductor layer is an n-type semiconductor layer, and the second semiconductor layer is a p-type semiconductor layer.