A display panel includes: a backplane, a plurality of light-emitting devices, a plurality of connecting leads, a first protective layer and a reflective layer. The backplane includes a first main surface, a second main surface, and a plurality of side surfaces. At least one side surface is as a selected side surface. The plurality of light-emitting devices are disposed on the second main surface and are electrically connected to the plurality of connecting leads. The plurality of connecting leads are disposed on the first main surface, the selected side surface and the second main surface, and each connecting lead sequentially passes through the selected side surface and the second main surface from the first main surface. The first protective layer covers the plurality of connecting leads. The reflective layer includes at least a first portion covering a portion of the first protective layer on the selected side surface.

A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a plurality of chips arranged on the base substrate each including a chip main body and a plurality of terminals arranged thereon; a plurality of fixed connection portions arranged on the base substrate, and adjacent to the plurality of chips; a terminal expansion layer arranged on the base substrate; and a plurality of expansion wires in the terminal expansion layer and configured to electrically connect the chips, wherein an expansion wire configured to electrically connect two chips includes at least a first wire segment and a second wire segment, and the first wire segment is configured to electrically connect a terminal of a chip and a fixed connection portion adjacent to the chip, and the second wire segment is configured to connect two fixed connection portions between the two chips.

The present invention provides a display device and a manufacturing method thereof that can simplify manufacturing steps and enhance efficiency in the use of materials, and further, a manufacturing method that can enhance adhesiveness of a pattern. One feature of the invention is that at least one or more patterns needed for manufacturing a display panel, such as a conductive layer forming a wiring or an electrode or a mask for forming a desired pattern is/are formed by a method capable of selectively forming a pattern, thereby manufacturing a display panel.

A method of fabricating a polarizing member includes: sequentially disposing a metal layer and a preliminary pattern layer on a base substrate including a display area and a non-display area; forming a patterned resin layer on the preliminary pattern layer in the display area, the patterned resin layer including patterns formed on a surface of the patterned resin layer; surface-treating the preliminary pattern layer and the patterned resin layer; forming a mask pattern including a photoresist material on the preliminary pattern layer disposed in the non-display area; forming preliminary patterns on the preliminary pattern layer using the patterned resin layer; and forming a wire grid polarizing unit in the display area by etching the metal layer using the preliminary pattern and the mask pattern as a polarizing pattern.

The display panel includes: a substrate, wherein a plurality of first protruding portions are disposed on a first edge of the substrate; a line layer including a plurality of first traces and a plurality of second traces, wherein the first traces are disposed on the first surface, the second traces are disposed on the second surface, and each of the first traces and each of the second traces respectively extend to one of the first protruding portions; and a conducting layer covering the first protruding portion, wherein the first trace is connected to the second trace by the conducting layer.

A display device including a substrate having thin film transistors (TFT) comprising: the TFT including an oxide semiconductor film, a gate electrode and an insulating film formed between the oxide semiconductor film and the gate electrode, wherein a first aluminum oxide film and a second aluminum oxide film, which is formed on the first aluminum oxide film, are formed between the insulating film and the gate electrode, an oxygen concentration in the first aluminum oxide film is bigger than an oxygen concentration in the second aluminum oxide film.

A substrate includes: a base substrate; an organic layer on the base substrate with openings defined through the organic layer; a first metal layer including first metal patterns, where the first metal pattern is in the opening, and includes a first portion parallel to a bottom of the opening and a second portion parallel to a lateral wall of the opening; a second metal layer having a thickness greater than a thickness of the first metal layer; where the second metal layer includes second metal patterns, the second metal pattern is located in the opening and is in contact with the first metal layer; and, a distance from a surface of the first metal layer away from the base substrate to a plane where the base substrate is located is smaller than a distance from a surface of the organic layer away from the base substrate to the plane.

An electronic printing device and a method for manufacturing a metal printed object using the same are provided. The electronic printing device includes a printing substrate including: a substrate having an active region and a peripheral region; a power layer disposed on the substrate; an insulating layer disposed on the power layer; and a plurality of printing units disposed on the substrate and in the active region, wherein one of the plurality of printing units includes: a conductive layer disposed on the power layer and electrically connected to the power layer, wherein the insulating layer has a first opening, a first part of the conductive layer is covered by the insulating layer, a second part of the conductive layer is exposed by the first opening, the first part has a first thickness, the second has a second thickness, and the first thickness is greater than the second thickness.

The present application provides an array substrate, a manufacturing method thereof, and a display panel thereof. A first ink is coated on an active region of an underlay substrate to form an active layer pattern, a second ink is coated on a channel region on the underlay substrate to form a protective layer pattern. Then the active layer pattern and the protective layer pattern is cured to form films, and to simultaneously form an active layer and a protective layer. The protective layer can protect the channel region of the active layer to mitigate an issue of the conventional corroded and contaminated metal oxide.

A method of manufacturing the display apparatus includes: attaching a removable first film to one of an upper surface and a lower surface of a substrate, adjacent to a side surface of the substrate; hydrophilic-treating a first region of the side surface of the substrate, where the side surface includes the first region and a second region; providing an organic film pattern on the first region after the hydrophilic-treating; providing a metal layer on the first region and the second region after forming the organic film pattern; and forming a connection wire by removing the organic film pattern and portions of the metal layer on the first region.