A light source. The light source includes as components which superimpose one another in this sequence: a first light-emitting semiconductor component; a first carrier element comprising a first carrier surface which faces the first light-emitting semiconductor component and a first cooling surface deliminating at least in part a first fluid path; and a distributor element comprising a first cavity and a further cavity. The first cavity and the further cavity are fluidically connected to one another by the first fluid path. Also disclosed are a printing machine; methods, in particular for producing a printed product, for irradiating a material to be irradiated, and for producing a light source; corresponding method products; an assembly having the light source; and uses of the light source.

Described herein are devices, systems and methods for utilizing fluid cooling to thermally manage electrically-powered devices such as microprocessors and microprocessor chips. Embodiments incorporating features of the present disclosure can purge heated cooling fluid from the system immediately after it has been used to absorb heat from an electrically-powered device, so that other devices in the system do not receive cooling fluid from another device in the system. In some embodiments, cooling fluid can be made to directly impinge on or near an electrically-powered device such as a microprocessor or microprocessor chip.

Disclosed are an LED light and a heat dissipation device thereof. The LED light comprises at least one LED light bead disposed on the heat dissipation device. The heat dissipation device comprises a circuit board having a first metal layer and a second metal layer located on two opposite sides respectively; and a heat sink. The LED light bead is welded to the first metal layer. The second metal layer is welded to the heat sink. The circuit board has heat conductive holes, so that a heat energy generated by the LED light bead can be transferred to the heat sink through the heat conductive holes. Some of the heat conductive holes can be optionally filled with heat conductive material columns, so that the heat energy generated by LED light bead can be conducted to the heat sink through the heat conductive material columns in the heat conductive holes.

Described herein are devices, systems and methods for utilizing fluid cooling to thermally manage electrically-powered devices such as microprocessors and microprocessor chips. Embodiments incorporating features of the present disclosure can purge heated cooling fluid from the system immediately after it has been used to absorb heat from an electrically-powered device, so that other devices in the system do not receive cooling fluid from another device in the system. In some embodiments, cooling fluid can be made to directly impinge on or near an electrically-powered device such as a microprocessor or microprocessor chip.

Provided is a display device including a display panel and a fluid heat dissipation module which includes a circulation cooling assembly and at least one heat dissipation assembly. A heat dissipation assembly includes a first fluid cavity adjacent to a first surface of the display panel and a second fluid cavity adjacent to a second surface of the display panel. The first fluid cavity communicates with the second fluid cavity. The heat dissipation assembly includes at least one fluid inlet disposed on an end of the first fluid cavity and at least one fluid outlet disposed on an end of the second fluid cavity. A fluid inlet and a fluid outlet are each connected to the circulation cooling assembly. The first fluid cavity of the heat dissipation assembly and the second fluid cavity of the heat dissipation assembly are adjacent to two surfaces of the display panel.

The present invention relates to a ceramic substrate with a heat sink and a manufacturing method thereof. The ceramic substrate comprises: a ceramic substrate including a metal layer on at least one surface of a ceramic base; and a heat sink that is bonded to one surface of the ceramic substrate and has a multi-layer structure that refrigerant enters and exits. The present invention has an integrated structure in which the heat sink having a multi-layer structure that refrigerant enters and exits is bonded to the ceramic substrate, and thus is capable of effectively dissipating heat generated from a semiconductor chip.

A backlight module and a display device are disclosed. The backlight module includes a light board and a heat dissipation structure. Multiple light-emitting elements are arranged in a matrix on the light board. The heat dissipation structure includes a first control layer arranged on a side of the light board facing away from the light-emitting elements, and a second control layer opposite to the first control layer. There is a gap between the first control layer and second control layer, and there is disposed a coolant droplet in the gap. When a light-emitting element satisfies a first heating condition, the first control layer and second control layer control a coolant droplet to move to a position underneath the light-emitting element. When the light-emitting element satisfies a second heating condition, the first control layer and second control layer control the coolant droplet to leave the position underneath the light-emitting element.

Disclosed are an LED light and a heat dissipation device thereof. The LED light comprises at least one LED light bead disposed on the heat dissipation device. The heat dissipation device comprises a circuit board having a first metal layer and a second metal layer located on two opposite sides respectively; and a heat sink. The LED light bead is welded to the first metal layer. The second metal layer is welded to the heat sink. The circuit board has heat conductive holes, so that a heat energy generated by the LED light bead can be transferred to the heat sink through the heat conductive holes. Some of the heat conductive holes can be optionally filled with heat conductive material columns, so that the heat energy generated by LED light bead can be conducted to the heat sink through the heat conductive material columns in the heat conductive holes.