A thermoelectric material includes a lower part from a bottom surface of the thermoelectric material to a point of 30% of an average thickness of the thermoelectric material and having an average content of carbon atoms of 40 at % or more in the thermoelectric material, and an upper part corresponding to a remaining 70% of the average thickness of the thermoelectric material and having an average content of carbon atoms of 20 at % or less in the thermoelectric material.

A structure and method for cooling a three-dimensional integrated circuit (3DIC) are provided. A cooling element is configured for thermal connection to the 3DIC. The cooling element includes a plurality of individually controllable cooling modules disposed at a first plurality of locations relative to the 3DIC. Each of the cooling modules includes a cold pole and a heat sink. The cold pole is configured to absorb heat from the 3DIC. The heat sink is configured to dissipate the heat absorbed by the cold pole and is coupled to the cold pole via an N-type semiconductor element and via a P-type semiconductor element. A temperature sensing element includes a plurality of thermal monitoring elements disposed at a second plurality of locations relative to the 3DIC for measuring temperatures at the second plurality of locations. The measured temperatures control the plurality of cooling modules.

In some embodiments, thermoelectric apparatus and various applications of thermoelectric apparatus are described herein. In some embodiments, a thermoelectric apparatus described herein comprises at least one p-type layer coupled to at least one n-type layer to provide a pn junction, and an insulating layer at least partially disposed between the p-type layer and the n-type layer, the p-type layer comprising a plurality of carbon nanoparticles and the n-type layer comprising a plurality of n-doped carbon nanoparticles.

A semiconductor crystal substrate includes a crystal substrate that is formed of a material including GaSb or InAs, a first buffer layer that is formed on the crystal substrate and formed of a material including GaSb, the first buffer layer having n-type conductivity, and a second buffer layer that is formed on the first buffer layer and formed of a material including GaSb, the second buffer layer having p-type conductivity.

A thermoelectric sintered body according to an embodiment comprises thermoelectric powder, the thermoelectric powder, arranged in a horizontal direction, comprising: a plurality of first powders in the shape of plate-type flakes; and a plurality of second powders in a shape different from that of the first powders, wherein the second powders comprise 5 volume % or less of the total thermoelectric powder.

The present disclosure is directed to nanocomposites comprising a co-sintered composition of a MXene crystal form composition and an inorganic oxide, or oxide-type ceramic and methods of making and using the same.

A thermoelectric composition is provided that includes a nanocomposite comprising a copper selenide (Cu.sub.2Se) matrix having a plurality of nanoinclusions comprising copper metal selenide (CuMSe.sub.2) distributed therein. M may be selected from the group consisting of: indium (In), aluminum (Al), gallium (Ga), antimony (Sb), bismuth (Bi), and combinations thereof. The thermoelectric composition has an average figure of merit (ZT) of greater than or equal to about 1.5 at a temperature of less than or equal to about 850K (about 577° C.). Methods of making such a thermoelectric nanocomposite material by a sequential solid-state transformation of a CuSe.sub.2 precursor are also provided.

Composite materials with thermoelectric properties and devices made from such materials are described. The thermoelectric composite material may comprise a metal oxide material and graphene or modified graphene. It has been found that the addition of graphene or modified graphene to thermoelectric metal oxide materials increases ZT. It has further been found that the ZT of the metal oxide becomes effective over a broader temperature range and at lower temperatures.

This invention relates to a thermoelectric material constituted of nanostructures and a thermoelectric element and an optical sensor including the same, as well as to a method for manufacturing a thermoelectric material constituted of nanostructures. An object of the present disclosure is to achieve better thermoelectric characteristics of the thermoelectric material containing nanoparticles. The thermoelectric material includes a first material having a band gap and a second material different from the first material. The thermoelectric material contains a plurality of nanoparticles distributed in a base material which is a mixture of the first material and the second material. A composition of the second material in the thermoelectric material is not lower than 0.01 atomic % and not higher than 2.0 atomic % of the thermoelectric material.

Discussed herein are systems and methods for fabrication of MgSnGe-based thermoelectric materials for applications from room temperature and near room temperature to high temperature applications. The TE materials may be fabricated by hand or ball milling a powder to a predetermined particle size and hot-pressing the milled powder to form a thermoelectric component with desired properties including a figure of merit (ZT) over a temperature range. The TE materials fabricated may be disposed in thermoelectric devices for varying applications.