An electronic device includes a substrate, an electronic component disposed over the substrate and an electrical testing component disposed over the substrate. The electronic component includes a bottom plate over the substrate, and a top plate over the bottom plate. The electrical testing component includes a first anti-fuse structure and a second anti-fuse structure, wherein the first anti-fuse structure and the second anti-fuse structure are electrically connected to the bottom plate.

A vehicle having a diagnostic system for a fuse is provided. The vehicle has first and second voltage sensors, a current sensor, and a microcontroller. The first and second voltage sensors generate first and second signals, respectively, indicating first and second voltage levels, respectively, at first and second ends, respectively, of the fuse. The current sensor generates a third signal indicating a current level flowing through the fuse. The microcontroller determines first and second voltage values based on the first and second signals, respectively, a current value based on the third signal, and a first resistance value utilizing the first and second voltage values and the current value. The microcontroller generates a diagnostic signal indicating degraded operation of the fuse if the first resistance value is greater than an end-of-life resistance value.

The present invention relates to fuse diagnosis device and method using voltage distribution, and more particularly, to fuse diagnosis device and method using voltage distribution which connect a resistor unit and a diagnostic resistor to one side of the fuse so as to be connected with the battery in parallel and calculate voltage of a battery applied to the diagnostic resistor by using the voltage distribution to diagnose a state of the fuse, in order to diagnose the states of one or more fuses connected in parallel.

A semiconductor wafer includes a semiconductor substrate having a plurality of die areas separated from one another by dicing areas. Each die area includes one or more metal layers above the semiconductor substrate and a plurality of fuse structures formed in at least one of the one or more metal layers. Each fuse structure includes a fuse area between first and second fuse heads. Each die area also includes a first pair of contacts connected to different areas of the first fuse head of at least some of the fuse structures. The wafer can be singulated along the dicing areas into individual dies. A corresponding method of fuse verification is also provided.

Systems and methods for detecting thermal-mechanical strain fatigue in an electrical fuse include a controller configured to monitor at least one fuse fatigue parameter over a period of time while the fuse is connected to an energized electrical power system, and based on the monitored at least one fuse fatigue parameter, the controller is further configured to determine at least one of a consumed service life of the fuse element or a service life remaining of the fuse element.

A retention member monitoring system for a slat-flap control lever assembly including a control lever movable over a range of discrete angular positions. Also included is a retention member engageable with the control lever to retain the control lever in each of the discrete angular positions. Further included is at least one electric device in communication with the retention member to determine the structural integrity of the retention member.

A back end of the line (BEOL) fuse structure having a stack of vias. The stacking of vias leads to high aspect ratios making liner and seed coverage inside the vias poorer. The weakness of the liner and seed layers leads to a higher probability of electromigration (EM) failure. The fuse structure addresses failures due to poor liner and seed coverage. Design features permit determining where failures occur, determining the extent of the damaged region after fuse programming and preventing further propagation of the damaged dielectric region.

System and methods for estimating a state if a fuse are presented. In some embodiments, the disclosed systems and methods may be utilized in connection with estimating a state of a fuse associated with a manual service disconnect associated with an energy storage system included in a vehicle. Consistent with embodiments disclosed herein, a current event counting-based method utilizing one or more weighted time data buckets associated with various current levels may be used in connection with estimating MSD fuse life. In some embodiments, a MSD fuse end-of-service life signal may be triggered when a total time associated in the weighted time data buckets exceed a threshold value.

Electrical current sensing and monitoring methods include connecting sensing a voltage across a conductor having a non-linear resistance such as a fuse element. The current flowing in the conductor is calculated based on at least a first detected state of the sensed voltage and a thermal equilibrium characterization of the conductor.

Systems and methods for detecting thermal-mechanical strain fatigue in an electrical fuse include a controller configured to monitor at least one fuse fatigue parameter over a period of time while the fuse is connected to an energized electrical power system, and based on the monitored at least one fuse fatigue parameter, the controller is further configured to determine at least one of a consumed service life of the fuse element or a service life remaining of the fuse element.