H01L51/40

OLED display and OLED display device with plurality of light-absorbing bodies in planarization layer

An organic light emitting diode (OLED) display panel and an OLED display device include a substrate, a thin film transistor array function layer disposed on the substrate; a planarization layer disposed on the thin film transistor array function layer; an anode electrode disposed on the planarization layer; and a pixel definition layer disposed on the anode electrode. The planarization layer and/or the pixel definition layer include a plurality of light-absorbing bodies used for absorbing incident light emitted from outside the OLED display panel. The light-absorbing bodies are doped in the planarization layer and/or the pixel definition layer.

Display device having a plurality of thin-film transistors with different semiconductors
11056509 · 2021-07-06 · ·

A display device includes a substrate; a buffer layer disposed on the substrate; a first thin-film transistor comprising a first active layer made of a low-temperature poly-silicon (LTPS), a first gate electrode overlapping with the first active layer with the first gate insulating layer and the second gate insulating layer therebetween, and a first source electrode and a first drain electrode electrically connected to the first active layer; and a second thin-film transistor comprising a second active layer made of an oxide semiconductor, a second gate electrode overlapping with the second active layer with the second gate insulating layer therebetween, and a second source electrode and a second drain electrode electrically connected to the second active layer. The first gate electrode of the first thin-film transistor and the second gate electrode of the second thin-film transistor may be disposed on the second gate insulating layer.

OLED package substrate having a conductor attached to electrode on an array substrate
10903444 · 2021-01-26 · ·

Embodiments of the present disclosure provide an OLED package substrate, a manufacturing method thereof, and an OLED display panel. The OLED package substrate comprises a display area and a non-display area, the display area comprising a pixel definition area. The OLED package substrate comprises a base substrate, and a conductor on the base substrate and within the pixel definition area. The conductor is configured to be in contact with a cathode or an anode at a surface of an array substrate for assembly with the OLED package substrate.

Display panel with a separation pillar having slanting side surfaces disposed on a pixel definition layer
10903303 · 2021-01-26 ·

The present disclosure relates to a display panel, a display screen, and a terminal device. The display panel includes a substrate, a first pixel electrode overlaying the substrate, a pixel definition layer overlaying a side of the first pixel electrode away from the substrate and including a plurality of pixel openings to expose a surface of the first pixel electrode, and a first type of separation pillar disposed on the pixel definition layer. A width of the first type of separation pillar changes continuously or intermittently in an extending direction thereof. The extending direction of the first type of separation pillar is parallel to the substrate. The width is a dimension of a projection of the first type of separation pillar on the substrate in a direction perpendicular to the extending direction of the first type of separation pillar.

Display panel having filler layer and heat dissipation layer and packaging method thereof, and display apparatus

A display panel. The display panel may include a substrate having a display region and a non-display region; a cover plate; a sealant between the substrate and the cover plate; and a filler layer covered by the sealant to cause the sealant to have tight contact with the substrate and with the cover plate. The sealant may be in the non-display region for bonding the substrate and the cover plate.

Organic electroluminescent element having a charge generating layer between adjacent light emitting layers
10879496 · 2020-12-29 · ·

This organic EL element comprises a first light emitting unit that contains a red phosphorescent light emitting layer and a green phosphorescent light emitting layer, a second light emitting unit that contains a blue fluorescent light emitting layer, and a third light emitting unit that contains a blue fluorescent light emitting layer; and this organic EL element has a structure in which a positive electrode, the third light emitting unit, a second charge generating layer, the second light emitting unit, a first charge generating layer, the first light emitting unit and a negative electrode are sequentially laminated in this order. The white light obtained through light emission of the first, second and third light emitting units has one peak wavelength within the red wavelength range, one peak wavelength within the green wavelength range, and one or two peak wavelengths within the blue wavelength range.

Vapor deposition mask, vapor deposition method, and production method for organic EL display device

Provided is a vapor deposition mask that suppresses heat conduction at a frame thereof, that achieves weight reduction, and that can tolerate high stress at a portion of the frame to which particularly high stress is applied. The present invention has: a mask main body (10) at which an opening pattern is formed; and a frame (15) to which at least a portion of a peripheral edge part of the mask main body is joined. At least a portion of the frame is formed as a rod-like lateral frame (15b) that is formed by laminating, via connection surface plates (153), unit structures (155) for a sandwich structure in which a surface plate (152) is stuck to a surface that faces at least portions of core parts (151) that contain vacant space.

Method for fabricating organic light emitting diode display

A method for fabricating an organic light emitting diode (OLED) display is provided. The fabricating method includes: forming a switch array layer on a base substrate; forming an organic light emitting display layer on the switch array layer; forming a thin film package layer on the organic light emitting display layer; and forming a superhydrophobic thin film on the thin film package layer using plasma chemical vapor deposition. The superhydrophobic thin film has a thickness smaller than a predetermined thickness.

Display panel with a fluorescent probe layer between a first electrode layer and light emitting layer

The present disclosure provides a display panel and a method for manufacturing the same, a detection method and a display device, and relates to the field of display technology. The display panel includes one or more detection units located on a substrate, wherein at least one of the one or more detection units comprises: a first electrode layer and a second electrode layer opposite to the first electrode layer; a light emitting layer located between the first electrode layer and the second electrode layer; and a fluorescent probe layer located between the first electrode layer and the light emitting layer.

Multilayer thin film encapsulation structure for an organic electroluminescent device

An organic electroluminescent device includes a substrate, driving circuit layer, inorganic protective layer, organic flattening layer, organic electroluminescent element layer, and TFE structure. The TFE structure includes a first inorganic barrier layer, organic barrier layer, and second inorganic barrier layer. The organic flattening layer is formed in a region where the inorganic protective layer is formed, organic electroluminescent elements are located in a region where the organic flattening layer is formed, and an outer perimeter of the TFE structure crosses lead wires and is present between an outer perimeter of the organic flattening layer and an outer perimeter of the inorganic protective layer. In a region where the inorganic protective layer and the first inorganic barrier layer are in direct contact with each other on the lead wires, a tapering angle of a side surface of a cross-section of the first inorganic barrier layer is smaller than 90 degrees.