The invention provides poiyfunctionai bio-based methacrylate oligomers, which are synthesized via the ring-opening reaction between at least one ethyienicaliy unsaturated acid selected from methacrylic acid, acrylic acid, and crotonic acid, and a poiyfunctionai bio-based epoxy resin, such as epoxidized sucrose soyate. The extent of reaction may be varied to generate a family of methacrylate oligomers with differing degrees of methacryiation. These methacrylate oligomers can optionally be mixed with a reactive diluent, such as styrene, and cured using, for example, a thermally-activated free radical initiator to form a thermoset polymer with high modulus. The thermosets can be used to form composites, adhesives, coatings, and dental restorative materials. Methods of making the methacrylate oligomers are disclosed as are coating compositions and coated objects, such as dental restorative materials, using the methacrylate oligomers.

[Problem] To provide an epoxy (meth)acrylate compound that serves as a material for a protective film that is unlikely to cause migration to an electrically conductive pattern, and a curable composition containing the epoxy (meth)acrylate compound. [Solution] Provided is an epoxy (meth)acrylate compound which is characterized by being represented by general formula (1) and in which the content of halogen atoms, which are impurities, is 100 ppm by mass or less. In addition, provided is a curable composition for forming a protective film for an electrically conductive pattern, the curable composition being obtained by mixing this epoxy (meth)acrylate compound with a photopolymerization initiator and at least one type of monomer or oligomer that contains a (meth)acryloyl group.

##STR00001##

(At least one of R.sup.1 to R.sup.5 has a structure represented by formula (2), and the remainder of R.sup.1 to R.sup.5 are each independently selected from the group consisting of hydrogen atoms and alkyl groups and alkoxy groups having 1-6 carbon atoms. R.sup.6 denotes a hydrogen atom or a methyl group.)

##STR00002## (* denotes the bonding position to a carbon atom that constitutes the benzene ring to which R.sup.1 to R.sup.5 are bonded in formula (1), and R.sup.7 denotes a hydrogen atom or a methyl group.)

The present invention relates to waterborne curing compositions for electrodeposition and radiation curing and processes to obtain such compositions. The compositions are characterized in that an ethylenically unsaturated compound (b), is dispersed in an aqueous solution by an at least partially neutralized (meth)acrylic modified amine epoxy adduct. The compositions of the invention are particularly suitable for coating metallic materials and temperature sensitive materials such as electrically conductive plastic materials.

A vinyl ester resin composition comprising a reaction product of: (a) a polyepoxide resin; (b) an unsaturated carboxylic acid; and (c) a reactive carboxyl group terminated amphiphilic block copolymer, a reactive epoxy group terminated amphiphilic block copolymer, or a mixture thereof; and a cured thermoset composite product produced from the above vinyl ester resin composition.

The thermosetting resin composition according to an embodiment of the present invention contains a component (A) which is a novolac vinyl ester resin having a hydroxyl group and an ethylenically unsaturated group in the molecule, a component (B) which is an ethylenically unsaturated monomer, and a component (D) which is a polyisocyanate compound, wherein the component (A) has a hydroxyl value of 30-150 mgKOH/g, and the mole number of the hydroxyl group with respect to the mole number of the ethylenically unsaturated group per gram of the component (A) ((the amount of the hydroxyl group [mol/g])/(the amount of the ethylenically unsaturated group [mol/g])) is 0.1-0.8.

There is provided herein a composition comprising (a) a mercapto-functional silicon compound having the general Formula (I):

##STR00001##

and a reactive resin containing at least one epoxy and/or (meth)acrylate group. There is also provided a silylated resin resulting from the reaction product of mercapto-functional silicon compound (a) and reactive resin contain at least one epoxy and/or (meth)acrylate groups.

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including a liquid epoxy resin component including a liquid epoxy resin and an acrylate monomer, a curing agent component including a compound having an imidazole group and, optionally, a co-curing agent for the compound having an imidazole group comprising a phenolic monomer compound, a branched chain carboxylic acid, and combinations thereof, and a non-aromatic polyol compound. The composition may be used to form composites, such as used in commercial wind turbine blade manufacturing.

A thermosetting resin composition, a thermosetting resin composition for protective films, a thermosetting resin composition for planarizing films, and a method for producing a cured film, a protective film, or a planarizing film by using the resin composition. A thermosetting resin composition has a polymer having a structural unit of Formula (1) below, a curing agent in an amount of 0% by mass to 30% by mass with respect to the polymer, and a solvent. When the thermosetting resin composition includes the curing agent, the curing agent is at least one compound selected from polyfunctional (meth)acrylate compounds and polyfunctional blocked isocyanate compounds:

##STR00001##

(wherein A.sup.1 is a C.sub.2 or C.sub.3 alkenyl group or alkynyl group, and A.sup.2 is a C.sub.2 alkenylene group or alkynylene group).

A transfer film includes a template layer having a first major surface and an opposing second major surface. The second major surface includes a structured non-planar release surface. A backfill layer is disposed upon and conforms to the non-planar structured surface. The backfill layer includes a first cross-linked polymer and a plurality of multifunctional monomers, which cure via different and independent curing mechanisms.

A sealant composition particularly suitable for a plastic substrate is disclosed. The sealant composition contains: a partially (meth)acrylated epoxy resin, a hydrophobic oligomer having a flexible hydrophobic backbone moiety and at least one functional group co-curable with the partially (meth)acrylated epoxy resin, and a latent epoxy-curing agent.