Bending mode transducers are provided including a substrate made of a high density material, the substrate having a first surface and a second surface, opposite the first surface. A piezoelectric layer is provided on the first surface of the substrate and at least one patterned electrode is provided on the piezoelectric layer. A mounting block is on the at least one patterned electrode at least one electrical contact point is provided on the first surface of the substrate remote from the at least one patterned electrode. Related devices and methods are also provided.

A manufacturing process for ultrasonic atomization piece relates to the atomization piece technical field and includes: S1. cutting a press-thermosetting conductive adhesive film into a shape matched with a piezoelectric ceramic sheet; S2. placing the press-thermosetting conductive adhesive film on a composite plate, wherein the composite plate includes a substrate and a conductive layer, the press-thermosetting conductive adhesive film is placed on the conductive layer, and the substrate is a polymer film; S3. placing the piezoelectric ceramic sheet on the press-thermosetting conductive adhesive film; S4. pressing the piezoelectric ceramic sheet and the composite plate in S3 together by a press machine. The press-thermosetting conductive adhesive film for connecting the piezoelectric ceramic sheet and the composite plate can be cured in a short time under high pressure and heating and has excellent adhesion, which is a thin film material with excellent plasticity and can be easily cut into various shapes.

A piezoelectric device has a good piezoelectric characteristic, while suppressing a leakage current between electrodes. The piezoelectric device has a first substrate, a first conductive film provided on the first substrate, a piezoelectric layer formed of an inorganic material and provided on the first conductive film, an adhesive layer provided on the piezoelectric layer, and a second conductive film provided on the adhesive layer.

A method of manufacturing a substrate for an acoustic wave device includes: a substrate joining step of joining a piezoelectric material layer to a surface on one side of a support substrate; a grinding step of grinding the piezoelectric material layer; a removal amount map forming step of measuring in-plane thickness of the piezoelectric material layer by an optical thickness meter, and calculating a removal amount for the piezoelectric material layer for adjusting thickness variability of the piezoelectric material layer to or below a threshold on the basis of each coordinate in the plane, to form a removal amount map; a laser processing step of applying a pulsed laser beam of such a wavelength as to be absorbed in the piezoelectric material layer, to selectively remove the piezoelectric material layer, based on the removal amount map; and a polishing step of polishing the surface of the piezoelectric material layer.

A method for manufacturing a hybrid structure comprising an effective layer of piezoelectric material having an effective thickness and disposed on a supporting substrate having a substrate thickness and a thermal expansion coefficient lower than that of the effective layer includes: a) a step of providing a bonded structure comprising a piezoelectric material donor substrate and the supporting substrate, b) a first step of thinning the donor substrate to form a thinned layer having an intermediate thickness and disposed on the supporting substrate, the assembly forming a thinned structure; c) a step of heat treating the thinned structure at an annealing temperature; and d) a second step, after step c), of thinning the thinned layer to form the effective layer. The method also comprises, prior to step b), a step a′) of determining a range of intermediate thicknesses that prevent the thinned structure from being damaged during step c).

A method for manufacturing a film on a support having a non-flat surface comprises: providing a donor substrate having a non-flat surface, forming an embrittlement zone in the donor substrate so as to delimit the film to be transferred, forming the support by deposition on the non-flat surface of the film to be transferred, and detaching the donor substrate along the embrittlement zone so as to transfer the film onto the support.

A method for fabricating an array of front ends for an array of packaged electronic components that each comprise: an electrical element packaged within a package comprising a front part of a package comprising an inner section with a cavity therein opposite the resonator defined by the raised frame and an outer section sealing said cavity; and a back part of the package comprising a back cavity in an inner back section, and an outer back section sealing the cavity, said back package further comprising a first and a second via through the back end around said at least one back cavity for coupling to front and back electrodes of the electronic component; the vias terminating in external contact pads that are coupleable in a ‘flip chip’ configuration to a circuit board; the method comprising the stages of: i. Obtaining a carrier substrate having an active membrane layer attached thereto by its rear surface, with a front electrode on the front surface of the active membrane layer; ii. Obtaining an inner front end section; iii. Attaching the inner front end section to the exposed front surface of the front electrode; iv. Detaching the carrier substrate from the rear surface of the active membrane layer; v. Optionally thinning the inner front section; vi. Processing the rear surface by removing material to create an array of at least one island of active membrane on at least one island of front electrode; vii. Creating an array of at least one front cavity by selectively removing at least outer layer of the inner front end section, such that there is one cavity opposite each island of membrane on the front side of the front electrode on the opposite side to the island of active membrane; viii. Applying an outer front end section to the inner front end section and bonding the outer front end section to an outer surface of the inner front end section such that the outer front end section spans across and seals the at least one cavity of the array of front cavities.

An adhesive reactive to ultraviolet rays is applied to an actuator mounting portion of a suspension. An electrical conducting material is applied to a conductor and the like of the actuator mounting portion. When the adhesive is irradiated with ultraviolet rays, the viscosity of the adhesive is increased. A piezoelectric element is placed on the adhesive the viscosity of which is increased. Thereafter, the adhesive and the electrical conducting material are heated, whereby the adhesive and the electrical conducting material are cured.

A method of manufacturing a disk drive suspension includes applying an adhesive to an actuator mounting portion, increasing viscosity of the adhesive by emitting light to the adhesive applied to the actuator mounting portion, arranging the piezoelectric element on the adhesive having the increased viscosity, detecting a height of the piezoelectric element arranged on the actuator mounting portion, and correcting an irradiation condition of the light in accordance with the detected height of the piezoelectric element.

An acoustic wave device includes: a mounting substrate; a first wiring layer located on an upper surface of the mounting substrate, the first wiring layer including a first bond region and a first connection region connecting with the first bond region and having a thickness substantially equal to a thickness of the first bond region; an element substrate mounted on the mounting substrate; an acoustic wave element located on a lower surface of the element substrate; and a second wiring layer located on the lower surface of the element substrate, the second wiring layer including a second bond region and a second connection region, the second bond region directly bonding with the first bond region of the first wiring layer, the second connection region connecting the acoustic wave element with the second bond region and having a thickness substantially equal to a thickness of the second bond region.