A method of manufacturing a dielectric device includes epitaxially growing a metal film on a substrate, forming a dielectric film on the metal film such that the dielectric film has a preferentially oriented structure, forming a first electrode film having a non-oriented or amorphous structure on the dielectric film, removing the substrate and the metal film from the dielectric film or removing the substrate from the metal film, and forming a second electrode film having a non-oriented or amorphous structure on the dielectric film or the metal film.

An MEMS piezoelectric transducer and a method for manufacturing the same are provided. The first substrate includes a first base, at least one conductive layer, a signal processing circuit and/or a driving circuit arranged on a side of the first base, where the signal processing circuit and/or the driving circuit is electrically connected to the at least one conductive layer. The second substrate includes a second base, a first electrode arranged on a side of the second base, and a piezoelectric layer arranged on the first electrode. A side of the first substrate where the at least one conductive layer is arranged is attached and fixed to a side of the second substrate where the first electrode and the piezoelectric layer are arranged. The first electrode and the at least one conductive layer are electrically connected through a conductive through via.

Systems and methods for operating a communication device. The methods comprise: immersing an antenna in an electric field of an incident radio wave; producing a net change in electrical charge on a surface of an electrodeformative element that acoustically vibrates when the antenna is immersed in the electric field of the incident radio wave; harvesting the electrical charge produced on the surface of the electrodeformative element to provide an antenna receive function; and providing the harvested electrical charge from the antenna to a receiver circuit of the communication device.

The disclosure provides an array substrate and a method of manufacturing the same, a display device and a method of detecting a touch position. In the array substrate, the plurality of X and Y sensing lines are respectively parallel to gate data lines, and a sensing thin film transistor is provided at a crossing position where the X and Y sensing lines cross. A control terminal and an output terminal of the sensing thin film transistor are coupled to the X and Y sensing lines, respectively. A piezoelectric material layer is formed between the control terminal and an input terminal of the sensing thin film transistor such that, when being pressed, the piezoelectric material layer generates deformation such that a sensing voltage is generated at the input terminal of the sensing thin film transistor with relative to the control terminal of the sensing thin film transistor.

Systems and techniques are provided for piezoelectric transducer array fabrication. A sheet of piezoelectric material may be diced into pieces of piezoelectric material. A sheet of elastic layer material may be spin coated with adhesive. The pieces of piezoelectric material may be placed onto the sheet of elastic layer material. Pressure may be applied to the pieces of piezoelectric material and the sheet of elastic layer material. The adhesive may be cured. Transduction elements may be cut from the pieces of piezoelectric material and the sheet of elastic layer material. Electronics may be mounted on a PCB mounting board. Adhesive may be applied onto the PCB mounting board. The transduction elements may be mounted on the PCB mounting board. A spacer may be mounted on the PCB mounting board. Adhesive may be applied onto the spacer and the transduction elements. Diaphragms may be mounted on the spacer.

A device that includes a substrate; a die couple to the substrate, a frame located between the die and the substrate, wherein the frame is further located along a periphery of the die; a solder interconnect coupled to the frame and the substrate; and a sealed cavity located between the die and the substrate, wherein a wall of the sealed cavity is formed by the solder interconnect and the frame. The frame may be configured to be coupled to ground.

A mounting structure includes a first substrate which has a first surface on which a functional element is provided, a second substrate that has a second surface facing the first surface, a wiring portion that is provided at a position which is different from a position of the functional element on the first surface, has a third surface facing the second surface, and is electrically connected to the functional element, and a conduction portion that is provided on the second surface, protrudes toward the first surface, and is connected to the third surface so as to be electrically connected to the functional element, in which an area of the third surface is larger than an area of a first end section of the wiring portion on the first substrate side in a plan view which is viewed from a thickness direction of the first substrate and the second substrate.

A method of manufacturing ultrasonic transducer devices, comprising fabricating an ultrasonic transducer panel; and dividing the ultrasonic transducer panel into ultrasonic transducer devices. Fabricating the ultrasonic transducer panel includes: providing a first carrier; arranging a plurality of piezoelectric elements spaced apart on the first carrier; applying a dielectric material on the plurality of piezoelectric elements to embed each piezoelectric element in the plurality of piezoelectric elements in the dielectric material, thereby forming a piezoelectric element device layer on the first carrier; thinning the piezoelectric element device layer, resulting in an exposed first side of each piezoelectric element in the plurality of piezoelectric elements; forming a first electrode layer on the piezoelectric element device layer, the first electrode layer including a first transducer electrode on the exposed first side of each piezoelectric element in the piezoelectric element device layer; and separating the piezoelectric element device layer from the first carrier.

A microelectro-mechanical system (MEMS) device includes a support structure formed of printed circuit board (PCB) materials; and a piezoelectric transducer formed at the support structure. Further, a MEMS assembly is described which shows such a MEMS device mounted at a component carrier. Furthermore, a method for manufacturing such a MEMS device is described.

Appliances, methods, and systems (e.g., utilities) for use in analyzing received pressure waves to obtain and deduce various types of meaningful information therefrom (e.g., testing operation of an acoustic device that generates beams of acoustic energy). A pressure sensor in the disclosed system makes use of a piezoelectric layer or film (e.g., polyvinylidene fluoride (PVDF)) that has been substantially uniformly poled prior to interconnection with electrodes that are configured to send electrical signals to a controller or the like for generation of a dynamic, image (e.g., 2D) representing the received pressure waves. Among other advantages, the disclosed system leverages excellent economy of scale, can be configured in different arrangements with reduced cost, and limits the need for adapters or reverse engineering (e.g., as it can operate independently of the design of a probe or system under test.