A module structure comprises a patterned substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post. The component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.

The subject disclosure relates to techniques for providing semiconductor chip security using piezoelectricity. According to an embodiment, an apparatus is provided that comprises an integrated circuit chip comprising a pass transistor that electrically connects two or more electrical components of the integrated circuit chip. The apparatus further comprises a piezoelectric element electrically connected to a gate electrode of the pass transistor; and a packaging component that is physically connected to the piezoelectric element and applies a mechanical force to the piezoelectric element, wherein the piezoelectric element generates and provides a voltage to the gate electrode as a result of the mechanical force, thereby causing the pass transistor to be in an on-state. In one implementation, the two or more electrical components comprise a circuit and a power source. In another implementation, the two or more electrical components comprise two circuits.

Appliances, methods, and systems (e.g., utilities) for use in analyzing received pressure waves to obtain and deduce various types of meaningful information therefrom (e.g., testing operation of an acoustic device that generates beams of acoustic energy). A pressure sensor in the disclosed system makes use of a piezoelectric layer or film (e.g., polyvinylidene fluoride (PVDF)) that has been substantially uniformly poled prior to interconnection with electrodes that are configured to send electrical signals to a controller or the like for generation of a dynamic, image (e.g., 2D) representing the received pressure waves. Among other advantages, the disclosed system leverages excellent economy of scale, can be configured in different arrangements with reduced cost, and limits the need for adapters or reverse engineering (e.g., as it can operate independently of the design of a probe or system under test.

A method for manufacturing a vibration actuator includes forming an elastic body integrally with a projection protruding from a surface of the elastic body, by press working. Forming the elastic body includes forming a bonding portion surrounding the projection, forming a contact portion at a top portion of the projection, forming a spring portion between the contact portion and the bonding portion, and forming a standing portion having a hollow structure, between the spring portion and the contact portion, so that the standing portion has a ring shape in a cross-sectional view in a direction parallel to the surface of the elastic member and that a space surrounded by the contact portion, the spring portion, and the standing portion. The spring portion is formed by press working, and the bonding portion is formed by press working.

In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

An ultrasonic sensor pixel includes a substrate, a piezoelectric micromechanical ultrasonic transducer (PMUT) and a sensor pixel circuit. The PMUT includes a piezoelectric layer stack including a piezoelectric layer disposed over a cavity, the cavity being disposed between the piezoelectric layer stack and the substrate, a reference electrode disposed between the piezoelectric layer and the cavity, and one or both of a receive electrode and a transmit electrode disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The sensor pixel circuit is electrically coupled with one or more of the reference electrode, the receive electrode and the transmit electrode and the PMUT and the sensor pixel circuit are integrated with the sensor pixel circuit on the substrate.

The present disclosure discloses a piezoelectric sensor and a method for manufacturing the same to realize omni-directional pressure sensing. The piezoelectric sensor according to the present disclosure comprises a first electrode layer, a second electrode layer and a piezoelectric thin film layer between the first electrode layer and the second electrode layer, the piezoelectric sensor further comprising: a first functional module and a second functional module, both of which are connected to the second electrode layer, wherein the first functional module is configured to sense a pressure applied to the piezoelectric sensor in a first direction, and the second functional module is configured to sense a pressure applied to the piezoelectric sensor in a second direction, the first direction and the second direction are perpendicular to each other.

The subject disclosure relates to techniques for providing semiconductor chip security using piezoelectricity. According to an embodiment, an apparatus is provided that comprises an integrated circuit chip comprising a pass transistor that electrically connects two or more electrical components of the integrated circuit chip. The apparatus further comprises a piezoelectric element electrically connected to a gate electrode of the pass transistor; and a packaging component that is physically connected to the piezoelectric element and applies a mechanical force to the piezoelectric element, wherein the piezoelectric element generates and provides a voltage to the gate electrode as a result of the mechanical force, thereby causing the pass transistor to be in an on-state. In one implementation, the two or more electrical components comprise a circuit and a power source. In another implementation, the two or more electrical components comprise two circuits.

A crystal oscillator (101) includes: a piezoelectric resonator plate (2) on which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) covering the first excitation electrode of the piezoelectric resonator plate (2); a second sealing member (4) covering the second excitation electrode of the piezoelectric resonator plate (2); and an internal space (13) formed by bonding the first sealing member (3) to the piezoelectric resonator plate (2) and by bonding the second sealing member (4) to the piezoelectric resonator plate (2), so as to hermetically seal a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate (2). An electrode pattern (371) including a mounting pad for wire bonding is formed on an outer surface (first main surface (311)) of the first sealing member (3).

Within a housing portion in which a recessed portion is formed, a circuit board is arranged on the bottom surface of the recessed portion, through a first connecting member. An acceleration sensor is stacked on the circuit board, through a second connecting member. Hence, sections that function as three or more springs, i.e., an anti-vibration portion, the first connecting member, and the second connecting member, are situated between an angular velocity sensor and the acceleration sensor. For this reason, transmission of vibration of the vibrating element in the angular velocity sensor to the acceleration sensor can be restricted, and reduction in the detection accuracy of the acceleration sensor can be restricted.