A method is provided for making electrical contact with an electronic component in the form of a stack formed from a plurality of material layers, which react upon application of an electric field, and a plurality of electrode layers, wherein each material layer is arranged between two of the electrode layers. An insulation structure is generated on at least one stack circumferential region of the stack, which exposes each second electrode layer of the at least one stack circumferential region for electrical contact to be made. Also, a contact-making structure is applied to the at least one stack circumferential region which is provided with the insulation structure. Before the step of generating the contact-making structure, the material layers are partially removed by a material-removing method such that the electrode layers are exposed close to the surface.

A method for manufacturing a liquid ejecting head including a laminate formed of a flow path substrate having a flow path communicating with nozzle openings that eject a liquid, a first electrode, a piezoelectric layer, and a second electrode, the method including stacking the first electrode, the piezoelectric material, the second electrode, and a reinforcing member on top of one another to form a laminate; heating the laminate to form a piezoelectric layer made of the piezoelectric material; bonding the laminate to the flow path substrate on a first electrode side; and removing the reinforcing member.

A method of bonding an electrode of a piezoelectric ultrasonic transducer to an electrically conductive layer of a support substrate, in order to support the piezoelectric ultrasonic transducer and establish an electrical connection between the electrode and the electrically conductive layer. The method includes: roughening the surface of one or both of the electrode and the electrically conductive layer; applying an adhesive to one or both of the electrode and the electrically conductive layer; assembling the electrode and the electrically conductive layer; and curing the adhesive. An assembly, an ultrasonic flow meter, and surface mount technology assembly is also disclosed.