Provided are a photosensitive resin composition which is excellent in a moisture and heat resistance and provides a cured product thereof with a high elastic modulus at high temperature and which is excellent as well in a hollow structure holding property and a photosensitive film prepared by using the same, a forming method for a rib pattern, a hollow structure and a forming method for the same and an electronic component. In an electronic component having a hollow structure, a photosensitive resin composition is used as a rib material or a cover material for forming the hollow structure described above, and it is characterized by using a photosensitive resin composition containing (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerization initiator and a photosensitive film obtained from the above photosensitive resin composition. Used as the component (A) are acrylate compounds or methacrylate compounds, to be specific, an acrylate compound or a methacrylate compound having an amide group and an acrylate compound or a methacrylate compound containing a urethane bond.

The present disclosure provides a contact lens package containing a contact lens in a compressed state. In one exemplary embodiment, the overall internal depth of the package is less than the natural sagittal depth of the contact lens. Different single-use contact lens package shapes and configurations may be used. In some embodiments, a spring disc is included in the packages to help present the contact lens to the user when the package is opened. The contact lens packages may be adhered or clipped to a card or other carrier sheet, and may be housed in a number of different secondary packages.