A dual-mode epidermal sensor/electrode that, when worn on a human chest, is capable of synchronously/continuously monitoring electrical activity and mechano-acoustic activity of a cardiovascular system. The dual-mode epidermal sensor/electrode consists of a pair of stretchable electrocardiogram (ECG) electrodes made out of filamentary serpentine gold nano-membranes and a stretchable seismocardiogram (SCG) sensor comprising a filamentary serpentine PVDF. The dual-mode epidermal sensor/electrode is light, thin, flexible, and requires no operational power. The sensor can be laminated conformably and unobtrusively on a human chest to provide high fidelity ECG measurements and SCG measurements, and an estimated beat-to-beat blood pressure (BP). The dual-mode epidermal sensor is fabricated using a cost-effective, cut-and-paste method of construction.

Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.

A radial type ultrasound transducer is arranged in an ultrasound endoscope including a bending portion on a distal end side of an insertion portion. The ultrasound transducer includes: a plurality of piezoelectric elements arranged at predetermined intervals in a circumferential manner and configured to transmit and receive ultrasound waves; a plurality of electrodes arranged in the respective piezoelectric elements; and a flexible printed circuit electrically connected to each of the electrodes. The flexible printed circuit includes a plurality of wires that extend such that at least parts of the wires cross a direction perpendicular to an arrangement direction of the piezoelectric elements, and the plurality of wires are electrically connected to the respective electrodes of the piezoelectric elements at positions where at least parts of the wires cross the direction perpendicular to the arrangement direction of the piezoelectric elements.

In certain aspects, a thin film surface acoustic wave (SAW) die comprises a high-resistivity substrate, a bonding layer on the high-resistivity substrate, and a thin film piezoelectric island on the bonding layer, where an edge of the thin film piezoelectric island is offset from an edge of the bonding layer.

An electronic device includes a first substrate and a second substrate. A side wall joins the first substrate to the second substrate. The side wall includes a first alloy layer of a first metal and a second metal bonded directly to an upper surface of the first substrate and a second alloy layer of the first metal and a third metal disposed on top of the first alloy layer and bonded directly to a lower surface of the second substrate, the second metal and the third metal being different from each other and from the first metal. An electronic circuit is disposed on the lower surface of the second substrate within a cavity defined by the lower surface of the first substrate, the upper surface of the second substrate, and the side wall.

Aspects of the embodiments are directed to systems and devices that include a piezo-electric element comprising a top-side electrode and a bottom-side electrode; a metal contact pad electrically connected to the bottom-side electrode; an electrode electrically connected to the top-side electrode; and an encasement encasing the piezo-electric element. The piezo-electric element can be prepared to include steps and metallization for use in one or more types of packaging.

Disclosed are an ultrasonic probe for obtaining an ultrasonic image and a manufacturing method thereof. The ultrasonic probe includes a transducer layer including a piezoelectric layer configured to generate ultrasonic waves and an acoustic layer disposed below the piezoelectric layer, and a matching layer disposed above the piezoelectric layer, wherein the transducer layer includes an active portion configured to transmit and receive ultrasonic waves, and a stepped portion extending outward from the active portion to prevent cutting damage of the active portion.

A fingerprint identification device includes a substrate, a piezoelectric layer, a conductive layer, and a planar layer. The piezoelectric layer is disposed on the substrate. The conductive layer is disposed on the piezoelectric layer, and the conductive layer has a rugged microstructure on an upper surface of the conductive layer. The planar layer is disposed on the conductive layer, and a bottom of the planar layer fills the rugged microstructure of the conductive layer.

Various methods and systems are provided for forming a flexible circuit. In one example, a method includes forming a flexible circuit comprising a plurality of contact pads arranged into a plurality of rows, each contact pad of a given row electrically coupled to one another via electrical traces and each contact pad including a via, electroplating the flexible circuit, including electroplating each via, with at least a first material, and upon confirming connectivity of each via, cutting at least some of the electrical traces at least partially.

An ultrasonic transducer includes a piezoelectric element that extends in a predetermined direction; a first electrode formed on a first surface of the piezoelectric element, in parallel with the direction, the first electrode including: a first portion for inputting an electrical signal to the piezoelectric element, and a first connection portion formed continuously with the first portion and intersecting the direction, wherein a first wiring is electrically connected to the first connection portion; and a second electrode disposed on a second surface, oppose to the first surface, of the piezoelectric element and spaced apart from the first electrode in the piezoelectric element, the second electrode including: a second portion for inputting an electric signal to the piezoelectric element, and a second connection portion formed continuously with the second portion, wherein a second wiring is electrically connected to the second connection portion and collectively arranged with the first wiring.