An LED lamp panel, which comprises a substrate that is provided with a circuit layer, and the circuit layer is provided with bonding pads for connecting with a plurality of LED chips; the circuit layer is provided with a first reflective layer, and the first reflective layer is provided with a plurality of window structures, which are disposed in an array, and at least one pair of bonding pads for connecting with the LED chips is distributed in each of the window structures; the LED lamp panel further comprises a second reflective layer filled between the first reflective layer and the LED chips, and the reflectivity of the second reflective layer is greater than that of the first reflective layer. The LED lamp panel provided by the present disclosure is beneficial for die bonding and has a high lighting effect, an improved process yield, and a low manufacturing cost.

A driving backplane includes a substrate, a plurality of pad groups, and a plurality of marks. The plurality of pad groups and the plurality of marks are located on a same side of the substrate, a pad group includes at least one pad, and orthogonal projections of the plurality of marks on the substrate and orthogonal projections of the plurality of pad groups on the substrate have no overlap. The pad group corresponds to at least one mark. An orthogonal projection of the at least one mark on the substrate is located on a circumference of an orthogonal projection of a corresponding area of the pad group on the substrate, is adjacent to an orthogonal projection of the pad group on the substrate, and has a first gap from the orthogonal projection of the pad group on the substrate.

A driving backplane includes a substrate, a plurality of pad groups, and a plurality of marks. The plurality of pad groups and the plurality of marks are located on a same side of the substrate, a pad group includes at least one pad, and orthogonal projections of the plurality of marks on the substrate and orthogonal projections of the plurality of pad groups on the substrate have no overlap. The pad group corresponds to at least one mark. An orthogonal projection of the at least one mark on the substrate is located on a circumference of an orthogonal projection of a corresponding area of the pad group on the substrate, is adjacent to an orthogonal projection of the pad group on the substrate, and has a first gap from the orthogonal projection of the pad group on the substrate.

Disclosed is a display device including a substrate as well as a plurality of pixels and at least one reflective element located over the substrate. Each of the plurality of pixels has a pixel circuit and a light-emitting element, and the light-emitting element has a pixel electrode electrically connected to the pixel circuit, a first stack structure over the pixel electrode, and a common electrode over the first stack structure. At least one reflective element has a lower electrode, a second stack structure over the lower electrode, and a reflective film overlapping the second stack structure. Each of the first stack structure and the second stack structure includes a plurality of inorganic semiconductor layers.

Disclosed is a display device including a substrate as well as a plurality of pixels and at least one reflective element located over the substrate. Each of the plurality of pixels has a pixel circuit and a light-emitting element, and the light-emitting element has a pixel electrode electrically connected to the pixel circuit, a first stack structure over the pixel electrode, and a common electrode over the first stack structure. At least one reflective element has a lower electrode, a second stack structure over the lower electrode, and a reflective film overlapping the second stack structure. Each of the first stack structure and the second stack structure includes a plurality of inorganic semiconductor layers.

Light sources including one or more light emitting diodes (LEDs) comprise a down converter material on the one or more LEDs; and a functional material that is laser-patterned on the down converter material. The functional material may be a distributed Bragg reflector (DBR). a dichroic filter (DCF), a ceramic material, or a powdered phosphor layer. The down converter material may comprise a polycrystalline ceramic plate of a phosphor material. A method of manufacturing a light source comprises: patterning a functional material of a light source comprising one or more light emitting diodes and a phosphor material.

Light sources including one or more light emitting diodes (LEDs) comprise a down converter material on the one or more LEDs; and a functional material that is laser-patterned on the down converter material. The functional material may be a distributed Bragg reflector (DBR). a dichroic filter (DCF), a ceramic material, or a powdered phosphor layer. The down converter material may comprise a polycrystalline ceramic plate of a phosphor material. A method of manufacturing a light source comprises: patterning a functional material of a light source comprising one or more light emitting diodes and a phosphor material.

The disclosure discloses a backlight module and a display device including the same. The backlight module includes a substrate, a light source assembly disposed on the substrate and including a plurality of light-emitting chips disposed at intervals, and a light guide plate disposed on the light source assembly. A surface of the light guide plate facing the substrate is provided with a plurality of grooves where one of the light-emitting chips is correspondingly disposed in one of the grooves, a bottom of each of the grooves is provided with a plurality of first concave parts disposed at intervals, and each of the first concave parts is defined with an arc surface recessed towards a direction away from the substrate.

The disclosure discloses a backlight module and a display device including the same. The backlight module includes a substrate, a light source assembly disposed on the substrate and including a plurality of light-emitting chips disposed at intervals, and a light guide plate disposed on the light source assembly. A surface of the light guide plate facing the substrate is provided with a plurality of grooves where one of the light-emitting chips is correspondingly disposed in one of the grooves, a bottom of each of the grooves is provided with a plurality of first concave parts disposed at intervals, and each of the first concave parts is defined with an arc surface recessed towards a direction away from the substrate.

A light-emitting substrate includes a substrate, a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate; the reflective layer has a plurality of openings, the plurality of openings include a plurality of first openings, and a light-emitting device is located in a first opening; the reflective layer includes a plurality of first reflective portions and a second reflective portion connecting any two adjacent first reflective portions; a first reflective portion, corresponding to the light-emitting device, is located on at least one side of the light-emitting device; a thickness of the first reflective portion is less than a thickness of the second reflective portion.