An optoelectronic device, comprising a stack including a plurality of light-emitting diodes disposed at a distance from one another, and a plurality of electrically conductive terminals arranged between the diodes, and a light confinement layer extending over the stack and comprising reflective walls defining between them, spaces located to the right of each diode. Further, the confinement layer includes the porous alumina in at least one of the spaces, the porous alumina having, in at least one space, preferably in at least two of the spaces, even in each space, from among the at least some spaces, at least two open pores on a first face of the confinement layer which is located opposite the stack. The optical crosstalk phenomena are advantageously reduced.

There is provided a display device including a film including a layer that selectively reflects at least a part of light in a wavelength range of 380 nm to 780 nm to exhibit a structural color, and a micro LED display.

There is provided a display device including a film including a layer that selectively reflects at least a part of light in a wavelength range of 380 nm to 780 nm to exhibit a structural color, and a micro LED display.

An operating element includes a carrier element, a luminous foil in or on which at least one optoelectronic component for generating light along a first main radiation direction and contact lines connected thereto are arranged, a diffuser layer arranged after the at least one optoelectronic component with respect to the first main radiation direction, a structured symbol element which is not arranged in front of the diffuser layer with respect to the first main radiation direction and configured to image at least one symbol along the first main radiation direction in a top view onto the diffuser layer and during operation of the at least one optoelectronic component, a touch-sensitive sensor configured to detect an exerted touch or pressure and to generate an electrical signal, and at least one reflective layer configured to reflect light scattered in the opposite direction to the main radiation direction in the main radiation direction.

An operating element includes a carrier element, a luminous foil in or on which at least one optoelectronic component for generating light along a first main radiation direction and contact lines connected thereto are arranged, a diffuser layer arranged after the at least one optoelectronic component with respect to the first main radiation direction, a structured symbol element which is not arranged in front of the diffuser layer with respect to the first main radiation direction and configured to image at least one symbol along the first main radiation direction in a top view onto the diffuser layer and during operation of the at least one optoelectronic component, a touch-sensitive sensor configured to detect an exerted touch or pressure and to generate an electrical signal, and at least one reflective layer configured to reflect light scattered in the opposite direction to the main radiation direction in the main radiation direction.

A light-emitting device includes a support; a first electrically-conductive part, a second electrically-conductive part, and a third electrically-conductive part disposed apart from one another on the support; a first light-emitting element disposed on the first electrically-conductive part; and an integrated circuit electrically connected to the first light-emitting element. At least a portion of the first electrically-conductive part is located between the second electrically-conductive part and the third electrically-conductive part in a first direction. The integrated circuit and the first light-emitting element are arranged side by side in a second direction orthogonal to the first direction. A maximum length of the integrated circuit in the second direction is smaller than a maximum length of the integrated circuit in the first direction.

A light-emitting device includes a support; a first electrically-conductive part, a second electrically-conductive part, and a third electrically-conductive part disposed apart from one another on the support; a first light-emitting element disposed on the first electrically-conductive part; and an integrated circuit electrically connected to the first light-emitting element. At least a portion of the first electrically-conductive part is located between the second electrically-conductive part and the third electrically-conductive part in a first direction. The integrated circuit and the first light-emitting element are arranged side by side in a second direction orthogonal to the first direction. A maximum length of the integrated circuit in the second direction is smaller than a maximum length of the integrated circuit in the first direction.

A method for manufacturing a light-emitting device includes: preparing an intermediate body including: a substrate, and a plurality of light-emitting elements disposed on the substrate, each including a first surface serving as a light extraction surface, a second surface opposite to the first surface, and a lateral surface connecting the first surface and the second surface; applying a powder composition including a reflective member and a silicone resin powder from above the first surfaces of the plurality of light-emitting elements through a sieve to locate the powder composition on the substrate and between the lateral surfaces of the plurality of light-emitting elements; and forming a first covering member by applying vibration to the powder composition and subsequently applying pressure in a thickness direction of the substrate to perform compression molding.

A method for manufacturing a light-emitting device includes: preparing an intermediate body including: a substrate, and a plurality of light-emitting elements disposed on the substrate, each including a first surface serving as a light extraction surface, a second surface opposite to the first surface, and a lateral surface connecting the first surface and the second surface; applying a powder composition including a reflective member and a silicone resin powder from above the first surfaces of the plurality of light-emitting elements through a sieve to locate the powder composition on the substrate and between the lateral surfaces of the plurality of light-emitting elements; and forming a first covering member by applying vibration to the powder composition and subsequently applying pressure in a thickness direction of the substrate to perform compression molding.

A light emitting apparatus includes: a circuit board; a plurality of light emitting devices connected to the circuit board; and a reflective sheet that reflects light emitted from the plurality of light emitting devices and includes a plurality of reflective cells which respectively accommodate the plurality of light emitting devices. The plurality of reflective cells include a plurality of low-reflection patterns. The plurality of low-reflection patterns include a pattern disposed closer to an edge of the reflective sheet, size of which is relatively smaller than size of other patterns.