A display device includes a substrate, a plurality of interconnects disposed on the substrate, and a plurality of light-emitting elements arranged on the substrate and electrically connected to the plurality of interconnects. The plurality of light-emitting elements include a red light-emitting element configured to emit red light, a green light-emitting element configured to emit green light, and a blue light-emitting element configured to emit blue light. A wall is provided around a light-emitting element selected from the red light-emitting element, the green light-emitting element, and the blue light-emitting element, so as to control light emitting from the selected light-emitting element.

A method of forming a micro light-emitting diode (microLED) array may include forming pixel isolation structures on a sacrificial substrate, and mounting the microLEDs on a separate backplane. The processes that forms the pixel isolation structures, and which may damage the backplane or microLEDs can be separately performed on the sacrificial substrate. The pixel isolation structures can then be attached to the backplane and the sacrificial substrate can be removed. This allows the formation of the pixel isolation structures to be isolated, the microLEDs to be tested early in the process, and the interface between the microLEDs and subsequent layers to be free of adhesive.

A method of forming a micro light-emitting diode (microLED) array may include forming pixel isolation structures on a sacrificial substrate, and mounting the microLEDs on a separate backplane. The processes that forms the pixel isolation structures, and which may damage the backplane or microLEDs can be separately performed on the sacrificial substrate. The pixel isolation structures can then be attached to the backplane and the sacrificial substrate can be removed. This allows the formation of the pixel isolation structures to be isolated, the microLEDs to be tested early in the process, and the interface between the microLEDs and subsequent layers to be free of adhesive.

A display device includes: an anode including an exposure area and a contact area; a mirror layer overlapping with the anode; and a via located between the anode and the mirror layer. The mirror layer includes: a first barrier layer; a reflective electrode on the first barrier layer; and a second barrier layer on a portion of the reflective electrode.

A display device includes: an anode including an exposure area and a contact area; a mirror layer overlapping with the anode; and a via located between the anode and the mirror layer. The mirror layer includes: a first barrier layer; a reflective electrode on the first barrier layer; and a second barrier layer on a portion of the reflective electrode.

A wafer includes: a substrate; a plurality of light emitting elements on the substrate, each of the plurality of light emitting elements includes a semiconductor stack, a first contact electrode, and a second contact electrode; a plurality of pin pads on the substrate and including a semiconductor stack; and a plurality of connectors connecting different pin pads to each of the first contact electrode and the second contact electrode of a light emitting element from among the plurality of light emitting elements.

A wafer includes: a substrate; a plurality of light emitting elements on the substrate, each of the plurality of light emitting elements includes a semiconductor stack, a first contact electrode, and a second contact electrode; a plurality of pin pads on the substrate and including a semiconductor stack; and a plurality of connectors connecting different pin pads to each of the first contact electrode and the second contact electrode of a light emitting element from among the plurality of light emitting elements.

A display device includes: a substrate; a light emitting element disposed on the substrate; a bank layer disposed on the light emitting element and defining an opening overlapping the light emitting element in a plan view; a color conversion pattern disposed inside the opening and having an outer side surface including a contact portion that contacts an upper surface of the bank layer; and a capping layer covering the bank layer and the color conversion pattern. An angle between a first tangent from the contact portion to the outer side surface of the color conversion pattern and a second tangent from the contact portion to the upper surface of the bank layer in a direction away from the color conversion pattern is greater than or equal to about 90 degrees and less than about 180 degrees.

A display device includes: a substrate; a light emitting element disposed on the substrate; a bank layer disposed on the light emitting element and defining an opening overlapping the light emitting element in a plan view; a color conversion pattern disposed inside the opening and having an outer side surface including a contact portion that contacts an upper surface of the bank layer; and a capping layer covering the bank layer and the color conversion pattern. An angle between a first tangent from the contact portion to the outer side surface of the color conversion pattern and a second tangent from the contact portion to the upper surface of the bank layer in a direction away from the color conversion pattern is greater than or equal to about 90 degrees and less than about 180 degrees.

A micro LED array includes a plurality of micro LED structures, wherein each of the micro LED structure includes: a mesa structure; a first thermal conductive layer formed surrounding a sidewall of the mesa structure, wherein a material of the first thermal conductive layer is an electrically insulative material with high thermal conductivity; and a bottom connect structure provided at a bottom of the mesa structure to electrically connect the mesa structure to a bottom pad of an integrated circuit (IC) backplane.