A semiconductor device is provided. The semiconductor device includes a backside power distribution (BSPDN), a high thermal conductivity dielectric layer, a heat sink, and a heat transfer pillar. The heat transfer pillar is connected to the high thermal conductivity dielectric layer and extends to the heat sink.

A microelectronic structure that includes a stacked FET that includes a frontside source/drain and a backside source/drain. A connection via that passes through the backside source/drain. The connection via extends from a frontside surface of the backside source/drain to a backside surface of the backside source/drain. The backside source/drain surrounds the connection via as it passes through the backside source/drain.

Methods for fabricating semiconductor structures are provided. An exemplary method includes forming a first transistor structure and a second transistor structure over a substrate, wherein each transistor structure includes at least one nanosheet. The method further includes depositing a metal over each transistor structure and around each nanosheet; depositing a coating over the metal; depositing a mask over the coating; and patterning the mask to define a patterned mask, wherein the patterned mask lies over a masked portion of the coating and the second transistor structure, and wherein the patterned mask does not lie over an unmasked portion of the coating and the first transistor structure. The method further includes etching the unmasked portion of the coating and the metal over the first transistor structure using a dry etching process with a process pressure of from 30 to 60 (mTorr).

In a semiconductor integrated circuit device, a plurality of cell rows each including standard cells arranged in the X direction are placed. The plurality of cell rows include a first cell row having a height H1 and a second cell row having a height H2 (H1<H2). The first cell row includes a logic cell and a cell having no logical function, and the second cell row includes a logic cell and a cell having no logical function. Nanosheets of the cells in the first cell row are smaller in width in the Y direction than nanosheets of the cells in the second cell row.

A semiconductor device includes a substrate having a first region and a second region, a first transistor in the first region, and a second transistor in the second region. The first transistor includes a first gate structure having an interfacial layer, a first high-k region over the interfacial layer, and a conductive layer over the first high-k region. The second transistor includes a second gate structure having the interfacial layer, a second high-k region over the interfacial layer, and the conductive layer over the second high-k region. The first high-k region is thicker than the second high-k region. The first transistor includes a first channel under the first gate structure. The first channel has first and second semiconductor materials alternately stacked. The first transistor includes a first source/drain (S/D) feature interfacing with both the first and second semiconductor materials in the first channel of the first transistor.

A method for forming a 2D channel field-effect transistor device is provided. The method includes forming a device layer stack on a substrate. The device layer stack includes lower and upper sacrificial layers and a channel layer of a 2D material. The method further includes embedding the device layer stack in a dummy layer, forming a gate cavity in the dummy layer, and removing the sacrificial layers from the device layer stack by etching the sacrificial material from the gate cavity. After removing the sacrificial layers, the method includes forming an oxide liner along sidewalls of the gate cavity including an oxidation process to oxidize a thickness portion of the dummy layer, forming a gate stack in the gate cavity to surround the channel layer, forming source/drain contact cavities in the dummy layer, forming source/drain contacts in the source/drain contact cavities, and replacing the dummy layer with a dielectric layer.

Isolation breaks between logic cells in integrated circuit (IC) devices. A source-drain trench between adjacent channel regions includes a pair of source or drain semiconductor bodies, a first of the source or drain bodies in the source-drain trench is connected to a first of the channel regions, a second of the source or drain bodies in the source-drain trench is connected to a second of the channel regions, and a dielectric isolation is in the source-drain trench and between the pair of source or drain bodies. The dielectric isolation may include a void between layers or sidewalls of dielectric. The pair of source or drain bodies may include highly conductive, metallized layers in contact with the dielectric isolation.

In a semiconductor integrated circuit device, a plurality of cell rows each including standard cells arranged in the X direction are placed. The plurality of cell rows include a first cell row having a height H1 and a second cell row having a height H2 (H1<H2). The first cell row includes a logic cell and a cell having no logical function, and the second cell row includes a logic cell and a cell having no logical function. Nanosheets of the cells in the first cell row are smaller in width in the Y direction than nanosheets of the cells in the second cell row.

An integrated circuit device includes a fin-shaped active region. A pair of lower channel regions are disposed on the active region. A pair of upper channel regions are disposed on upper portions of the lower channel regions. A lower source/drain region is formed on the active region, contacting the pair of lower channel regions. An upper source/drain region is formed on the lower source/drain region, contacting the pair of upper channel regions. The upper source/drain region includes a first semiconductor pattern contacting side surfaces of the pair of upper channel regions, a second semiconductor pattern covering the first semiconductor pattern, and a third semiconductor pattern filled between the pair of upper gate portions, and covering the first semiconductor pattern and the second semiconductor pattern. A lowermost portion of a lower surface of the upper source/drain region is a part of a lower surface of the third semiconductor pattern.

A method includes performing a cleaning process on a first surface of a first wafer, and performing a surface activation process on the first surface. The surface activation process is selected from the group consisting of: a plasma surface activation process comprising generating a plasma from a process gas, wherein ions in the plasma are removed using a filter, and wherein a remaining uncharged part of the plasma is used to treat the first surface; a laser surface activation process using a laser beam; an acid surface activation process using an acid; and an alkali surface activation process using an alkali. After the surface activation process, a rinsing process is performed on the first surface. The first surface of the first wafer is bonded to a second surface of a second wafer.