An electronic device and methods of fabrication are disclosed. In an embodiment, an electronic device includes a display panel including a display area, a peripheral edge surrounding the display area, and a border region along the peripheral edge and surrounding the display area. The display panel may further include an array of pixel driver chips, a redistribution layer (RDL) over the array of pixel driver chips, and an array of light-emitting diodes (LEDs) mounted on the RDL within the display area, where the RDL includes a metal seal ring in the border region.

An electronic device and methods of fabrication are disclosed. In an embodiment, an electronic device includes a display panel including a display area, a peripheral edge surrounding the display area, and a border region along the peripheral edge and surrounding the display area. The display panel may further include an array of pixel driver chips, a redistribution layer (RDL) over the array of pixel driver chips, and an array of light-emitting diodes (LEDs) mounted on the RDL within the display area, where the RDL includes a metal seal ring in the border region.

Provided are a display panel and a display apparatus. The display panel comprises a substrate and pixel circuits on one side of the substrate. At least one of the pixel circuits comprises a driving transistor, a data writing transistor, and an anode reset transistor. The data writing transistor has a gate electrically connected to a first scan line, a first electrode electrically connected to a data line, and a second electrode electrically connected to a first electrode of the driving transistor. The anode reset transistor has a gate electrically connected to the first scan line, a first electrode electrically connected to a reset line, and a second electrode electrically connected to a light-emitting element. The anode reset transistor and the data writing transistor of a same pixel circuit are electrically connected to a same first scan line.

Provided are a display panel and a display apparatus. The display panel comprises a substrate and pixel circuits on one side of the substrate. At least one of the pixel circuits comprises a driving transistor, a data writing transistor, and an anode reset transistor. The data writing transistor has a gate electrically connected to a first scan line, a first electrode electrically connected to a data line, and a second electrode electrically connected to a first electrode of the driving transistor. The anode reset transistor has a gate electrically connected to the first scan line, a first electrode electrically connected to a reset line, and a second electrode electrically connected to a light-emitting element. The anode reset transistor and the data writing transistor of a same pixel circuit are electrically connected to a same first scan line.

A display device including a substrate including a pixel circuit, a pixel electrode connected to the pixel circuit, an insulating layer disposed on the pixel electrode, a through electrode penetrating the insulating layer and connecting to the pixel electrode, a bottom bonding electrode and an upper bonding electrode sequentially disposed on the through electrode and the insulating layer, and a light emitting element disposed on the upper bonding electrode. The through electrode has a groove whose upper surface is concave downward. A lower surface of the bottom bonding electrode follows the surface profile of the insulating layer and the through electrode disposed below, and an upper surface is flat. The bottom bonding electrode includes an oxide layer.

A display device including a substrate including a pixel circuit, a pixel electrode connected to the pixel circuit, an insulating layer disposed on the pixel electrode, a through electrode penetrating the insulating layer and connecting to the pixel electrode, a bottom bonding electrode and an upper bonding electrode sequentially disposed on the through electrode and the insulating layer, and a light emitting element disposed on the upper bonding electrode. The through electrode has a groove whose upper surface is concave downward. A lower surface of the bottom bonding electrode follows the surface profile of the insulating layer and the through electrode disposed below, and an upper surface is flat. The bottom bonding electrode includes an oxide layer.

A mass transfer assembly includes a temporary substrate and a transfer substrate. The temporary substrate is configured to adhere electrodes of each light-emitting element on a growth substrate, to separate each light-emitting element from the growth substrate, such that a light-emitting body of each light-emitting element is suspended. The transfer substrate is configured to adhere, through adhesion regions, a light-emitting body of each light-emitting element on the temporary substrate, to separate each light-emitting element from the temporary substrate, such that electrodes of each light-emitting element are suspended. One adhesion region adheres a light-emitting body of one light-emitting element. Positions of the adhesion regions on the transfer substrate are in one-to-one correspondence with positions of binding regions on a driving substrate. The transfer substrate is further configured to transfer each light-emitting element to the driving substrate, to bind electrodes of each light-emitting element to a corresponding binding region.

A mass transfer assembly includes a temporary substrate and a transfer substrate. The temporary substrate is configured to adhere electrodes of each light-emitting element on a growth substrate, to separate each light-emitting element from the growth substrate, such that a light-emitting body of each light-emitting element is suspended. The transfer substrate is configured to adhere, through adhesion regions, a light-emitting body of each light-emitting element on the temporary substrate, to separate each light-emitting element from the temporary substrate, such that electrodes of each light-emitting element are suspended. One adhesion region adheres a light-emitting body of one light-emitting element. Positions of the adhesion regions on the transfer substrate are in one-to-one correspondence with positions of binding regions on a driving substrate. The transfer substrate is further configured to transfer each light-emitting element to the driving substrate, to bind electrodes of each light-emitting element to a corresponding binding region.

A micro multi-color LED device includes two or more LED structures for emitting a range of colors. The two or more LED structures are vertically stacked to combine light from the two more LED structures. In some embodiments, each LED structure is connected to a pixel driver and a shared P-electrode. The LED structures are bonded together through bonding layers. In some embodiments, reflection layers are implemented in the device to improve the LED emission efficiency. A display panel comprising an array of the micro tri-color LED devices has a high resolution and a high illumination brightness.

A display apparatus includes: a substrate; a first wiring on the substrate; and a second wiring on the first wiring and electrically connected to the first wiring, wherein the first wiring and the second wiring comprise an overlapping area in which the first wiring overlaps the second wiring in a plan view, and at least one of the first wiring or the second wiring comprises an opening in the overlapping area.