A pickup control method and a transfer device of a light-emitting element chip are discussed. The pickup control method can include a first operation of loading stamps on a transfer head, transporting the transfer head to a first substrate, and picking up light-emitting element chips with the stamps, a second operation of transporting the transfer head along with the stamps that pick up the light-emitting element chips to a second substrate and checking pickup states of the light-emitting element chips transported to the second substrate using an image detector located below the transfer head, and a third operation of transporting the transfer head along with the stamps that pick up the light-emitting element chips toward a chip removal system when a pickup failure is detected from the light-emitting element chips as a result of analyzing an image captured by the image detector.

A pickup control method and a transfer device of a light-emitting element chip are discussed. The pickup control method can include a first operation of loading stamps on a transfer head, transporting the transfer head to a first substrate, and picking up light-emitting element chips with the stamps, a second operation of transporting the transfer head along with the stamps that pick up the light-emitting element chips to a second substrate and checking pickup states of the light-emitting element chips transported to the second substrate using an image detector located below the transfer head, and a third operation of transporting the transfer head along with the stamps that pick up the light-emitting element chips toward a chip removal system when a pickup failure is detected from the light-emitting element chips as a result of analyzing an image captured by the image detector.

A manufacturing method of an electronic device includes following steps: (a) providing an electronic panel, wherein the electronic panel includes a first substrate and a plurality of electronic elements, and the plurality of electronic elements are bonded on the first substrate; (b) inspecting the electronic panel, wherein when the electronic panel is determined to be a defective product, perform following step (c) to step (f); (c) debonding the plurality of electronic elements from the first substrate; (d) transferring the plurality of electronic elements to a temporary substrate; (e) transferring the plurality of electronic elements from the temporary substrate to a second substrate; and (f) bonding the plurality of electronic elements on the second substrate.

A manufacturing method of an electronic device includes following steps: (a) providing an electronic panel, wherein the electronic panel includes a first substrate and a plurality of electronic elements, and the plurality of electronic elements are bonded on the first substrate; (b) inspecting the electronic panel, wherein when the electronic panel is determined to be a defective product, perform following step (c) to step (f); (c) debonding the plurality of electronic elements from the first substrate; (d) transferring the plurality of electronic elements to a temporary substrate; (e) transferring the plurality of electronic elements from the temporary substrate to a second substrate; and (f) bonding the plurality of electronic elements on the second substrate.

A method for manufacturing a display module includes the steps of: transferring LEDs of a substrate to a first relay substrate; transferring the LEDs of the first relay substrate to a second relay substrate in a primary stretch array such that a gap between adjacent LEDs on the second relay substrate is greater than a gap between adjacent LEDs on the first relay substrate in one direction from among a row direction and a column direction; and transferring the LEDs of the second relay substrate to a target substrate in a secondary stretch array such that a gap between adjacent LEDs on the target substrate is greater than a gap between adjacent LEDs on the second relay substrate in a remaining direction from among the row direction and the column direction.

A method for manufacturing a display module includes the steps of: transferring LEDs of a substrate to a first relay substrate; transferring the LEDs of the first relay substrate to a second relay substrate in a primary stretch array such that a gap between adjacent LEDs on the second relay substrate is greater than a gap between adjacent LEDs on the first relay substrate in one direction from among a row direction and a column direction; and transferring the LEDs of the second relay substrate to a target substrate in a secondary stretch array such that a gap between adjacent LEDs on the target substrate is greater than a gap between adjacent LEDs on the second relay substrate in a remaining direction from among the row direction and the column direction.

A light emitting element transfer device includes a first transfer head, a second transfer head disposed below the first transfer head, a stamp disposed below the second transfer head, a tilting adjustment member which adjusts a tilting of the second transfer head and a buffer member disposed below the second transfer head to be adjacent to the stamp and protruding in a downward direction to be lower than the stamp, where the buffer member includes an elastic material, where a thickness of the buffer member is greater than a sum of a thickness of the stamp and a thickness of the light emitting element.

A display device comprises a plurality of singulated dies attached to a backplane. Each singulated die comprises a plurality of LEDs. A method of forming the display device comprises attaching the plurality of singulated dies to the backplane.

A display device comprises a plurality of singulated dies attached to a backplane. Each singulated die comprises a plurality of LEDs. A method of forming the display device comprises attaching the plurality of singulated dies to the backplane.

A mask and a method for manufacturing the mask with excellent processability and transferability of individualized pieces, as well as a method for manufacturing a display device and a display device. By using a mask having a predetermined shape of a light-shielding portion that blocks laser light within an opening that transmits laser light, laser light is irradiated from the base material side to the curable resin film formed on the base material to remove the curable resin film in the irradiated portion, thereby forming individualized pieces of a predetermined shape composed of a curable resin film with a reaction rate of 25% or less on the base material. This allows for excellent workability and transferability of the individualized pieces, thereby improving tact time.