A stacked chip assembly for a display system may include a front plane die and one or more backplane dies, such as a first backplane die and a second backplane die. The front plane die may include a plurality of light emitting diodes (LEDs). The one or more backplane dies may be stacked vertically relative to the front plane die. In some implementations, the first backplane die may include a first portion of metal oxide semiconductor field effect transistor (MOSFET) display circuitry coupled with the plurality of LEDs, and the second backplane die may include a second portion of MOSFET display circuitry coupled with the first portion of MOSFET display circuitry. In some implementations, the backplane die may include display circuitry that is partitioned between analog circuitry in a first layer and digital circuitry in a second layer. Other aspects are also described and claimed.

The present disclosure relates to a display screen, comprising: a first CMOS circuit layer; a second CMOS circuit layer, located on the first CMOS circuit layer; a light emitting unit layer, located on a side of the second CMOS circuit layer away from the first CMOS circuit layer; the light emitting unit layer comprises a plurality of light emitting units, and the plurality of light emitting units correspond to pixel driving circuits of the first CMOS circuit layer and pixel driving circuits of the second CMOS circuit layer in a one-to-one correspondence; the first CMOS circuit layer comprises different types of CMOS devices than the second CMOS circuit layer. The present solution effectively improves the PPI of the display device, and reduces the size of the entire micro LED-on-silicon display device.

The present disclosure relates to a display screen, comprising: a first CMOS circuit layer; a second CMOS circuit layer, located on the first CMOS circuit layer; a light emitting unit layer, located on a side of the second CMOS circuit layer away from the first CMOS circuit layer; the light emitting unit layer comprises a plurality of light emitting units, and the plurality of light emitting units correspond to pixel driving circuits of the first CMOS circuit layer and pixel driving circuits of the second CMOS circuit layer in a one-to-one correspondence; the first CMOS circuit layer comprises different types of CMOS devices than the second CMOS circuit layer. The present solution effectively improves the PPI of the display device, and reduces the size of the entire micro LED-on-silicon display device.

A display device includes a first display panel including a plurality of first sub-pixels, a first display driver circuit configured to control an image display operation of the first display panel, a second display panel disposed in front of the first display panel and including a plurality of second sub-pixels and a plurality of light-transmitting areas disposed adjacent to the plurality of second sub-pixels, and a second display driver circuit configured to control an image display operation of the second display panel, wherein the second display panel is superimposed with the first display panel at a predetermined distance.

A display device includes a first display panel including a plurality of first sub-pixels, a first display driver circuit configured to control an image display operation of the first display panel, a second display panel disposed in front of the first display panel and including a plurality of second sub-pixels and a plurality of light-transmitting areas disposed adjacent to the plurality of second sub-pixels, and a second display driver circuit configured to control an image display operation of the second display panel, wherein the second display panel is superimposed with the first display panel at a predetermined distance.

A display device includes: a display panel including a first area, a second area formed to be bendable from the first area, and a third area extending from the second area; a driving chip in the third area; a connection substrate including a first hole overlapping the driving chip and a second hole overlapping the third area, and overlapping at least a portion of the third area; and a first resin layer in the second hole.

A display device includes: a display panel including a first area, a second area formed to be bendable from the first area, and a third area extending from the second area; a driving chip in the third area; a connection substrate including a first hole overlapping the driving chip and a second hole overlapping the third area, and overlapping at least a portion of the third area; and a first resin layer in the second hole.

A manufacturing method includes providing a first substrate including a circuit layer and an electronic element disposed on the circuit layer, providing a second substrate, bonding the first substrate and the second substrate to form an electronic module, cutting the electronic module, forming a wire on a first surface exposed after cutting the electronic module and on a second surface of the electronic module, wherein the first surface is adjacent to the second surface and the wire is electrically connected to the circuit layer, and disposing a driving element on the second surface of the electronic module to be electrically connected to the wire.

A manufacturing method includes providing a first substrate including a circuit layer and an electronic element disposed on the circuit layer, providing a second substrate, bonding the first substrate and the second substrate to form an electronic module, cutting the electronic module, forming a wire on a first surface exposed after cutting the electronic module and on a second surface of the electronic module, wherein the first surface is adjacent to the second surface and the wire is electrically connected to the circuit layer, and disposing a driving element on the second surface of the electronic module to be electrically connected to the wire.

A display device includes: a first substrate divided into an active area and a peripheral area adjacent to the active area, an insulating layer disposed on the first substrate, a pixel defining film disposed on the insulating layer, a light emitting element disposed on the insulating layer, an inorganic layer disposed on the pixel defining film, a second substrate disposed on the inorganic layer, a sealing part disposed between the first substrate and the second substrate and overlapping the peripheral area, and a filling material disposed to fill an inner space defined by the first substrate, the second substrate, and the sealing part. In the peripheral area, the insulating layer may be spaced apart from the filling material with the inorganic layer therebetween.