Provided is a display device including a light emitting element layer disposed on a substrate, a thin-film encapsulation layer disposed on the light emitting element layer, a counter substrate facing the substrate, a color filter layer disposed on a surface of the counter substrate and having light transmitting areas and a light blocking area defined, a wavelength conversion layer disposed on the color filter layer, and a filling layer disposed between the wavelength conversion layer and the thin-film encapsulation layer, wherein the wavelength conversion layer includes, a bank overlapping the light blocking area, light transmitting members disposed between portions of the bank and spaced apart from each other, and organic layers spaced apart from each other with the bank interposed between the organic layers and covering the light transmitting members, and lower surfaces of the organic layers and a lower surface of the bank are disposed on a same layer.

The present invention relates to a vertically stacked microdisplay panel, which includes a back wafer having an upper surface on which a plurality of complementary metal-oxide-semiconductor (CMOS) electrode pads are arranged, a plurality of light-emitting diode (LED) stacks, each of which includes a plurality of light-emitting units and a plurality of bonding layers that are stacked in a vertical direction and is arranged on one of a plurality of CMOS electrode pads, and a common electrode formed on the plurality of LED stacks, wherein each of the plurality of LED stacks, by forming a short path in at least one of the plurality of light-emitting units, allows a current to flow through the light-emitting unit in which the short path is not formed, and emits only a specific color, and the short path has a preset depth and a preset width.

According to the present invention, since a color filter is unnecessary despite the adoption of a vertically stacked tandem structure, the color quality of a microdisplay can be significantly improved, and process complexity and productivity can be significantly improved.

The present invention relates to a vertically stacked microdisplay panel, which includes a back wafer having an upper surface on which a plurality of complementary metal-oxide-semiconductor (CMOS) electrode pads are arranged, a plurality of light-emitting diode (LED) stacks, each of which includes a plurality of light-emitting units and a plurality of bonding layers that are stacked in a vertical direction and is arranged on one of a plurality of CMOS electrode pads, and a common electrode formed on the plurality of LED stacks, wherein each of the plurality of LED stacks, by forming a short path in at least one of the plurality of light-emitting units, allows a current to flow through the light-emitting unit in which the short path is not formed, and emits only a specific color, and the short path has a preset depth and a preset width.

According to the present invention, since a color filter is unnecessary despite the adoption of a vertically stacked tandem structure, the color quality of a microdisplay can be significantly improved, and process complexity and productivity can be significantly improved.

An electronic device includes a first substrate, a circuit layer, at least one electronic unit, a second substrate, a reflective layer and an optical layer. The circuit layer is disposed on the first substrate. The electronic unit is disposed above the first substrate and electrically connected to the circuit layer. The second substrate is disposed opposite to the first substrate and includes at least one light transmission area and at least one light reflection area. The light transmission area is located next to the light reflection area, and the light transmission area is arranged corresponding to the electronic unit. The reflective layer is disposed at one side of the second substrate close to the first substrate, and is located corresponding to the light reflection area. The optical layer is disposed between the second substrate and the electronic unit, and is located at least corresponding to the light transmission area.

An electronic device includes a first substrate, a circuit layer, at least one electronic unit, a second substrate, a reflective layer and an optical layer. The circuit layer is disposed on the first substrate. The electronic unit is disposed above the first substrate and electrically connected to the circuit layer. The second substrate is disposed opposite to the first substrate and includes at least one light transmission area and at least one light reflection area. The light transmission area is located next to the light reflection area, and the light transmission area is arranged corresponding to the electronic unit. The reflective layer is disposed at one side of the second substrate close to the first substrate, and is located corresponding to the light reflection area. The optical layer is disposed between the second substrate and the electronic unit, and is located at least corresponding to the light transmission area.

A display device includes a substrate including a first side and a second side adjoining the first side, a plurality of light emitters located on the substrate, a plurality of emission control signal lines located on the substrate to control an emission state or a non-emission state of the plurality of light emitters, and a plurality of connection pads located at an edge adjacent to the first side of the substrate and at an edge adjacent to the second side of the substrate. The plurality of connection pads is connected to the plurality of emission control signal lines.

A display device includes a substrate including a first side and a second side adjoining the first side, a plurality of light emitters located on the substrate, a plurality of emission control signal lines located on the substrate to control an emission state or a non-emission state of the plurality of light emitters, and a plurality of connection pads located at an edge adjacent to the first side of the substrate and at an edge adjacent to the second side of the substrate. The plurality of connection pads is connected to the plurality of emission control signal lines.