A system in a package (SIP) (195) includes carrier layer regions (107) that have a dielectric material with a metal post (109) therethrough, where adjacent carrier layer regions define a gap. A driver IC die (110) is positioned in the gap having nodes connected to bond pads (111) exposed by openings in a top side of a first passivation layer (113), with the bond pads facing up. A dielectric layer (116) is on the first passivation layer and carrier layer region (107) that includes filled through vias (116a) coupled to the bond pads and to the metal post (109). A light blocking layer (118) is on sidewalls and a bottom of the substrate. A first device (140) includes a light emitter that has first bondable features (151a). The light blocking layer blocks at least 90% of incident light. The first bondable features are flipchip mounted to a first portion of the bond pads.

An electromagnetic shielding cap for an electronic circuit includes a main surface and four lateral surfaces. A recessed portion is present in the first lateral surface provided by an open cavity in and at a base of the first lateral surface. An electronic circuit, such as an optical transmission and/or reception device, includes a chip bonded to a first main surface of a substrate. The electromagnetic shielding cap is mounted over the chip to the first main surface of the substrate. The circuit further includes an additional cap made of polymer material. The electromagnetic shielding cap is assembled to the substrate using a solder joint soldered both to a metal pad of the substrate and to at least one wall of the recessed portion. The second cap may be positioned over or under the first cap.

An electromagnetic shielding cap for an electronic circuit includes a main surface and four lateral surfaces. A recessed portion is present in the first lateral surface provided by an open cavity in and at a base of the first lateral surface. An electronic circuit, such as an optical transmission and/or reception device, includes a chip bonded to a first main surface of a substrate. The electromagnetic shielding cap is mounted over the chip to the first main surface of the substrate. The circuit further includes an additional cap made of polymer material. The electromagnetic shielding cap is assembled to the substrate using a solder joint soldered both to a metal pad of the substrate and to at least one wall of the recessed portion. The second cap may be positioned over or under the first cap.

An electronic system includes a radar antenna, configured to emit electromagnetic radiation having a wavelength in a first direction. The electronic system also includes an electric device. The electric device is arranged in an emission direction of the radar antenna. The electric device includes a dielectric layer and a metal wiring for contacting elements of the electric device. A thickness of the dielectric layer measured in the first direction is determined so that the emitted electromagnetic radiation forms at least one standing wave having at least one minimum of electric field intensity within the dielectric layer. The metal wiring is arranged in a horizontal layer of the dielectric layer. A position, in the first direction, of the metal wiring is determined so that it corresponds to a minimum of the electric field strength of electromagnetic radiation having the wavelength .

An electronic system includes a radar antenna, configured to emit electromagnetic radiation having a wavelength in a first direction. The electronic system also includes an electric device. The electric device is arranged in an emission direction of the radar antenna. The electric device includes a dielectric layer and a metal wiring for contacting elements of the electric device. A thickness of the dielectric layer measured in the first direction is determined so that the emitted electromagnetic radiation forms at least one standing wave having at least one minimum of electric field intensity within the dielectric layer. The metal wiring is arranged in a horizontal layer of the dielectric layer. A position, in the first direction, of the metal wiring is determined so that it corresponds to a minimum of the electric field strength of electromagnetic radiation having the wavelength .

An optical sensor package includes a light-emitting unit disposed on a package substrate and configured to emit first light toward a target, a light-receiving unit disposed on the package substrate and configured to receive second light obtained when the first light is reflected from the target, and a molding member formed on the package substrate to surround a top surface of an exposed portion of the package substrate, the light-emitting unit, and the light-receiving unit, the molding member including a groove formed in a thickness direction between the light-emitting unit and the light-receiving unit, wherein the groove is filled with an opaque material.

An optical sensor package includes a light-emitting unit disposed on a package substrate and configured to emit first light toward a target, a light-receiving unit disposed on the package substrate and configured to receive second light obtained when the first light is reflected from the target, and a molding member formed on the package substrate to surround a top surface of an exposed portion of the package substrate, the light-emitting unit, and the light-receiving unit, the molding member including a groove formed in a thickness direction between the light-emitting unit and the light-receiving unit, wherein the groove is filled with an opaque material.

An optoelectronic component comprises a field effect transistor that is implemented in a first die and has a source and a sink. The field effect transistor is implemented as a floating-gate transistor with a control electrode and an isolated gate electrode. The optoelectronic component further comprises a light diode that is implemented in a second die and has an anode and a cathode. The second die is arranged on an upper side of the first die. The light diode and a channel of the field effect transistor are electrically connected in series.

An optoelectronic component comprises a field effect transistor that is implemented in a first die and has a source and a sink. The field effect transistor is implemented as a floating-gate transistor with a control electrode and an isolated gate electrode. The optoelectronic component further comprises a light diode that is implemented in a second die and has an anode and a cathode. The second die is arranged on an upper side of the first die. The light diode and a channel of the field effect transistor are electrically connected in series.

In an embodiment a housing includes a first leadframe part and a second leadframe part and a housing body mechanically connecting the first and second leadframe parts to one another, wherein each first and second leadframe part has a mounting area on an inner side and each has an outer side opposite the inner side, wherein the first leadframe part has at least one solder control point and the second leadframe part has at least two solder control points, wherein each solder control point is formed as a recess at an associated outer side and is accessible from an outer side wall of the housing, and wherein the solder control points of the second leadframe part and the at least one solder control point of the first leadframe part are located on mutually opposite outer side walls of the housing body and are arranged completely offset relative to one another so that the solder control points are free of an overlap in a direction parallel to a main axis.