The present application relates to the field of biomedical engineering. Disclosed are an individual impedance-based radio-frequency heating temperature field prediction method and system which greatly improve the rate and accuracy of temperature distribution prediction. The method of the present application comprises: creating a first region; obtaining a position of an ablation needle, and with the ablation needle as a center, creating a second region in the first region; keeping the electrical conductivity within the second region constant, and adjusting the electrical conductivity in the first region such that impedance between the ablation needle and an earth pole is consistent with real individual impedance actually measured by a treatment system; performing mesh division on a combination of the first region and the second region and performing coupling computation using a radio-frequency field model and a biological heat transfer model to obtain temperature field time-space information.

There is provided a design assist apparatus including an inputting unit configured to input an analysis condition including substrate information of a thermal analysis target and current detection element information, and a display control unit configured to control a display unit to display, on the display unit, a thermal analysis result based on the analysis condition, in which the display control unit is configured to control the display unit to display, on the display unit and in a mutually identifiable manner, a first thermal analysis result based on a first analysis condition input by the inputting unit and a second thermal analysis result based on a second analysis condition obtained by changing at least one of the substrate information and the current detection element information from the first analysis condition.

Apparatus and methods are provided for improving thermal control, including collecting data of a plurality of systems, each of the plurality of systems including at least one first cooling element and at least one first heat-generating element; conducting a first simulation using a simulation model based on the collected data to generate a first set of simulation results; conducting a first training on a control system using the first set of simulation results to obtain a first trained control system; and using the first trained control system to monitor a field system with a space having at least one second cooling element and at least one second heat-generating element and to control the at least one second cooling element and the at least one second heat-generating element.

Systems and methods for predicting locations of overheating of one or more objects for build of the one or more objects by additive manufacturing using simulation. A method includes simulating temperature of an object as a function of spatial location during a layer by layer build using powder based additive manufacturing comprising determining a temperature over time at a plurality of locations of a plurality of layers of the object. The method further includes calculating, for each of the plurality of locations, an overheating index that is a function of each of a corresponding maximum temperature, thermal gradient, and heat modulus. The method further includes, based on one or more overheating indexes of one or more locations exceeding the threshold indicating overheating, adjusting a build of the object.

A method includes: receiving a layout of an integrated circuit; identifying, based on the layout, at least a first net and at least a second net, wherein the first net extends through the integrated circuit along a vertical direction, and the second net terminates at a middle portion of the integrated circuit along the vertical direction; dividing the integrated circuit into a plurality of grid units, wherein the first net is constituted by a first subset of the plurality of grid units, and the second net is constituted by a second subset of the plurality of grid units; estimating a first thermal conductivity of each of the first subsets of grid units; estimating a second thermal conductivity of each of the second subsets of grid units; and estimating an equivalent thermal conductivity of the integrated circuit based on combining the first thermal conductivity and the second thermal conductivity.

Systems and methods for adapting a boundary condition of a simulation of 3D manufacturing are provided. The simulation of 3D manufacturing is based on thermal sensor data from a thermal sensor at a point of a build enclosure are provided.

A thermal compensation design and implementation method for near-net-shape molding of a thermoset composite part based on temperature and curing degree fields is provided. A minimum symmetric unit model is established based on sizes of the part and a mold and ambient temperature. A curing kinetic model and a heat transfer model are established. A molding temperature curve is written into a subprogram. A simulated thermal compensation is performed on a region whose temperature is lower than a molding temperature with a difference of greater than or equal to 5% of the molding temperature until the temperature difference of individual regions is less than 5% of the molding temperature. The simulated thermal compensation is then performed on those regions with a curing degree less than or equal to 0.9. A thermal compensation device is assembled according to the thermal compensation scheme for experimental verification.

A method of testing an integrated circuit on a test circuit board includes performing, by a processor, a simulation of a first heat distribution throughout an integrated circuit design, and simultaneously performing a burn-in test of the integrated circuit and an automated test of the integrated circuit. The burn-in test has a minimum burn-in temperature of the integrated circuit or a burn-in heat distribution across the integrated circuit that includes a set of circuit blocks or a first set of heaters. The integrated circuit design corresponding to the integrated circuit. The performing the simulation includes determining a heat signature of the integrated circuit design from configured power information or location information for each circuit block of the set of circuit blocks or each heater of the set of heaters included in the integrated circuit design. The heat signature includes heat values distributed throughout the integrated circuit design.

An information handling system includes a memory device and a processor. The memory device includes first data representing a thermal profile of a motherboard, and second data representing a circuit trace of the motherboard. The circuit trace provides a high-speed data interconnection between two or more circuit devices. The processor determines an average temperature of the circuit trace on the motherboard based upon the first data and the second data, and models a trace layout for the circuit trace on the motherboard based upon the average temperature.

Disclosed are DFOS/DTS systems, methods, and structures that employ physics-informed machine learning, Finite Element Analysis (FEA) in combination with DFOS/DTS to enhance the detection, prediction, and management of thermal anomalies in submarine cables. Our integrated approach advantageously leverages FEA to simulate accurate temperature distributions within the cable, identifies potential hot spots, and validates these with real-time DTS data. By integrating advanced machine learning algorithms, our systems and methods continuously learn from both simulated and real-world data, predicting potential failure points and suggesting preemptive maintenance actions. A hybrid model, combining data-driven and physics-based approaches, incorporates uncertainty quantification methods, providing confidence intervals for predictions. Our systems and methods enhance the reliability, efficiency, and lifespan of submarine cables, by providing anomaly detection and predictive maintenance indications for the submarine cables.