A curable composition including (A) a semiconductor nanorod, (B) a photopolymerizable monomer including a compound having an unsaturated carbon-carbon double bond, (C) a photopolymerization initiator including a compound of a specific structure, and (D) a solvent, a film manufactured using the same, and a display device including the film are provided.

A stamp includes a substrate; position limiting structures located on a side of the substrate and spaced apart from each other; and transfer structures, which are located on the side of the substrate where the position limiting structures are located, and are spaced apart from each other. The position limiting structures are in one-to-one correspondence with the transfer structures. Each position limiting structure surrounds a periphery of a corresponding transfer structure, and an orthogonal projection of the position limiting structure on the substrate does not overlap with an orthogonal projection of the corresponding transfer structure on the substrate. A distance between an end surface of an end, which is distal to the substrate, of each transfer structure and the substrate is greater than a distance between an end surface of an end, which is distal to the substrate, of a corresponding position limiting structure and the substrate.

A stamp includes a substrate; position limiting structures located on a side of the substrate and spaced apart from each other; and transfer structures, which are located on the side of the substrate where the position limiting structures are located, and are spaced apart from each other. The position limiting structures are in one-to-one correspondence with the transfer structures. Each position limiting structure surrounds a periphery of a corresponding transfer structure, and an orthogonal projection of the position limiting structure on the substrate does not overlap with an orthogonal projection of the corresponding transfer structure on the substrate. A distance between an end surface of an end, which is distal to the substrate, of each transfer structure and the substrate is greater than a distance between an end surface of an end, which is distal to the substrate, of a corresponding position limiting structure and the substrate.

An ink for manufacturing a display device includes a solvent; and light emitting elements disposed in the solvent, wherein the light emitting elements include a first semiconductor layer including a first type of semiconductor and a second semiconductor layer including a second type of semiconductor, and an electrical conductivity of the ink is about 1.5 S/m or less. Also provided are a method of manufacturing a display device using the ink and a display device manufactured by the method.

An ink for manufacturing a display device includes a solvent; and light emitting elements disposed in the solvent, wherein the light emitting elements include a first semiconductor layer including a first type of semiconductor and a second semiconductor layer including a second type of semiconductor, and an electrical conductivity of the ink is about 1.5 S/m or less. Also provided are a method of manufacturing a display device using the ink and a display device manufactured by the method.

A display device includes a bank layer disposed on a substrate and defining a light-emitting area and a sub-area, a first electrode and a second electrode spaced apart from each other and extending from the light-emitting area to the sub-area, a plurality of light-emitting elements disposed on the first electrode and the second electrode in the light-emitting area, a plurality of dummy light-emitting elements disposed on the first electrode and the second electrode in the sub-area, a first connection electrode in electrical contact with an end of each of the plurality of light-emitting elements, and a second connection electrode in electrical contact with another end of each of the plurality of light-emitting elements. The sub-area includes an isolation area in which each of the first electrode and the second electrode is disconnected, and the plurality of dummy light-emitting elements are not disposed in the isolation area.

A display device includes a bank layer disposed on a substrate and defining a light-emitting area and a sub-area, a first electrode and a second electrode spaced apart from each other and extending from the light-emitting area to the sub-area, a plurality of light-emitting elements disposed on the first electrode and the second electrode in the light-emitting area, a plurality of dummy light-emitting elements disposed on the first electrode and the second electrode in the sub-area, a first connection electrode in electrical contact with an end of each of the plurality of light-emitting elements, and a second connection electrode in electrical contact with another end of each of the plurality of light-emitting elements. The sub-area includes an isolation area in which each of the first electrode and the second electrode is disconnected, and the plurality of dummy light-emitting elements are not disposed in the isolation area.

A light-emitting element extending in one direction includes: a semiconductor core including a main body extending in the one direction, a first end connected to one side of the main body and having an inclined side surface, and a second end connected to an other side of the main body and having a width less than that of the main body; and an insulation film around at least a portion of the outer surface of the semiconductor core, wherein the insulation film includes a first insulation film around the first end of the semiconductor core; and a second insulation film around the second end of the semiconductor core, wherein the diameter of an outer surface of the first insulation film is the same as a diameter of an outer surface of the second insulation film.

A mass transfer assembly includes a temporary substrate and a transfer substrate. The temporary substrate is configured to adhere electrodes of each light-emitting element on a growth substrate, to separate each light-emitting element from the growth substrate, such that a light-emitting body of each light-emitting element is suspended. The transfer substrate is configured to adhere, through adhesion regions, a light-emitting body of each light-emitting element on the temporary substrate, to separate each light-emitting element from the temporary substrate, such that electrodes of each light-emitting element are suspended. One adhesion region adheres a light-emitting body of one light-emitting element. Positions of the adhesion regions on the transfer substrate are in one-to-one correspondence with positions of binding regions on a driving substrate. The transfer substrate is further configured to transfer each light-emitting element to the driving substrate, to bind electrodes of each light-emitting element to a corresponding binding region.

A mass transfer assembly includes a temporary substrate and a transfer substrate. The temporary substrate is configured to adhere electrodes of each light-emitting element on a growth substrate, to separate each light-emitting element from the growth substrate, such that a light-emitting body of each light-emitting element is suspended. The transfer substrate is configured to adhere, through adhesion regions, a light-emitting body of each light-emitting element on the temporary substrate, to separate each light-emitting element from the temporary substrate, such that electrodes of each light-emitting element are suspended. One adhesion region adheres a light-emitting body of one light-emitting element. Positions of the adhesion regions on the transfer substrate are in one-to-one correspondence with positions of binding regions on a driving substrate. The transfer substrate is further configured to transfer each light-emitting element to the driving substrate, to bind electrodes of each light-emitting element to a corresponding binding region.