A solder connection that connects a contact pad on a first surface to a strip-shaped conductor. The strip-shaped conductor has a widening at one end and a through opening therein. A solder ball is located in the opening and connects the end of the conductor to the contact pad.

A semiconductor processing apparatus includes a process chamber that defines an enclosure. The enclosure includes a substrate support configured to support a substrate and rotate the substrate about a central axis of the process chamber. The substrate support is also configured to move vertically along the central axis and position the substrate at multiple locations in the enclosure. The apparatus also includes one or more UV lamps configured to irradiate a top surface of the substrate supported on the substrate support.