A light emitting device is provided and includes a first substrate, a light blocking element disposed on the first substrate, and a plurality of light emitting diodes. The light blocking element has a first opening, a second opening, and a third opening, wherein the first opening is adjacent to the second opening, the third opening is adjacent to the first opening, and the first opening and the second opening have different areas. One of the light emitting diodes is overlapped with the third opening. The first opening and the second opening are not overlapped with the plurality of light emitting diodes in a normal direction of a surface of the first substrate.

A light-emitting module according to an embodiment comprises: a substrate; a plurality of light-emitting diode chips which are disposed on the substrate; a plurality of wavelength converters which are disposed on the plurality of light-emitting diode chips respectively; and a white wall which surrounds the plurality of light-emitting diode chips and the plurality of wavelength converters, wherein each of the plurality of wavelength converters includes a side surface which is inclined at an inclination angle of 80 degrees or less to the upper surface of the wavelength converter.

A light-emitting module according to an embodiment comprises: a substrate; a plurality of light-emitting diode chips which are disposed on the substrate; a plurality of wavelength converters which are disposed on the plurality of light-emitting diode chips respectively; and a white wall which surrounds the plurality of light-emitting diode chips and the plurality of wavelength converters, wherein each of the plurality of wavelength converters includes a side surface which is inclined at an inclination angle of 80 degrees or less to the upper surface of the wavelength converter.

In an embodiment an arrangement includes a plurality of optoelectronic semiconductor components arranged in a common plane, wherein each semiconductor component is laterally delimited by side faces, and wherein each semiconductor component has a semiconductor body with an active region configured to emit electromagnetic radiation, a radiation outlet side configured to couple out the electromagnetic radiation, a rear face opposite to the radiation outlet side, and a contact structure arranged on the rear face. The arrangement further includes an output element, an electrically insulating insulation layer and an electrical connection structure, wherein the insulation layer is arranged between side faces of adjacent semiconductor components and is absorbent or reflective of the electromagnetic radiation.

In an embodiment an arrangement includes a plurality of optoelectronic semiconductor components arranged in a common plane, wherein each semiconductor component is laterally delimited by side faces, and wherein each semiconductor component has a semiconductor body with an active region configured to emit electromagnetic radiation, a radiation outlet side configured to couple out the electromagnetic radiation, a rear face opposite to the radiation outlet side, and a contact structure arranged on the rear face. The arrangement further includes an output element, an electrically insulating insulation layer and an electrical connection structure, wherein the insulation layer is arranged between side faces of adjacent semiconductor components and is absorbent or reflective of the electromagnetic radiation.

An LED lamp panel, which comprises a substrate that is provided with a circuit layer, and the circuit layer is provided with bonding pads for connecting with a plurality of LED chips; the circuit layer is provided with a first reflective layer, and the first reflective layer is provided with a plurality of window structures, which are disposed in an array, and at least one pair of bonding pads for connecting with the LED chips is distributed in each of the window structures; the LED lamp panel further comprises a second reflective layer filled between the first reflective layer and the LED chips, and the reflectivity of the second reflective layer is greater than that of the first reflective layer. The LED lamp panel provided by the present disclosure is beneficial for die bonding and has a high lighting effect, an improved process yield, and a low manufacturing cost.

An LED lamp panel, which comprises a substrate that is provided with a circuit layer, and the circuit layer is provided with bonding pads for connecting with a plurality of LED chips; the circuit layer is provided with a first reflective layer, and the first reflective layer is provided with a plurality of window structures, which are disposed in an array, and at least one pair of bonding pads for connecting with the LED chips is distributed in each of the window structures; the LED lamp panel further comprises a second reflective layer filled between the first reflective layer and the LED chips, and the reflectivity of the second reflective layer is greater than that of the first reflective layer. The LED lamp panel provided by the present disclosure is beneficial for die bonding and has a high lighting effect, an improved process yield, and a low manufacturing cost.

Provided are a photosensitive composition containing a coloring material precursor which colors black by a stimulus; and a transfer film, a laminate, a manufacturing method of the laminate, and a micro LED display, each of which uses the photosensitive composition.

A light-emitting substrate has a display region and a peripheral region located on at least one side of the display region, the peripheral region includes a first peripheral region, and the first peripheral region and the display region are spaced apart in a first direction. The light-emitting substrate includes: a substrate; a first conductive layer disposed on the substrate, the first conductive layer including a plurality of signal lines located in the display region; an insulating layer covering the plurality of signal lines; and a second conductive layer disposed on the insulating layer. The insulating layer includes a first insulating layer and a second insulating layer sequentially stacked in a direction away from the substrate; and at least between the first peripheral region and the display region, at least part of edges of the first insulating layer exceeds an edge of the second insulating layer.

A light-emitting substrate has a display region and a peripheral region located on at least one side of the display region, the peripheral region includes a first peripheral region, and the first peripheral region and the display region are spaced apart in a first direction. The light-emitting substrate includes: a substrate; a first conductive layer disposed on the substrate, the first conductive layer including a plurality of signal lines located in the display region; an insulating layer covering the plurality of signal lines; and a second conductive layer disposed on the insulating layer. The insulating layer includes a first insulating layer and a second insulating layer sequentially stacked in a direction away from the substrate; and at least between the first peripheral region and the display region, at least part of edges of the first insulating layer exceeds an edge of the second insulating layer.