A surface radiator includes a light-emitting semiconductor component and a housing body. The housing body has a cooling channel forming part of a fluid path from an inlet opening to a return opening. A transparent emission window overlies the light-emitting semiconductor component. The housing body provides an attachment surface spaced apart from the emission window for the light-emitting semiconductor component. The arrangement of the emission window on the housing body is formed in a fluid-tight manner. The housing body, the semiconductor component and the emission window delimit an emission chamber. The fluid path is defined by a first cooling channel, which extends from the inlet opening through the housing body to an orifice opening, the emission chamber, and a second cooling channel, which extends from the discharge opening through the housing body to the return opening. The coolant is an electrically insulating liquid, which is transparent for the incident radiation.

A surface radiator includes a light-emitting semiconductor component and a housing body. The housing body has a cooling channel forming part of a fluid path from an inlet opening to a return opening. A transparent emission window overlies the light-emitting semiconductor component. The housing body provides an attachment surface spaced apart from the emission window for the light-emitting semiconductor component. The arrangement of the emission window on the housing body is formed in a fluid-tight manner. The housing body, the semiconductor component and the emission window delimit an emission chamber. The fluid path is defined by a first cooling channel, which extends from the inlet opening through the housing body to an orifice opening, the emission chamber, and a second cooling channel, which extends from the discharge opening through the housing body to the return opening. The coolant is an electrically insulating liquid, which is transparent for the incident radiation.

A semiconductor module according to the present disclosure includes a substrate, at least one semiconductor element located on the substrate, and a heat dissipation member located above the at least one semiconductor element. In the semiconductor module according to one aspect of the present disclosure, a position of the at least one semiconductor element is shifted from a center of the substrate in a plan view of the substrate.

A semiconductor module according to the present disclosure includes a substrate, at least one semiconductor element located on the substrate, and a heat dissipation member located above the at least one semiconductor element. In the semiconductor module according to one aspect of the present disclosure, a position of the at least one semiconductor element is shifted from a center of the substrate in a plan view of the substrate.

The micro LED array electronic device suggested in one example of the present invention is a micro LED array comprising a plurality of light emitting devices arranged in columns and rows, which comprises two electrodes formed extending in one direction on a substrate; and cured polymers that fill the gap between the electrodes and vertically spaced electronic devices and comprises ferromagnetic particles, wherein the gap between the plurality of electronic devices is 5 m or more and 100 m or less.

The micro LED array electronic device suggested in one example of the present invention is a micro LED array comprising a plurality of light emitting devices arranged in columns and rows, which comprises two electrodes formed extending in one direction on a substrate; and cured polymers that fill the gap between the electrodes and vertically spaced electronic devices and comprises ferromagnetic particles, wherein the gap between the plurality of electronic devices is 5 m or more and 100 m or less.

A light-emitting substrate and a manufacturing method thereof are disclosed. In the embodiment of the present disclosure, by providing a groove on a base plate in the manufacturing method of the light-emitting substrate, the accuracy of coating the solder resist ink layer can be improved so as to reduce a distance between the solder resist ink layer and the pad assembly and avoid poor soldering or soldering failure caused by the overflow of the solder resist ink onto the pad.

A light-emitting substrate and a manufacturing method thereof are disclosed. In the embodiment of the present disclosure, by providing a groove on a base plate in the manufacturing method of the light-emitting substrate, the accuracy of coating the solder resist ink layer can be improved so as to reduce a distance between the solder resist ink layer and the pad assembly and avoid poor soldering or soldering failure caused by the overflow of the solder resist ink onto the pad.

A light-emitting module includes: a substrate; plurality of light sources disposed on the substrate, the plurality of light sources including a red light source, a green light source, a blue light source, and an infrared light source; at least one light-receiving element disposed on the substrate; and a lens disposed facing the plurality of light sources and the at least one light-receiving element. The red light source includes: a first light-emitting element configured to emit blue light, and a first phosphor configured to convert a wavelength of at least part of the blue light emitted from the first light-emitting element to emit red light. The at least one light-receiving element is configured to output biological photodetection information obtained by receiving light that has been emitted from at least one of the plurality of light sources and reflected or scattered by a biological body.

A light-emitting module includes: a substrate; plurality of light sources disposed on the substrate, the plurality of light sources including a red light source, a green light source, a blue light source, and an infrared light source; at least one light-receiving element disposed on the substrate; and a lens disposed facing the plurality of light sources and the at least one light-receiving element. The red light source includes: a first light-emitting element configured to emit blue light, and a first phosphor configured to convert a wavelength of at least part of the blue light emitted from the first light-emitting element to emit red light. The at least one light-receiving element is configured to output biological photodetection information obtained by receiving light that has been emitted from at least one of the plurality of light sources and reflected or scattered by a biological body.