Provided are a display panel and a display device. The display panel includes isolation columns and a partition insulating layer. The partition insulating layer is disposed on at least one of a first side surface of the isolation column facing a hole region or a second side surface of the isolation column facing away from the hole region.

A Micro-LED display chip and a method for manufacturing the same are provided according to the present application. The method includes: providing a driving substrate; providing a first LED layer; bonding the first LED layer to the driving substrate, where the first LED units and a first conductive column are electrically connected to contacts respectively; disposing a second LED layer on the first LED layer, where the second LED layer consists of multiple second LED units and a second filling structure located between the second LED units, the second LED units are electrically connected to the first conductive column directly below them, and the second LED units emit light of a different color from that of the first LED units. This facilitates reducing the process difficulty in manufacturing the multicolor Micro-LED display chips.

A micro LED panel having a micro LED array and the system and method to manufacture the micro LED panel are provided. The micro LED array includes at least one micro LED structure. The micro LED structure at least includes: a mesa structure and a re-growth layer (04). The re-growth layer (04) is grown on at least part of the sidewall of the first type epitaxial layer (01) and on the whole sidewall of the light emitting layer (03), thereby decreasing the non-radiation recombination on the sidewall of the mesa structure and improving the light emitting efficiency.

Disclosed are a display substrate, driving method and a display device. The display substrate includes: a substrate base including a first display area and a second display area; the plurality of light-emitting devices include a plurality of first light-emitting devices in the first display area and a plurality of second light-emitting devices in the second display area, and the density of the plurality of first light-emitting devices in the first display area is less than or equal to that of the plurality of second light-emitting devices in the second display area; and the plurality of ambient sensors are in the first display area and below at least part of the first light-emitting devices, and the orthographic projections of the ambient sensor on the substrate base covers and is greater than the orthographic projections of the corresponding first light-emitting devices on the substrate base.

A display substrate, including a first substrate and a backplane arranged in a sequentially laminated manner, and a light-emitting layer, where the light-emitting layer includes a binding pads and a light-emitting elements arranged one-to-one corresponding to each other, where the binding pad is arranged on a side of the backplane away from the first substrate, and a pin of the light-emitting element is electrically connected to the binding pad, where the binding pad includes a first region and a second region, the orthographic projection of the first region on the backplane is covered by the orthographic projection of the light-emitting element on the backplane, and the orthographic projection of the second region on the backplane is arranged on the outer side of the orthographic projection of the light-emitting element on the backplane.

A splicing display device is provided. The splicing display device includes at least two first display units and a second display unit. The first display units are spliced and connected. Each of the first display units includes a non-display area. The second display unit is disposed on a light-emitting side of the first display units, and attached and fixed to a splicing position of the non-display areas of the two adjacent first display units.

A driving backplane includes a substrate, a plurality of pad groups, and a plurality of marks. The plurality of pad groups and the plurality of marks are located on a same side of the substrate, a pad group includes at least one pad, and orthogonal projections of the plurality of marks on the substrate and orthogonal projections of the plurality of pad groups on the substrate have no overlap. The pad group corresponds to at least one mark. An orthogonal projection of the at least one mark on the substrate is located on a circumference of an orthogonal projection of a corresponding area of the pad group on the substrate, is adjacent to an orthogonal projection of the pad group on the substrate, and has a first gap from the orthogonal projection of the pad group on the substrate.

The invention relates a transfer process for micro elements, including at least one picking step wherein at least one micro element is picked up from at least one donor surface by at least one transfer surface and at least one placing step wherein at least one micro element is placed upon at least one receiving surface from at least one transfer surface, wherein the process according to the invention enables that at least the picking step benefits of several flexible parameters.

A light-emitting substrate has a display region and a peripheral region located on at least one side of the display region, the peripheral region includes a first peripheral region, and the first peripheral region and the display region are spaced apart in a first direction. The light-emitting substrate includes: a substrate; a first conductive layer disposed on the substrate, the first conductive layer including a plurality of signal lines located in the display region; an insulating layer covering the plurality of signal lines; and a second conductive layer disposed on the insulating layer. The insulating layer includes a first insulating layer and a second insulating layer sequentially stacked in a direction away from the substrate; and at least between the first peripheral region and the display region, at least part of edges of the first insulating layer exceeds an edge of the second insulating layer.

A wiring substrate, an electronic element and an electronic apparatus is provided according to the disclosure, the wiring substrate includes: a base substrate; connection lines located on the substrate, wherein at least two connection lines are configured to transmit different signals; a plurality of pads, wherein any two pads are distributed at intervals, and the pads include first pads; a first pad group composed of at least three first pads; wherein the connection lines include a first type of connection line, which includes a plurality of branch portions, different branch portions are connected with different first pads, and any two branch portions are arranged at intervals.