A MicroLED display panel includes a plurality of display structures, where each display structure includes a first electrode, a second electrode, a first semiconductor layer, a second semiconductor layer, and a light emitting layer; first electrodes, first semiconductor layers, and light emitting layers of adjacent display structures are independent of each other; the first semiconductor layer and the second semiconductor layer are respectively located on surfaces of two sides of the light emitting layer; the first electrode is located on a side that is of the first semiconductor layer and that is away from the light emitting layer, and the second electrode is located on a side that is of the second semiconductor layer and that is away from the light emitting layer; the light emitting layer of each display structure corresponds to one pixel region; and the second electrode is routed around each pixel region.

An operating element includes a carrier element, a luminous foil in or on which at least one optoelectronic component for generating light along a first main radiation direction and contact lines connected thereto are arranged, a diffuser layer arranged after the at least one optoelectronic component with respect to the first main radiation direction, a structured symbol element which is not arranged in front of the diffuser layer with respect to the first main radiation direction and configured to image at least one symbol along the first main radiation direction in a top view onto the diffuser layer and during operation of the at least one optoelectronic component, a touch-sensitive sensor configured to detect an exerted touch or pressure and to generate an electrical signal, and at least one reflective layer configured to reflect light scattered in the opposite direction to the main radiation direction in the main radiation direction.

A display device is provided. The display device includes a substrate having a pixel electrode, a light emitting element on the pixel electrode, and a connection electrode layer including a plurality of connection electrodes between the pixel electrode and the light emitting element, the plurality of connection electrodes being spaced from each other.

A light-emitting element, a light-emitting device and a display device are provided, which relate to the technical filed of semiconductor devices. The light-emitting element is a flip-chip light-emitting diode, and has a light-emitting surface and a backlight surface respectively located on outermost sides of the flip-chip light-emitting diode and opposite to each other; the flip-chip light-emitting diode includes an epitaxial staked layer configured to generate predetermined light; and a light-splitting layer disposed on a side of the epitaxial stacked layer proximate to the light-emitting surface; the light-splitting layer is configured to reflect predetermined light with an incident complementary angle of a first angle, transmit predetermined light with an incident complementary angle of a second angle, and reflect predetermined light with an incident complementary angle of a third angle; and the first angle is smaller than the second angle, and the second angle is smaller than the third angle.

A method of manufacturing an optoelectronic device including the steps of manufacturing of the display pixel circuits, each comprising an emission surface, and on the surface, walls delimiting at least one cavity, of bonding of the display pixel circuits to a support, and of filling of the at least one cavity of each display pixel circuit with a first filling material to form a first color conversion module in the cavity.

A micro-LED display panel includes a micro-LED display chip including a micro-LED array area and an IC (integrated circuit) backplane, wherein the micro-LED array area is provided on the IC backplane; an image light rotating element including a transmission lens assembly provided above the micro-LED display chip and including a transmission lens over the micro-LED array area; and a lens position rotating actuator configured to rotate the transmission lens about at least one preset axis, wherein the at least one preset axis is parallel to the micro-LED array area; and a holder provided on the micro-LED display chip and configured to support the transmission lens assembly.

A light-emitting device includes a support; a first electrically-conductive part, a second electrically-conductive part, and a third electrically-conductive part disposed apart from one another on the support; a first light-emitting element disposed on the first electrically-conductive part; and an integrated circuit electrically connected to the first light-emitting element. At least a portion of the first electrically-conductive part is located between the second electrically-conductive part and the third electrically-conductive part in a first direction. The integrated circuit and the first light-emitting element are arranged side by side in a second direction orthogonal to the first direction. A maximum length of the integrated circuit in the second direction is smaller than a maximum length of the integrated circuit in the first direction.

An embodiment relates to a method for forming by defocused lithography a stack including a photosensitive layer based on a photosensitive resin having scattering particles. The stack further includes at least one pattern defined at least partly by a curved lateral wall so that an intersection of the curved wall with a plane substantially perpendicular to the plane of main extension of the stack forms a curved line. An embodiment also relates to the creation of an optoelectronic device including the stack, wherein the at least one pattern is at least one cavity at least partly defined by the curved lateral wall, and at least one light-emitting diode disposed in the at least one cavity.

A method for manufacturing a light-emitting device includes: preparing an intermediate body including: a substrate, and a plurality of light-emitting elements disposed on the substrate, each including a first surface serving as a light extraction surface, a second surface opposite to the first surface, and a lateral surface connecting the first surface and the second surface; applying a powder composition including a reflective member and a silicone resin powder from above the first surfaces of the plurality of light-emitting elements through a sieve to locate the powder composition on the substrate and between the lateral surfaces of the plurality of light-emitting elements; and forming a first covering member by applying vibration to the powder composition and subsequently applying pressure in a thickness direction of the substrate to perform compression molding.

A stretchable display device includes a base substrate having a rigid portion and a soft portion; a stretchable line in the soft portion over the base substrate; a first electrode and a second electrode in the rigid portion over the base substrate; and a light-emitting element contacting the first electrode and the second electrode, wherein the first electrode and the second electrode have a plurality of first protrusions and a plurality of second protrusions, and the light-emitting element is in contact with the plurality of first protrusions and the plurality of second protrusions.