An image display device manufacturing method includes: providing a first substrate that includes: a circuit including a circuit element formed on a light-transmitting substrate, and a first insulating film covering the circuit; forming, on the first insulating film, a conductive layer including a portion made of a single crystal metal; forming, on the portion made of the single crystal metal, a semiconductor layer including a light-emitting layer; etching the semiconductor layer to form a light-emitting element; forming a second insulating film covering the conductive layer, the light-emitting element, and the first insulating film; forming a via passing through the first insulating film and the second insulating film; and electrically connecting the light-emitting element and the circuit element through the via at a light-emitting surface facing a surface of the light-emitting element on a first insulating film side.

A display apparatus includes a substrate, a light-emitting diode disposed on the substrate and including an emission layer, a bank layer disposed on the substrate and defining an opening overlapping the emission layer of the light-emitting diode, a first refractive layer disposed in the opening of the bank layer, and a second refractive layer disposed on the first refractive layer, where the first refractive layer includes a concave top surface and the second refractive layer includes a convex bottom surface and a convex top surface.

A display device and an electronic device including the same are provided. The display device includes a substrate, a light-emitting element layer disposed on the substrate and emitting light, an encapsulation layer disposed on the light-emitting element layer, a touch sensing layer disposed on the encapsulation layer, a color filter layer disposed on the touch sensing layer, and an overcoat layer disposed on the color filter layer, wherein the overcoat layer includes organic films and inorganic films alternately stacked on one another, and wherein the organic films are disposed at a bottom and a top of the overcoat layer, respectively.

A light bead, a light plate, and a display device are disclosed. The light bead includes a light bead main body, a buffer portion, and a mating portion. The light bead main body includes a first end and a second end that are spaced apart from each other. The first end is the end of the light bead main body adjacent to a light-emitting side. The second end is the end of the light bead main body opposite to the light-emitting side. The buffer portion is arranged on the first end of the light bead main body and fits around the first end of the light bead main body. The mating portion is arranged on the second end of the light bead main body and is configured to mate with the light plate to install the light bead onto the light plate.

A display module includes: a substrate, a first dielectric layer, a second dielectric layer and a plurality of color filters. The substrate is disposed with a plurality of light-emitting diodes (LEDs) thereon. The LEDs have a non-smooth upper surface. The first dielectric layer is located on the substrate and surrounding the LEDs. The first dielectric layer is filled between the substrate and the second dielectric layer, and a refractive index of the second dielectric layer is greater than a refractive index of the first dielectric layer. The color filters are located on a side of the second dielectric layer opposite to the first dielectric layer.

A display device includes a circuit substrate, a pixel definition layer, a light-emitting chip, and an underfill layer. The pixel definition layer is disposed on the circuit substrate and includes an aperture. The light-emitting chip is disposed in the aperture and electrically connected to the circuit substrate. The light-emitting chip includes a light-emitting diode, a filling layer, and a reflective layer. The filling layer surrounds the light-emitting diode. The reflective layer is disposed on a side surface of the filling layer. The underfill layer is disposed between the light-emitting chip and the pixel definition layer.

An electronic device includes a pixel defining film defining a plurality of emission areas and a non-emission area, a plurality of light emitting elements which are disposed in the emission areas, respectively, and emit source light, and an optical layer disposed on the light emitting elements. The light emitting elements each include a first electrode, a first emission layer generating first light of a blue color, a second emission layer generating second light of a green color, a third emission layer generating third light of the blue color, a fourth emission layer generating fourth light of the blue color, a charge generation layer, and a second electrode. The pixel defining film includes a pigment having a black color, and a distance between the first and second electrodes is less than a resonance distance of green light.

An anti-reflective layer includes a light blocking pattern including a first opening overlapping a first light emitting element, a second opening overlapping a second light emitting element, and a third opening overlapping a third light emitting element, a first color filter overlapping the first opening, a second color filter overlapping the second opening, a third color filter overlapping the third opening, a first sub-pattern overlapping a portion of the second color filter and a portion of the third color filter, the first sub-pattern and the first color filter including a same material, a second sub-pattern overlapping the first light emitting element in a plan view, the second sub-pattern and the second color filter including a same material, and an overcoat layer covering the first, second, and third color filters and the second sub-pattern.

An electronic device including a substrate, an insulation layer, a first organic portion, a shielding structure, and a first optical unit is provided. The insulation layer is disposed on the substrate and includes a first opening. The first organic portion is disposed in the first opening of the insulation layer. The shielding structure is disposed on the insulation layer and includes a retaining wall and a first opening. The first optical unit is disposed in the first opening of the shielding structure. The retaining wall of the shielding structure overlaps with the first opening of the insulation layer.

A display device includes a first substrate, a second substrate opposite to the first substrate, a light-emitting element layer on the first substrate and including at least one light-emitting element, an encapsulation layer on the light-emitting element layer and including at least one inorganic encapsulation layer and at least one organic encapsulation layer, a functional layer on the encapsulation layer and including at least one of quantum dots or scattering particles, a color filter layer on a surface of the second substrate facing the first substrate, a lens layer on a surface of the color filter layer facing the functional layer and corresponding to the at least one light-emitting element, and a low-refractive layer between the color filter layer and the lens layer on the second substrate and the functional layer on the first substrate.