A wiring substrate, an electronic element and an electronic apparatus is provided according to the disclosure, the wiring substrate includes: a base substrate; connection lines located on the substrate, wherein at least two connection lines are configured to transmit different signals; a plurality of pads, wherein any two pads are distributed at intervals, and the pads include first pads; a first pad group composed of at least three first pads; wherein the connection lines include a first type of connection line, which includes a plurality of branch portions, different branch portions are connected with different first pads, and any two branch portions are arranged at intervals.

A light-emitting device and a display apparatus. The light-emitting device extracts, by means of a light extraction member, light emitted from a side surface (a second light-emitting surface) of a semiconductor light source; the light from the side surface is collected to a top part to be emitted to a wavelength conversion member together with light from a first light-emitting surface; white light is emitted from a top part (a second abutting surface of the wavelength conversion member; and after passing through a light-transmitting layer, the white light is emitted from a top part of the light-transmitting layer that is in the thickness direction thereof and is provided with a light inhibition layer, and the white light from the top part is partially inhibited by the light inhibition layer.

Disclosed are an integrated LED packaging structure and a packaging method, and relates to the technical field of LED packaging. The disclosure includes a shell, a bottom end of the shell is fixedly connected to a pin platform, a top end of the shell is fixedly connected to an LED plug, three lamp beads are fixedly mounted at a top end of the LED plug, a bottom end of the pin platform is fixedly connected to a cup cavity, and a bottom end of the cup cavity is fixedly connected to connecting pins. The top end of the LED plug is provided with LED sockets in positions corresponding to the lamp beads, and bottom ends of inner sides of the LED sockets are fixedly connected to insulating plates. Furthermore, a combination of an in-line and SMD form is adopted, and the lower half part adopts an SMD structure.

An LED carrier plate, comprising a carrier plate front side and a carrier plate back side, wherein a plurality of through holes penetrate the carrier plate front side and the carrier plate back side, and the plurality of through holes at least comprise two rows of through holes; at least every three through holes enclose one island-shaped carrier plate region on the carrier plate front side; and at least two electrode pins are arranged in the island-shaped carrier plate region, and are configured to be connected to an LED arranged on the carrier plate front side. In addition, further disclosed is an LED display device using the LED carrier plate. The carrier plate and the LED display device can achieve both light transmission and LED display/lighting effects.

This application provides a pixel unit, a manufacturing method therefor, a microdisplay, and a pixel-level discrete device. The pixel unit includes a backplane and a display unit. The display unit is arranged on the backplane, and includes a first device layer and a second device layer. The first device layer includes a first compound light-emitting layer and a second compound light-emitting layer. The second device layer includes a color conversion layer and a third compound light-emitting layer. The color conversion layer is arranged above the first compound light-emitting layer. The color conversion layer is arranged, so that the compound light-emitting layer can implement color development through color conversion, to reduce power and improve performance. The pixel unit occupies less space in the horizontal direction. A decrease in external quantum efficiency caused by a size effect is effectively reduced, power consumption is effectively reduced, and performance such as brightness is improved.

In an embodiment a display unit includes a first contact layer, a second contact layer, a plurality of connection region and a plurality of optoelectronic semiconductor components, wherein the first contact layer has a plurality of row lines at a row spacing from one another, wherein the second contact layer has a plurality of column lines at a column spacing from one another, wherein the first contact layer and the second contact layer are arranged stacked, wherein each of the connection regions electrically conductively connects at least one row line to at least one column line, and wherein the row spacing deviates by less than 50% from the column spacing.

A micro light-emitting element includes a substrate and at least one micro light-emitting diode. Each micro light-emitting diode includes a semiconductor epitaxial stacked layer, which includes a first-type semiconductor layer, an active layer and a second-type semiconductor layer, and comprises a first surface and a second surface; the first surface is located on a side near the first-type semiconductor layer, the second surface is located on a side near the second-type semiconductor layer, and the first surface faces towards the substrate; and an adhesive film layer, which is located between the substrate and the semiconductor epitaxial stacked layer. An etching protective layer is disposed between the adhesive film layer and the first surface. The micro light-emitting element can reduce damage to the semiconductor epitaxial stacked layer during a residual adhesive removing process after laser lifting-off of each micro light-emitting diode, thus improving reliability of the micro light-emitting element.

This application provides a display panel and an electronic device. The display panel includes a drive backplane, a filling layer, and a plurality of pixel structures. The filling layer is fastened to the drive backplane. The plurality of pixel structures are fastened to the drive backplane at intervals and are embedded in the filling layer. The drive backplane is configured to drive the plurality of pixel structures to emit light. The filling layer includes an insulation layer and a light shielding layer. The insulation layer includes a bottom wall and a side wall. The bottom wall of the insulation layer and the side wall of the insulation layer form first accommodation space. The bottom wall of the insulation layer is fastened to the drive backplane. The side wall of the insulation layer is fastened to a side surface of the pixel structure.

A surface radiator includes a light-emitting semiconductor component and a housing body. The housing body has a cooling channel forming part of a fluid path from an inlet opening to a return opening. A transparent emission window overlies the light-emitting semiconductor component. The housing body provides an attachment surface spaced apart from the emission window for the light-emitting semiconductor component. The arrangement of the emission window on the housing body is formed in a fluid-tight manner. The housing body, the semiconductor component and the emission window delimit an emission chamber. The fluid path is defined by a first cooling channel, which extends from the inlet opening through the housing body to an orifice opening, the emission chamber, and a second cooling channel, which extends from the discharge opening through the housing body to the return opening. The coolant is an electrically insulating liquid, which is transparent for the incident radiation.

A semiconductor module according to the present disclosure includes a substrate, at least one semiconductor element located on the substrate, and a heat dissipation member located above the at least one semiconductor element. In the semiconductor module according to one aspect of the present disclosure, a position of the at least one semiconductor element is shifted from a center of the substrate in a plan view of the substrate.