Patent classifications
H10H29/857
INORGANIC LIGHT-EMITTING DIODE, LIGHT-EMITTING PANEL AND BACKLIGHT MODULE
A light-emitting panel includes at least one light-emitting control region. In any one of the at least one light-emitting control region, the light-emitting panel includes inorganic light-emitting diodes distributed in an array and includes at least one first line extending along a first direction and at least one second line extending along a second direction. One of the inorganic light-emitting diodes has a plurality of first pins and a second pin. A first pin of one of two inorganic light-emitting diodes adjacent along the first direction is electrically connected to an adjacent first pin of the other one of the two inorganic light-emitting diodes through a corresponding first line, the second pin of one of the inorganic light-emitting diodes is electrically connected to a corresponding second line.
LIGHT EMITTING DIODE DEVICES WITH EXTENDED JUNCTION SPACERS
Described are light emitting diode (LED) arrays (100) comprising a plurality of mesas (101a, b) defining pixels having sidewalls, each of the mesas comprising semiconductor layers (108) having a total thickness (11), the semiconductor layers including an n-type layer (104n), an active region (106), and a p-type layer (104p). A plurality of junction spacers (118) comprise a dielectric material conformal to a portion of the sidewalls, and span a longitudinal distance of greater than or equal to 20% of the thickness (t1) of the semiconductor layers. A plurality of cathodes comprising an n-contact material (114) between each of the mesas provide optical isolation therebetween, and electrically contact an uninsulated portion (105) of the n-type layer of each of the mesas along the sidewalls, the uninsulated portion of the n-type layer comprising a doped N-type material (104n-d-1). A surface (120) of the doped N-type material of the uninsulated portion of the n-layer is effective to provide an active metal-semiconductor contact.
APPARATUS FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
An apparatus for manufacturing a display device includes a transfer device that transfers a plurality of light emitting devices to a display panel and a light receiving unit that detects light emitted from the plurality of light emitting devices. In addition, a method for manufacturing a display device includes contacting a stamp of a transfer device with the light emitting device and inspecting whether the light emitting device normally emits light, in a state in which the stamp and the light emitting device are in contact with each other.
LIGHT SOURCE AND WIRING SUBSTRATE
A light source including: a wiring substrate including a conductor layer and a first insulating layer arranged on an upper surface of the conductor layer; and first and second light-emitting devices arranged on an upper surface of the wiring substrate. The wiring substrate includes first, second, third, and fourth wiring lines arranged on the first insulating layer. The third and fourth wiring lines are electrically connected to the conductor layer. The first light-emitting device includes a first anode and a first cathode. The second light-emitting device includes a second anode and a second cathode. The first anode is electrically connected to the first wiring line. The first cathode and the second anode are electrically connected to the second wiring line. The second cathode is electrically connected to the third wiring line.
Method of repairing light emitting device and display panel having repaired light emitting device
A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and a surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.
Light emitting module and display device
A light emitting module includes: a light emitting element array provided on a first substrate, including a plurality of light emitting elements arranged in an array in a row direction and a column direction, each of which includes a first electrode and a second electrode, wherein a driving current of the light emitting element is greater than or equal to 1 mA; and a plurality of row driving chips and a plurality of column driving chips provided on the first substrate. At least one row driving chip and at least one column driving chip are spaced apart in the row direction and the column direction. At least one row driving chip and at least one column driving chip are respectively electrically connected to the first electrodes of at least one row of light emitting elements and the second electrodes of at least one column of light emitting elements.
MICROLED ARRAY WITH INTEGRATED PHOTODETECTORS
Devices and methods for analyzing polymer arrays formed on integrated surfaces of microLEDs. One microarray includes a plurality of individually controllable microLED elements, a plurality of photodetector elements, an integrated surface, and a CMOS driver chip. Each microLED element is paired with a photodetector element. The CMOS driver chip controls activation of the microLED elements and the photodetector elements.
LENS STRUCTURES IN LIGHT-EMITTING DIODE PACKAGES
Light-emitting diode (LED) devices and more particularly lens structures in LED packages are disclosed. Lens structures include complex shapes for achieving various emission patterns in LED packages. Complex lens shapes include lens widths that are greater than corresponding widths of support elements, including lead frame structures or submount structures. Complex lens shapes further include inward depressions positioned relative to underlying LED chips for directing peak emission intensities off center relative to LED packages. Exemplary LED packages further include encapsulant layers positioned between lenses and underlying LED chips for providing one or more of improved surfaces for lens formation and improved adhesion.
LIGHT EMITTING DEVICE
Provided is a light emitting device including: a substrate unit that includes a light emitting substrate; a plurality of first light emitters that are arranged in a first direction on the light emitting substrate to generate light; and a plurality of second light emitters that are arranged in the first direction on the light emitting substrate to generate the light. The plurality of first light emitters and the plurality of second light emitters are disposed in a second direction perpendicular to the first direction, and a size of each of the plurality of first light emitters is larger than a size of each of the plurality of second light emitters in a plan view.
WEARABLE PHOTOTHERAPY DEVICE
Embodiments of the present invention provide a wearable phototherapy device, comprising a flexible substrate supporting a plurality of light-emitting elements configured to emit therapeutic light of one or more wavelengths. The substrate conforms to a treatment surface and may be integrated into a mask, wrap, patch, or garment insert. A conductive thin-film layer with an integrated metal-grid structure limits current to the light-emitting elements. The elements are arranged in one or more treatment zones, each independently addressable to provide wavelength and intensity control. A connector assembly enables selective attachment and detachment of the substrate to a power and control module. The device provides uniform, targeted illumination for dermatological, cosmetic, or therapeutic applications while maintaining ergonomic comfort.