A light-emitting element, and a light-emitting component and its manufacturing method, belonging to field of semiconductor manufacturing technologies, are provided. The light-emitting element includes at least two light-emitting units adjacent to one another, and a bridging conductive bridge bridged between adjacent light-emitting units to make the adjacent light-emitting units be connected in series. The light-emitting unit includes an epitaxial structure and a dielectric layer. The epitaxial structure includes first and second surfaces. The light-emitting units connected in series are defined with a trench therebetween penetrating from the first surface to the second surface. The second surface is formed with multiple removal areas. The dielectric layer covers the second surfaces of the light-emitting units connected in series and extends across the trench. The bridging conductive bridge is on a side of the dielectric layer facing away from the epitaxial structure and electrically connected to the epitaxial structure through the removal area.

The present invention relates to a vertically-laminated microdisplay panel requiring no color filter, the panel comprising: a back wafer, the top surface of which has multiple CMOS electrode pads aligned thereon; multiple LED laminates, each of which includes multiple light emitting units and multiple bonding layers vertically laminated on the back wafer, and which are aligned on the multiple CMOS electrode pads, respectively; and a common electrode formed on the multiple LED laminates, wherein each of the multiple LED laminates emits only a particular color by having a short passage formed through at least one light emitting unit among the multiple light emitting units to bypass current so as to prevent the current from being injected into the light emitting unit.

An optical interconnect may include an optoelectronic IC mounted to a substrate. The optoelectronic IC may have optoelectronic devices, for example microLEDs and/or photodetectors, mounted to a surface of the optoelectronic IC away from the substrate. The optoelectronic IC may have circuitry for driving the microLEDs and/or processing electrical signals from the photodetectors. The optoelectronic IC may be interfaced to a D2D interface chip. The D2D interface chip may be mounted to the optoelectronic IC.

A display device, a light emitting element, and a manufacturing method of the display device are provided. The display device includes: a substrate on which a pixel electrode is located; a light emitting element on the pixel electrode and including an element rod and a contact electrode on one surface and a side surface of the element rod; a connection electrode electrically connecting the contact electrode and the pixel electrode; and a common electrode on the light emitting element, wherein the element rod includes: a first element rod including a first semiconductor layer and an active layer and having a side surface having a first inclination angle; a second element rod on the first element rod and having a side surface having a second inclination angle; and a third element rod on the second element rod and having a side surface having a third inclination angle.

A multi-chip package may include a system-on-chip (SoC) and an optical IO subassembly on a common substrate. The SoC and the optical IO subassembly may be linked by a die-to-die interface. The optical IO subassembly may include an optical IO IC with microLEDs and/or photodetectors bonded to a surface of the optical IO IC away from the common substrate. An optical window layer may shield optical elements of the optical IO subassembly from damage relating to molding compound related operations during assembly.

A lighting device disclosed in an embodiment of the invention includes a heat dissipation plate having a recess portion; a circuit board accommodated in the recess portion of the heat dissipation plate and having pads; a light source portion having bonding pads; connection members respectively connecting between the pads and the bonding pads; and an adhesive member that adheres the light source portion to the heat dissipation plate. The light source portion includes a support member; light emitting devices having light emitting chips and a wavelength conversion layer; and a resin member. Each of the connection members has a ribbon shape, and a width of each of the connection members is more than twice the thickness of each of the connection members, and each of the connection members may include two ends respectively connected to the bonding pads and the pads, and a center portion extending convexly between the two ends.

A display device includes a pixel including a first subpixel, wherein the first subpixel includes: a first pixel electrode, and a first light emitting element and a second light emitting element on the first pixel electrode, each of the first light emitting element and the second light emitting element including a body portion and a bonding electrode at a first surface of the body portion, the body portion includes a first semiconductor layer, an active layer, and a second semiconductor layer, wherein at least one of the first light emitting element or the second light emitting element is disposed at an angle on the first pixel electrode.

A placement member includes a first surface; a plurality of electrode members arranged on the first surface, and including a first electrode member and a second electrode member that are spaced apart from each other; and a plurality of identification marks configured to identify a reference line for alignment, and including a first identification mark provided on a first electrode member side of the placement member and a second identification mark provided on a second electrode member side of the placement member, the first identification mark and the second identification mark being configured to aid in distinguishing between the first electrode and the second electrode, wherein a shape of the first identification mark and a shape of the second identification mark are different from each other.

A light-emitting element includes: a substrate; a conductive member disposed on the substrate; a first insulating layer disposed on the conductive member; a semiconductor structure including a first light-emitting unit and a second light-emitting unit that are spaced apart from each other on the first insulating layer; a first wiring electrically connected to a first semiconductor layer of the first light-emitting unit; a second wiring electrically connected to a second semiconductor layer of the first light-emitting unit and the first semiconductor layer of the second light-emitting unit; a third wiring electrically connected to the second semiconductor layer of the second light-emitting unit; a first pad electrode separated from the semiconductor structure in a plan view and electrically connected to the first wiring; and a second pad electrode separated from the semiconductor structure in a plan view and electrically connected to the third wiring.

A circuit board includes a base having a plurality of interconnections on an upper surface thereof, a first photosensitive solder resist (PSR) covering the interconnections and defining a pad open region exposing portions of the interconnections, a second PSR covering the first PSR and having an opening exposing the pad open region. The opening of the second PSR is larger than the pad open region of the first PSR.