Devices and methods for a microLED array and a bonded CMOS driver chip. An example array includes a plurality of microLEDs having backside contacts, a plurality of through-substrate vias, a CMOS driver chip bonded to the backside contacts of the microLEDs, and an encapsulating layer forming an integrated surface of the array. At least one through-substrate via is paired with each microLED. Each through-substrate via electrically connects the paired microLED to the CMOS driver chip.

A display device includes a substrate including a display area and a non-display area. A pad portion is disposed in the non-display area and includes a pad area in which a pad is disposed and a non-pad area surrounding the pad area. First and second pattern layers partially overlap the pad and are spaced apart from each other. The first pattern layer may overlap a portion of the pad area and a portion of the non-pad area, and the second pattern layer may overlap a portion of the pad area and may include a center line of the pad. In a maximum height measured in a first direction that is perpendicular to an upper surface of the substrate from the upper surface thereof, a first height of the first pattern layer may be greater than a second height of the second pattern layer.

A manufacturing method of an electronic device includes providing a first substrate, wherein the first substrate includes a circuit layer; cutting the first substrate; forming a wire on a first surface which is exposed after cutting the first substrate and on a second surface of the first substrate, wherein the first surface is adjacent to the second surface, and the wire is electrically connected to the circuit layer; disposing an electronic element on the circuit layer; bonding the first substrate after cutting and a second substrate to form an electronic module; and disposing a driving element on the second surface of the first substrate to be electrically connected to the wire.

A display device comprises a plurality of first LEDs disposed in a first passivation layer. Each first LED has a first electrode disposed on the respective first LED and a second electrode that is electrically coupled to a control device. A contact of at least one second LED is directly bonded to the first electrode of at least one first LED. The second LED and the first electrode of the at least one first LED are disposed in a second passivation layer. An electrode of the second LED is electrically connected to a same control device that the second electrode of the at least one first LED is connected to.

A display apparatus includes a driving circuit substrate having pixel driving structures, light emitting element groups, a planarization layer, and a first light shielding layer. Each pixel driving structure includes sub-pixel driving structures. Each sub-pixel driving structure includes a sub-pixel driving circuit, at least one main pad, and at least one repair pad. The planarization layer is disposed on the driving circuit substrate. The first light shielding layer is disposed on the planarization layer. The pixel driving structures include a normal pixel driving structure. The light emitting element groups include a normal light emitting element group. The first light shielding layer includes a first solid portion shielding the at least one repair pad of the normal pixel driving structure and a first opening located above a first light emitting element of the normal light emitting element group. A manufacturing method of the display apparatus is also provided.

The disclosure provides a display panel and a display device. The display panel includes a base substrate; an active layer located on one side of the base substrate; multiple metal layers located on a side of the active layer away from the base substrate, the multiple metal layers including a first metal layer and a second metal layer, the first metal layer including a physical part and a plurality of openings, the second metal layer including a physical part and a plurality of openings; and a first shielding area, where at least a portion of the active layer is located in the first shielding area, and in a direction perpendicular to a plane where the base substrate is located, at least one of the physical part of the first metal layer and the physical part of the second metal layer covers the first shielding area.

The present disclosure relates to an apparatus for manufacturing a display panel in which it is possible to prevent light-emitting elements from remaining on a transfer member during a transfer process, thereby preventing damage to a donor member or a panel defect. To achieve this, in the apparatus for manufacturing a display panel, by allowing the light-emitting members that remain on the transfer member during the transfer process to be adhered to a maintenance wafer substrate, it is possible to remove the light-emitting elements that remain on the transfer member. Accordingly, by removing the light-emitting elements that remain on the transfer member during the transfer process, it is possible to prevent damage to the donor member or the panel defect.

A display module and a manufacturing method therefor are provided. The display module includes a substrate including a plurality of electrode pads, a first non-conductive adhesive member formed on a surface of the substrate and having a first curing temperature, a second non-conductive adhesive member formed on the first non-conductive adhesive member and having a second curing temperature, and a plurality of light emitting elements bonded to the plurality of electrode pads, wherein electrodes of the plurality of light emitting elements are respectively bonded to the plurality of electrode pads by sequentially passing through the second non-conductive adhesive member and the first non-conductive adhesive member, and wherein the second curing temperature is higher than the first curing temperature.