In an embodiment a display unit includes a first contact layer, a second contact layer, a plurality of connection region and a plurality of optoelectronic semiconductor components, wherein the first contact layer has a plurality of row lines at a row spacing from one another, wherein the second contact layer has a plurality of column lines at a column spacing from one another, wherein the first contact layer and the second contact layer are arranged stacked, wherein each of the connection regions electrically conductively connects at least one row line to at least one column line, and wherein the row spacing deviates by less than 50% from the column spacing.

The present relates to a micro LED display device and a method for manufacturing the micro LED display device, wherein micro LEDs and a drive substrate can be stably bonded without a reduction in light extraction efficiency. The micro LED display device a drive substrate having a first pad and a second pad that are connected to different potentials; and micro LEDs having a light-emitting structure in which an n-type semiconductor layer, an active layer, and a p-type semiconductor layer are stacked, an n-type pad electrically connecting the n-type semiconductor layer and the first pad, and a p-type pad electrically connecting the p-type semiconductor layer and the second pad. One of the n-type pad or the p-type pad may be provided on a side surface of the light-emitting substrate.

In an embodiment a method for producing an array of light emitting elements includes providing a growth substrate, applying a mask having a plurality of apertures to the growth substrate, growing structures into the apertures and processing at least some of the structures into light emitting elements, wherein adjacent apertures are arranged at a first distance to each other, wherein adjacent light emitting elements are arranged at a second distance to each other, wherein the second distance is greater than the first distance, wherein at least some of the structures are reduced in an area and the reduced structures are processed into light emitting elements, and wherein the structures are reduced in area by material removal.

Selective bonding integrates semiconductor devices onto a receiver substrate. A laser releases devices from a substrate according to a pattern. The pattern syncs laser frequency and speed/location of the stage with the receiver substrate, or uses a diffractive optical element and pottering, or masks the emitted laser to a desired size/shape. Laser steering employs digital micromirror devices or fast scanning mirrors followed by an f-theta lens. Sequential selective bonding and laser processing enables full-colour display by transferring violet or blue micro-LEDs and employing colour-conversion layers or sequentially patterning red, green, and blue sub-pixels. The same method transfers driving circuits onto a substrate. A pattern from defective devices is generated after test and used for repair. A second round prints micro-devices onto pads in or beside defective devices. Sidewalls coated with a reflective layer stops crosstalk between pixels, improves light-extraction efficiency, improves emission angle, and provides a uniform light pattern.

This specification discloses light emitting structures with light emitting devices, where the structures include a protective layer that blocks certain wavelengths of light from degrading particularly vulnerable elements of the light emitting structures. The protective layer may be a transparent UV blocking layer that prevents a substantial amount of UV light from reaching an adhesive layer that would otherwise yellow or degrade under UV exposure. The transparent UV blocking layer may be completely or largely transparent to visible light, so that a user of the light emitting structure can clearly view the visible light emitted or incident on the light emitting structures.

The micro LED array electronic device suggested in one example of the present invention is a micro LED array comprising a plurality of light emitting devices arranged in columns and rows, which comprises two electrodes formed extending in one direction on a substrate; and cured polymers that fill the gap between the electrodes and vertically spaced electronic devices and comprises ferromagnetic particles, wherein the gap between the plurality of electronic devices is 5 m or more and 100 m or less.

This LED panel comprising: a base substrate including circuit wiring; a plurality of light-emitting diodes disposed to form an array on the base substrate; a side optical layer located laterally to the plurality of light-emitting diodes and including a diffusing agent; and a plurality of upper optical layers respectively located on top of the plurality of light-emitting diodes and including a diffusing agent can provide uniform light in all directions through uniform light distribution by reducing color difference for different viewing angles that occurs due to the structure of a semiconductor light-emitting diode.

A self-assembly apparatus can include a fluid chamber for accommodating a fluid and semiconductor light-emitting elements, a conveyor to convey an assembly substrate so one surface of the assembly substrate is immersed in the fluid, the assembly substrate having a plurality of assembly electrodes, a magnet array spaced apart from the fluid chamber to apply a magnetic force to the semiconductor light-emitting elements, a power supply to apply power to the plurality of assembly electrodes disposed on the assembly substrate so that the semiconductor light-emitting elements are seated in a preset region on the assembly substrate, and a repair substrate disposed to face the one surface of the assembly substrate and including a plurality of pair electrodes on which an electric field is generated as power is supplied. The plurality of pair electrodes can be disposed at the same interval as the plurality of assembly electrodes.

A light-emitting substrate and a manufacturing method thereof are disclosed. In the embodiment of the present disclosure, by providing a groove on a base plate in the manufacturing method of the light-emitting substrate, the accuracy of coating the solder resist ink layer can be improved so as to reduce a distance between the solder resist ink layer and the pad assembly and avoid poor soldering or soldering failure caused by the overflow of the solder resist ink onto the pad.

A display device includes a first epitaxial structure vertically stacked, a first light emitting element including a second epitaxial structure and a third epitaxial structure, a second light emitting element spaced apart from the first light emitting element and including the first epitaxial structure, a first passivation layer arranged to surround a sidewall of the first light emitting element, and a second passivation layer arranged to surround a sidewall of the second light emitting element. Each of the first epitaxial structure, the second epitaxial structure, and the third epitaxial structure may include a structure in which a first semiconductor layer of a first conductivity type, a carrier blocking layer, an active layer, and a second semiconductor layer of a second conductivity type are sequentially stacked.