A MicroLED display panel includes a plurality of display structures, where each display structure includes a first electrode, a second electrode, a first semiconductor layer, a second semiconductor layer, and a light emitting layer; first electrodes, first semiconductor layers, and light emitting layers of adjacent display structures are independent of each other; the first semiconductor layer and the second semiconductor layer are respectively located on surfaces of two sides of the light emitting layer; the first electrode is located on a side that is of the first semiconductor layer and that is away from the light emitting layer, and the second electrode is located on a side that is of the second semiconductor layer and that is away from the light emitting layer; the light emitting layer of each display structure corresponds to one pixel region; and the second electrode is routed around each pixel region.

The invention relates to a preparation method of Na.sup.+/Cu.sup.2+ ions co-doped cesium lead bromide perovskite quantum dots, products and applications thereof, which belongs to the technical field of modification research of perovskite quantum dots. The invention discloses a preparation method of Na.sup.+/Cu.sup.2+ ions co-doped cesium lead bromide (CsPbBr.sub.3) perovskite quantum dots, which adopts lead bromide (PbBr.sub.2), oleic acid (OA), oleylamine (OAm), sodium ion precursors and copper ion precursors for the reaction preparation in octadecene (ODE), in which copper ions (Cu.sup.2+) and sodium ions (Na.sup.+) substitute A and B crystal sites in cesium lead bromide (CsPbBr.sub.3) perovskite fluorescent quantum dots respectively. The quantum dots have been effectively improved in photoluminescence quantum yield, thermal stability, etc., and can be used as an active layer to fabricate light emitting diodes which achieve the tuning of emission color from green to blue.

A method of manufacturing a wiring board includes: providing a substrate including an insulating resin and a metal member provided with an anti-rust layer on a surface facing a second surface of the insulating resin; forming a plurality of first holes passing through the metal member by etching; forming a second hole passing through the insulating resin and communicating with at least one of the first holes from a first surface side of the insulating resin; and filling an electroconductive paste to connect the second hole with any of the plurality of first holes and disposing the electroconductive paste on the first surface of the insulating resin to form wiring continuous with the filled electroconductive paste, the anti-rust layer on the surface of the metal member being removed from an inner bottom surface of the second hole in the forming of the second hole.

A method of manufacturing an optoelectronic device including the steps of manufacturing of the display pixel circuits, each comprising an emission surface, and on the surface, walls delimiting at least one cavity, of bonding of the display pixel circuits to a support, and of filling of the at least one cavity of each display pixel circuit with a first filling material to form a first color conversion module in the cavity.

An embodiment relates to a method for forming by defocused lithography a stack including a photosensitive layer based on a photosensitive resin having scattering particles. The stack further includes at least one pattern defined at least partly by a curved lateral wall so that an intersection of the curved wall with a plane substantially perpendicular to the plane of main extension of the stack forms a curved line. An embodiment also relates to the creation of an optoelectronic device including the stack, wherein the at least one pattern is at least one cavity at least partly defined by the curved lateral wall, and at least one light-emitting diode disposed in the at least one cavity.

A method for manufacturing a light-emitting device includes: preparing an intermediate body including: a substrate, and a plurality of light-emitting elements disposed on the substrate, each including a first surface serving as a light extraction surface, a second surface opposite to the first surface, and a lateral surface connecting the first surface and the second surface; applying a powder composition including a reflective member and a silicone resin powder from above the first surfaces of the plurality of light-emitting elements through a sieve to locate the powder composition on the substrate and between the lateral surfaces of the plurality of light-emitting elements; and forming a first covering member by applying vibration to the powder composition and subsequently applying pressure in a thickness direction of the substrate to perform compression molding.

An electronic device includes a first substrate, a first circuit layer, a second circuit layer, a side circuit layer, a light-shielding layer, a protective layer, and a circuit board. The first substrate has a first surface, a second surface, and a side surface. The first surface is opposite to the second surface. The side surface connects the first surface and the second surface. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The side circuit layer is disposed on the side surface and electrically connected to the first circuit layer and the second circuit layer. The light-shielding layer is disposed on the side circuit layer. The protective layer is disposed on the light-shielding layer and the second circuit layer, and continuously extends from the side surface to the second surface. The protective layer includes an opening exposing a portion of the second circuit layer. The circuit board is electrically connected to the second circuit layer through the opening.

A stretchable display device includes a base substrate having a rigid portion and a soft portion; a stretchable line in the soft portion over the base substrate; a first electrode and a second electrode in the rigid portion over the base substrate; and a light-emitting element contacting the first electrode and the second electrode, wherein the first electrode and the second electrode have a plurality of first protrusions and a plurality of second protrusions, and the light-emitting element is in contact with the plurality of first protrusions and the plurality of second protrusions.

A light-emitting element transfer stamp can include a stamp substrate, an elastic part disposed on the stamp substrate, a pickup portion disposed on the elastic portion, and a damper part connected to the elastic part. A method for fabricating a display device using the light-emitting element transfer stamp is also discussed.

A display device includes a substrate including a first area and a second area surrounding the first area, a first electrode disposed in the first area, a first bank layer disposed on the first electrode and defining a first opening that overlaps the first electrode and a second opening that overlaps the second area, an intermediate layer disposed on the first electrode, a second electrode disposed on the intermediate layer, and an encapsulation layer disposed on the second electrode and defining a third opening that overlaps the second area, wherein the first bank layer includes a first sub-bank layer and a second sub-bank layer, the second sub-bank layer being disposed on the first-sub bank layer and including a first tip extending toward the first opening and a second tip extending toward the second opening.