A display device includes a first barrier layer disposed on a substrate, a lower metal layer disposed on the first barrier layer, and a semiconductor layer disposed on the lower metal layer. In a cross-sectional view, the lower metal layer includes a first part spaced apart from the semiconductor layer and a second part closer to the semiconductor layer, in a plan view, an area of the second part is smaller than an area of the first part, and a side of the semiconductor layer and a side of the second part, which is adjacent to the semiconductor layer, are parallel to each other.

A method of manufacturing a display device includes a step of attaching a plurality of LED elements to an adhesive resin layer of a transfer substrate and a step of applying a thermal treatment to a plurality of bump electrodes, whereby electrodes of the plurality of LED elements are bonded to the plurality of bump electrodes of an array substrate. The array substrate has a mounting region to which the plurality of LED elements are mounted from the transfer substrate. Planar areas of the bump electrodes provided in a peripheral edge portion of the mounting region are larger than a planar area of the bump electrode provided in a central portion of the mounting region.

A display device includes a substrate including a main area including a display area, a sub area spaced apart from the main area in a first direction, and a plurality of bending areas connecting the main area and the sub area, a display panel in the display area on the substrate, and a printed circuit board attached to the sub area.

Provided is a display device. The display device includes a substrate, a display panel including a display disposed on a front surface of the substrate and a flexible base material extending from the display to surround a portion of each of a side surface and a rear surface of the substrate, and a support layer disposed between the side surface of the substrate and the flexible base material to support the flexible base material. The flexible base material includes: a pair of curved portions spaced apart from the support layer and a side cover portion that is configured to connect the pair of curved portions to each other and is in contact with the support layer.

A light plate, a method for assembling a light plate, and a display device are disclosed. The light plate includes a bottom plate, a vibration fitting assembly, and multiple light-emitting elements. The vibration fitting assembly includes a vibrator, a vibration plate disposed on a side of the vibrator facing away from the bottom plate, and a support elastic piece abutting against the vibration plate. Multiple groups of installation slots are defined in the vibration plate. Each light-emitting element includes a positioning structure matching a respective group of installation slots, and is installed in the installation slots through the positioning structure. When the light-emitting elements are laid on the vibration plate, the vibrator is started to drive the vibration plate to vibrate, thereby shaking the light-emitting elements, so that the positioning structure of each light-emitting element is fitted with the installation slots to complete the installation of the light-emitting elements.

A light-emitting array includes a semiconductor LED structure, multiple outcoupling structures, multiple independent first electrical contacts, and second electrical contact(s). The LED structure extends contiguously over the array. The second electrical contacts are in electrical contact with the second semiconductor layer. Each outcoupling structure is a protruding portion of the second semiconductor layer. Each first electrical contact includes a circumscribed electrode layer opposite a corresponding outcoupling structure. Each outcoupling structure and corresponding first electrical contact define a corresponding discrete, circumscribed pixel region within the contiguous area of the array, each pixel region separate from the others. Some light emitted in the pixel region is collected or redirected by the outcoupling structure to exit the outcoupling structure and propagate away from the array.

A display device includes a pixel electrode and a common electrode on the substrate and spaced from each other, a light emitting element including a first contact electrode on the pixel electrode and a second contact electrode on the common electrode and a first connection electrode that electrically connects the first contact electrode and the pixel electrode, and a second connection electrode that electrically connects the second contact electrode and the common electrode, wherein the light emitting element further includes: a plurality of semiconductor layer stacks, a protective layer around sides of the plurality of semiconductor layer stacks except one side and a reflective layer around the plurality of semiconductor layer stacks on the protective layer, wherein the protective layer and the reflective layer protrude from a top end of the semiconductor layer stack to an outside perpendicular to the side of the semiconductor layer stack.

A pixel may include a first bottom conductive layer including a plurality of first bottom conductive patterns, a second bottom conductive layer disposed on the first bottom conductive layer, and including a plurality of second bottom conductive patterns, and a semiconductor layer disposed on the second bottom conductive layer. The first bottom conductive layer may have a stacked structure including a first metal layer, an alloy layer, and a second metal layer stacked on each other. The second bottom conductive layer may have a stacked structure including a first metal layer, an alloy layer, and a second metal layer stacked on each other. A thickness of the alloy layer in the first bottom conductive layer may be greater than a thickness of the alloy layer in the second bottom conductive layer.

A chip including: four connection pads receiving respectively a supply voltage, a reference voltage, a first data signal, and a second data signal; at least two pixels; at least two drivers, each driver being configured to control one of the pixels, the drivers being coupled in a sequence; each driver including a first input and a first output, the first output of each driver being coupled to the first input of the following driver in the sequence, each driver being configured, in a programing step, to be programmed by storing digital data from the second data signal, and, in a display step, to drive one of the pixels from the stored digital data and from the first data signal.

A method includes transferring a first subset of the first LEDs from a first substrate to a first backplane to form first subpixels in pixel regions, transferring a first subset of the second LEDs to a second backplane and separating the first subset of the second LEDs from a second substrate to leave first vacancies on the second substrate, forming an additional electrically conductive material on a second subset of second LEDs located on the second substrate after transferring the first subset of the second LEDs to the second backplane, positioning the second substrate over the first backplane, such that the first subpixels are disposed in the first vacancies, and transferring the second subset of the second LEDs to a second subset of bonding structures on the first backplane to form second subpixels in the pixel regions, while a gap exists between the first subpixels and the second substrate.