A lighting-board packaging structure includes a circuit substrate, an LED chip, a diffuser structure, a black light-transmissive layer, a haze layer, and an anti-reflection layer. The LED chip is disposed on the circuit substrate by a chip-on-board process and emits a color light. The diffuser structure has two types of scattering particles doped therein and covers the LED chip for homogenizing and diffusing the color light. A doping concentration of each of the two types of scattering particles in the diffuser structure is not greater than 10%. The black light-transmitting layer is stacked on the diffuser structure to reduce reflection of an ambient light incident to the lighting-board packaging structure. The haze layer is stacked on the black light-transmissive layer for scattering the ambient light. The anti-reflection layer is stacked on the haze layer for allowing the ambient light to enter.

A lighting-board packaging structure includes a circuit substrate, an LED chip, a diffuser structure, a black light-transmissive layer, a haze layer, and an anti-reflection layer. The LED chip is disposed on the circuit substrate by a chip-on-board process and emits a color light. The diffuser structure has two types of scattering particles doped therein and covers the LED chip for homogenizing and diffusing the color light. A doping concentration of each of the two types of scattering particles in the diffuser structure is not greater than 10%. The black light-transmitting layer is stacked on the diffuser structure to reduce reflection of an ambient light incident to the lighting-board packaging structure. The haze layer is stacked on the black light-transmissive layer for scattering the ambient light. The anti-reflection layer is stacked on the haze layer for allowing the ambient light to enter.

A display device includes a pixel electrode and a common electrode on the substrate and spaced from each other, a light emitting element including a first contact electrode on the pixel electrode and a second contact electrode on the common electrode and a first connection electrode that electrically connects the first contact electrode and the pixel electrode, and a second connection electrode that electrically connects the second contact electrode and the common electrode, wherein the light emitting element further includes: a plurality of semiconductor layer stacks, a protective layer around sides of the plurality of semiconductor layer stacks except one side and a reflective layer around the plurality of semiconductor layer stacks on the protective layer, wherein the protective layer and the reflective layer protrude from a top end of the semiconductor layer stack to an outside perpendicular to the side of the semiconductor layer stack.

Glasses are disclosed which can be used to produce substrates for flat panel display devices. The glasses may be substantially alkali free. The glasses are doped with one or more transition metals (e.g., Ni, Co) and exhibit reduced optical transmittance to suppress light leakage from the display device and/or to improve contrast. The display device may be a bottom emission display device or a top emission display device. The display device may be a tiled display device. Glasses disclosed herein may be used, for example, as a baseplate having a plurality of display substrates disposed thereon, a display substrate (e.g., backplane) having a plurality of light emitters disposed thereon, a glass cover plate, or combinations thereof.

Glasses are disclosed which can be used to produce substrates for flat panel display devices. The glasses may be substantially alkali free. The glasses are doped with one or more transition metals (e.g., Ni, Co) and exhibit reduced optical transmittance to suppress light leakage from the display device and/or to improve contrast. The display device may be a bottom emission display device or a top emission display device. The display device may be a tiled display device. Glasses disclosed herein may be used, for example, as a baseplate having a plurality of display substrates disposed thereon, a display substrate (e.g., backplane) having a plurality of light emitters disposed thereon, a glass cover plate, or combinations thereof.

A display device includes a bank including an opening defining pixels, light emitting elements disposed in the pixels, a color conversion layer disposed on the light emitting elements in the opening, a capping layer overlapping the color conversion layer, and a color filter layer disposed on the capping layer. The color filter layer includes a low refractive material.

A display device includes a bank including an opening defining pixels, light emitting elements disposed in the pixels, a color conversion layer disposed on the light emitting elements in the opening, a capping layer overlapping the color conversion layer, and a color filter layer disposed on the capping layer. The color filter layer includes a low refractive material.

A display device includes a display area, a first signal pad, a second signal pad, an auxiliary circuit part, an organic protective layer, an insulating film, a first organic film, and a second organic film. The auxiliary circuit part disposed between the first signal pad and the second signal pad in a non-display area, and the organic protective layer overlaps the auxiliary circuit part. The insulating film includes a first insulating opening defined between the first signal pad and the auxiliary circuit part and a second insulating opening defined between the second signal pad and the auxiliary circuit part, and the insulating film may be disposed on the organic protective layer. The first and second organic film may be disposed respectively to fill at least a portion of the first and second insulating openings.

A display device includes a display area, a first signal pad, a second signal pad, an auxiliary circuit part, an organic protective layer, an insulating film, a first organic film, and a second organic film. The auxiliary circuit part disposed between the first signal pad and the second signal pad in a non-display area, and the organic protective layer overlaps the auxiliary circuit part. The insulating film includes a first insulating opening defined between the first signal pad and the auxiliary circuit part and a second insulating opening defined between the second signal pad and the auxiliary circuit part, and the insulating film may be disposed on the organic protective layer. The first and second organic film may be disposed respectively to fill at least a portion of the first and second insulating openings.

An electronic device includes a display panel including a base layer including an active area, which includes a hole area, an encapsulation layer covering light-emitting elements and including a first encapsulation inorganic layer, an encapsulation organic layer, and a second encapsulation inorganic layer, and dam patterns disposed on the hole area, and an input sensor including an organic pattern layer which overlaps a first sensing insulating layer, first conductive patterns, a second sensing insulating layer, second conductive patterns, a third sensing insulating layer, and the hole area, is disposed on the first sensing insulating layer, and is covered on the second sensing insulating layer. A module hole overlapping the hole area is defined, and the second encapsulation inorganic layer, the first sensing insulating layer, the second sensing insulating layer, and the third sensing insulating layer contact each other on at least one top surface of the dam patterns.