A light-emitting array includes a semiconductor LED structure, multiple outcoupling structures, multiple independent first electrical contacts, and second electrical contact(s). The LED structure extends contiguously over the array. The second electrical contacts are in electrical contact with the second semiconductor layer. Each outcoupling structure is a protruding portion of the second semiconductor layer. Each first electrical contact includes a circumscribed electrode layer opposite a corresponding outcoupling structure. Each outcoupling structure and corresponding first electrical contact define a corresponding discrete, circumscribed pixel region within the contiguous area of the array, each pixel region separate from the others. Some light emitted in the pixel region is collected or redirected by the outcoupling structure to exit the outcoupling structure and propagate away from the array.

A method for manufacturing a light-emitting device includes: providing a first structure including: a substrate having a first surface and a second surface, a plurality of semiconductor light-emitting units disposed on the second surface, and a semiconductor portion disposed on the second surface in a region in which the plurality of semiconductor light-emitting units are not disposed, the semiconductor portion being configured to emit no light; disposing the first structure on a support member such that the second surface faces the support member, disposing a first resin member between a portion of the first structure and a portion of the support member; and after the disposing of the first resin member, separating the substrate from the plurality of semiconductor light-emitting units and the semiconductor portion by irradiating laser light from a first surface side of the substrate toward the plurality of semiconductor light-emitting units and the semiconductor portion.

A light-emitting substrate and a manufacturing method are provided. The light-emitting substrate includes a substrate and light-emitting devices arranged at intervals thereon. Light-shielding structure is at a gap between the light-emitting devices and shields light emitted from the light-emitting devices laterally. The light-shielding structure and light-emitting devices do not overlap in a target light-emitting direction of the light-emitting devices, or overlap in a target light-emitting direction of the light-emitting devices by being less than a width. Since the light-shielding structure is at the gap between the light-emitting devices, light emitted by the light-emitting devices laterally is shielded, avoiding light from irradiating other devices and causing light crosstalk. Light from the light-emitting devices in the target light-emitting direction is not shielded or not completely shielded, eliminating an adverse effect on light efficiency of the light-emitting devices, improving the light-emitting effect of the light-emitting surface of the light-emitting substrate.

A method of forming a micro light-emitting diode (microLED) array may include forming pixel isolation structures on a sacrificial substrate, and mounting the microLEDs on a separate backplane. The processes that forms the pixel isolation structures, and which may damage the backplane or microLEDs can be separately performed on the sacrificial substrate. The pixel isolation structures can then be attached to the backplane and the sacrificial substrate can be removed. This allows the formation of the pixel isolation structures to be isolated, the microLEDs to be tested early in the process, and the interface between the microLEDs and subsequent layers to be free of adhesive.

An electronic device, including a circuit substrate, a light-absorbing layer, and an electronic component, is provided. The light-absorbing layer is disposed on the circuit substrate, and the light-absorbing layer includes an opening. The electronic component is disposed in the opening and is electrically connected to the circuit substrate. In a cross-sectional view of the electronic device, a profile of a sidewall of the opening has at least one arc-shaped edge, and an inclination angle between an extension line of the sidewall of the opening and a horizontal line is between 75 degrees and 105 degrees.

Provided is a micro-light emitting diode (micro-LED) pixel including a first micro-LED, a second micro-LED on the first micro-LED, a level of the first micro-LED and a level of the second micro-LED being different from each other in a vertical direction, and a first reflective layer on the first micro-LED opposite to the second micro-LED, the first reflective layer being configured to reflect light incident from at least one of the first micro-LED and the second micro-LED in a direction opposite to the incident direction, wherein on a plane from a top plan view, a size of the first micro-LED and a size of the second micro-LED are different from each other in a horizontal direction, and wherein the first micro-LED and the second micro-LED are aligned in vertical direction corresponding to a main emission direction of light.

A method of manufacturing a light-emitting device includes: providing a substrate, providing a light-emitting structure containing a plurality of solid-state light sources disposed on the substrate, and providing a hybrid encapsulation film for encapsulating the light-emitting structure. The hybrid encapsulation film includes a B-stage light-transmitting layer having a front surface and a back surface and a plurality of first reflective layers disposed at intervals on the front surface of the B-stage light-transmitting layer. The method further includes: laminating the back surface of the B-stage light-transmitting layer of the hybrid encapsulation film toward the solid-state light sources of the light-emitting structure, so that the solid-state light sources are embedded in the B-stage light-transmitting layer and correspond to the positions of the first reflective layers, and performing a thermal process to cure the hybrid encapsulation film.

A method of fabricating a display device includes: providing a substrate; forming an electrode layer on the substrate; bonding a light emitting element to the electrode layer; forming a light blocking layer to cover at least a portion of the light emitting element; ashing the light blocking layer; and forming a color filter on the light emitting element.

The backlight unit according to an embodiment comprises: a base substrate including circuit wiring; a plurality of light-emitting diodes disposed to form an array on the base substrate; a diffusion layer located laterally around the individual light-emitting diodes; and correcting lenses located on top of the respective light-emitting diodes, and can provide uniform white light in all directions through uniform light distribution by reducing color difference for different viewing angles that occurs due to the structure of a semiconductor light-emitting diode.

A method of manufacturing a light-transmissive member includes: providing a member including: a base having light transmissivity, the base having a first surface, a second surface opposite to the first surface, and a first film disposed on the first surface, the first film containing a substance removable by an acidic substance; and obtaining a light-transmissive second film having voids by bringing the first film into contact with the acidic substance. The first surface of the base includes a first region and a second region adjacent to the first region. A light transmittance of the first region is higher than a light transmittance of the second region. A thickness of the second film located in the second region is less than a thickness of the second film located in the first region.