A LED display device includes a display substrate; the display substrate includes an epitaxial layer, a common electrode layer, a reflective layer, and reflective electrode patterns. The epitaxial layer includes a first semiconductor layer, an active layer, and a second semiconductor layer sequentially stacked. The second semiconductor layer has first recessed regions, and protruding tabs are formed by the first recessed regions. The common electrode layer fills the first recessed regions and contact side walls of protrusion structures. The reflective layer covers top walls of the protruding tabs and the common electrode layer. The reflective electrode patterns are arranged at intervals on the side of the first semiconductor layer away from the active layer. A reflectivity of the reflective layer is less than that of the reflective electrode patterns to form resonant cavities, allowing light to be output from one side of the reflective layer.

Disclosed is a light emitting display device and a light emitting display panel. The light emitting display device includes a first column spacer and a second column spacer disposed on a bank layer. The first column spacer has a different shape form the second column spacer, and at least one of the first column spacer and the second column spacer includes a light-shielding material. The column spacer with the light-shielding material is disposed apart from a reflective electrode of a light emitting diode so that a metal component in the reflective electrode is not reacted with a component with the light-shielding material in the column spacer. Light reflected from metal electrodes and external light is blocked by the column spacer so that the light emitting display device with beneficial luminous efficiency is realized.

An image display device includes: a light-transmitting substrate comprising a first surface; a circuit element located on the first surface; a first wiring layer located on the circuit element and electrically connected to the circuit element; a first insulating film covering the circuit element and the first wiring layer on the first surface; a first portion located on the first insulating film and comprising graphene; a light-emitting element located on the first portion; a second insulating film covering at least a portion of the light-emitting element, the first portion, and the first insulating film; a second wiring layer located on the second insulating film and electrically connected to a light-emitting surface facing a surface of the light-emitting element on a side of the first insulating film; and a first via passing through the first insulating film and the second insulating film and electrically connecting the first and second wiring layers.

A display module and an electronic device are provided. The display module includes a circuit board including a plurality of individual electrodes and a plurality of common electrodes having a polarity opposite to a polarity of the plurality of individual electrodes; a plurality of light emitting diodes (LEDs), each LED of the plurality of LEDs including a plurality of semiconductor layers, a first pixel electrode connected to the plurality of individual electrodes, and a second pixel electrode at an opposite direction from the first pixel electrode, respectively; a top connection layer on the plurality of LEDs and connected to the second pixel electrode; and a plurality of connecting elements connecting the top connection layer to the plurality of common electrodes.

The disclosure provides a semiconductor chip including a first semiconductor element, a second semiconductor element, a filling layer, a transparent conductive layer and a first metal layer. The second semiconductor element is adjacent to the first semiconductor element. The filling layer wraps the first semiconductor element and the second semiconductor element. The transparent conductive layer is disposed on the filling layer. The transparent conductive layer electrically connects the first semiconductor element and the second semiconductor element. The first metal layer is disposed under the filling layer and includes a first portion and a second portion. The first portion is electrically connected to at least one of the first semiconductor element and the second semiconductor element. The second portion is disposed on a side surface of the filling layer. The semiconductor chip of the disclosure is adapted to reduce a defect rate or power consumption.

A display device includes a substrate including a light emission area and a non-light emission area; an anode electrode positioned on the light emission area of the substrate; a light emitting layer positioned on the anode electrode; a cathode electrode positioned on the light emitting layer; a protective electrode positioned on the cathode electrode; a pixel defining layer positioned on the non-light emission area of the substrate, defining an opening; and a common electrode positioned on the pixel defining layer and in contact with the protective electrode at a portion that overlaps the opening. An inclination angle of a side surface of the light emitting layer, which faces the non-light emission area, with respect to an upper surface of the anode electrode is 60 to 90.

A display device includes a substrate including a display area and a non-display area, a plurality of pixel electrodes disposed on the substrate in the display area, light emitting elements each disposed on a corresponding one of the plurality of pixel electrodes, a common electrode disposed on the light emitting elements and commonly connected to a plurality of pixels, and an auxiliary electrode disposed on the common electrode and not overlapping with the light emitting elements in a thickness direction of the substrate.

A display device includes a first pixel electrode on a substrate, a first light emitting element on the first pixel electrode and including a semiconductor stack and a protective layer, and a common electrode on the substrate. A side surface of the semiconductor stack includes a first portion and a second portion that are different from each other, the protective layer is on the first portion of the side surface of the semiconductor stack, and the common electrode is on the second portion of the side surface of the semiconductor stack.

A light-emitting diode (LED) epitaxial structure includes a first color epitaxial layer and a second color epitaxial layer that are stacked. Each of the first color epitaxial layer and the second color epitaxial layer includes a first stress buffer layer, a first carrier injection layer, a light-emitting layer, and a second carrier injection layer that are sequentially stacked in a first direction. The light-emitting layers are of different colors. One of the first carrier injection layer and the second carrier injection layer is an electron injection layer, and the other of the first carrier injection layer and the second carrier injection layer is a hole injection layer.

In a method of manufacturing a display device, the method includes providing a carrier module including a carrier wafer and light-emitting elements, forming a planarization layer between the light-emitting elements, forming a transparent electrode layer on the planarization layer, inspecting the light-emitting elements, and removing the planarization layer and the transparent electrode layer.