An optoelectronic apparatus comprises an at least partially transparent first cover, a second cover and at least one first layer segment, in particular intermediate layer segment, which is arranged between the first cover and the second cover. The first layer segment carries an arrangement of a plurality of optoelectronic light sources. The arrangement of the plurality of optoelectronic light sources has a defined shape with a defined contour and the first layer segment has the same shape and the same contour as the arrangement of the plurality of optoelectronic light sources.

A display module includes: a substrate including a mounting surface on which a plurality of inorganic light-emitting diodes emitting light in a first direction are mounted, a side surface, and a rear surface being opposite to the mounting surface; a front cover bonded with the mounting surface and covering the mounting surface in the first direction; a metal plate bonded with the rear surface; a side cover surrounding the side surface; and a side end member covering at least one portion of the side cover and extending in a second direction being orthogonal to the first direction along the side surface, wherein the side end member includes a body extending in the second direction, and a plurality of ribs extending from the body in the first direction and arranged at intervals along the second direction.

An optical interconnect may include an optoelectronic IC mounted to a substrate. The optoelectronic IC may have optoelectronic devices, for example microLEDs and/or photodetectors, mounted to a surface of the optoelectronic IC away from the substrate. The optoelectronic IC may have circuitry for driving the microLEDs and/or processing electrical signals from the photodetectors. The optoelectronic IC may be interfaced to a D2D interface chip. The D2D interface chip may be mounted to the optoelectronic IC.

A multi-chip package may include a system-on-chip (SoC) and an optical IO subassembly on a common substrate. The SoC and the optical IO subassembly may be linked by a die-to-die interface. The optical IO subassembly may include an optical IO IC with microLEDs and/or photodetectors bonded to a surface of the optical IO IC away from the common substrate. An optical window layer may shield optical elements of the optical IO subassembly from damage relating to molding compound related operations during assembly.

An LED device, particularly an LED lamp, includes pump LEDs and one or more phosphors allowing the lamp to emit both visible light and SWIR (short-wave infrared) useful in, for example, aviation safety. The emission spectrum of the phosphors provides SWIR light that has high transmission in air with a high water vapor concentration, making it suitable for use with SWIR cameras employed in aircraft. The layout of the LED device also delivers the sufficient visible flux required in aviation safety.

A packaging structure and a formation method thereof are provided. The packaging structure includes a base, a semiconductor element, a wrap layer, a cap layer, and an electrical connecting structure. The wrap layer is disposed on the base, covers the semiconductor element, and exposes the top surface of the semiconductor element. The cap layer is disposed on the wrap layer and the semiconductor element and includes a first and a second part. The first part is in contact with the semiconductor element. The second part is in contact with the wrap layer, wherein in measurement results of Fourier transform infrared spectroscopy, the ratio between maximum intensities at wavenumbers of 1060 cm.sup.1 to 1080 cm.sup.1 and 780 cm.sup.1 to 800 cm.sup.1 of the second part is greater than 0.65. The electrical connecting structure passes through the base and the wrap layer to electrically connect to the semiconductor element.

The present disclosure discloses a corner protection device for a display screen and a display screen assembly. In the corner protection device, when a locking member slides on a base to be in a locked state, a locking block is inserted into a locking slot, a first protrusion is inserted into a first through hole of a first corner protection plate, and a second protrusion is inserted into a second through hole of a second corner protection plate. The first corner protection plate and the second corner protection plate protrude from a corner of the display screen. When the locking member slides on the base to be in an unlocked state, the first protrusion or the second protrusion drives the locking block to disengage from the locking slot, and the first corner protection plate and the second corner protection plate are received in a corner of the display screen.

A light-emitting component includes a connection board with a mounting side. The light-emitting component also includes a light source. The light source is fastened and electrically connected to the connection board on the mounting side. The light-emitting component further includes a cover which covers the connection board in places on its mounting side and laterally surrounds the light source. The light-emitting component additionally includes an optical element. The optical element has a central region which is arranged downstream of the light source on the mounting side of the connection board. A provision is made to prevent impingement of light in the central region of the optical element.

An electromagnetic shielding cap for an electronic circuit includes a main surface and four lateral surfaces. A recessed portion is present in the first lateral surface provided by an open cavity in and at a base of the first lateral surface. An electronic circuit, such as an optical transmission and/or reception device, includes a chip bonded to a first main surface of a substrate. The electromagnetic shielding cap is mounted over the chip to the first main surface of the substrate. The circuit further includes an additional cap made of polymer material. The electromagnetic shielding cap is assembled to the substrate using a solder joint soldered both to a metal pad of the substrate and to at least one wall of the recessed portion. The second cap may be positioned over or under the first cap.

A display module includes: a substrate including a mounting surface on which a plurality of inorganic light-emitting diodes emitting light in a first direction are mounted, a side surface, and a rear surface being opposite to the mounting surface; a front cover bonded with the mounting surface and covering the mounting surface in the first direction; a metal plate bonded with the rear surface; a side cover surrounding the side surface; and a side end member covering at least one portion of the side cover and extending in a second direction being orthogonal to the first direction along the side surface, wherein the side end member includes a body extending in the second direction, and a plurality of ribs extending from the body in the first direction and arranged at intervals along the second direction.