A method for manufacturing a ceramic sintered body substrate includes preparing a ceramic substrate 1 provided with a through hole 2 before firing (S11), disposing a first metal paste 3 in the through hole (S12), and firing the ceramic substrate provided with the first metal paste (S14). In the disposing of the first metal paste, the first metal paste includes a plurality of particles of first metal powder (4) and a plurality of particles of active metal powder (50), and the first metal powder includes a metal powder (4a) serving as a core, and a covering metal member (40b) having a melting point lower than a melting point of the metal powder and covering at least a part of the metal powder, and in the firing of the ceramic substrate, a firing temperature is a temperature in a range from 700 C. to less than the melting point of the metal powder.

A display panel includes a base layer, first and second pixel circuit layers on the base layer, each of the first and second pixel circuit layers including a transistor and insulating layers, a first light-emitting diode on the first pixel circuit layer, a second light-emitting diode on the second pixel circuit layer, and a protective layer on the first and second light-emitting diodes. The insulating layers of each of the first and second pixel circuit layers include an inorganic insulating stack and a first organic insulating layer on the inorganic insulating stack, the first organic insulating layer of the first pixel circuit layer includes first grooves arranged along an edge thereof and is space from the second pixel circuit layer, and a portion of the protective layer is in each of the first grooves.

A light-emitting device is provided. The light-emitting device includes a substrate, a reflection layer on the substrate, a plurality of light-emitting elements on the substrate and in the reflection layer, and a plurality of light transmitting elements on a plurality of light-emitting elements and in the reflection layer. A plurality of upper surfaces of a plurality of light transmitting elements are exposed by the reflection layer. There is a first micrometer scale pitch between adjacent two light transmitting elements of a plurality of light transmitting elements. The reflection layer includes a light reflection material and a light absorption material.

A stretchable panel includes a stretchable substrate, and a strain sensor on the stretchable substrate, wherein the strain sensor includes a first gate electrode, a first polymer semiconductor layer overlapped with the first gate electrode along a thickness direction of the stretchable substrate and including polymer chains of the first polymer semiconductor layer, and a first source electrode and a first drain electrode electrically connected to the first polymer semiconductor layer and facing each other with the first polymer semiconductor layer interposed therebetween, and the polymer chains of the first polymer semiconductor layer are oriented so as to cross a first channel length direction extending from the first source electrode to the first drain electrode.

Devices and methods for a microLED array and a bonded CMOS driver chip. An example array includes a plurality of microLEDs having backside contacts, a plurality of through-substrate vias, a CMOS driver chip bonded to the backside contacts of the microLEDs, and an encapsulating layer forming an integrated surface of the array. At least one through-substrate via is paired with each microLED. Each through-substrate via electrically connects the paired microLED to the CMOS driver chip.

Discussed is a display device and, more specifically, can include a display device capable of preventing or reducing mura defects by including a display panel, a functional member disposed on the display panel, and an adhesive layer disposed between the display panel and the functional member and adjusting the modulus and creep of the adhesive layer.

An electronic device includes a second substrate disposed relative to a first substrate, a first light-emitting unit disposed between the first substrate and the second substrate, a first microstructure on the first surface of the first light-emitting unit and the first surface away from the first substrate, and an adhesive layer disposed between the second substrate and the first surface of the first light-emitting unit. There is a first gap between the adhesive layer and the first microstructure.

A packaging structure is provided. The packaging structure includes a dielectric layer, a redistribution layer, a plurality of light-emitting elements, a photodegradation prevention layer, and a cover layer. The redistribution layer is disposed on the dielectric layer. The plurality of light-emitting elements is disposed on the redistribution layer and electrically connected to the redistribution layer. The photodegradation prevention layer is disposed on the dielectric layer and surrounds the plurality of light-emitting elements. The cover layer is disposed on the plurality of light-emitting elements and the photodegradation prevention layer. The area of the photodegradation prevention layer accounts for at least 50% of the area of the cover layer.

A packaging structure is provided. The packaging structure includes a first dielectric layer, a redistribution structure, a plurality of light-emitting elements, an integrated circuit element, and a cover layer. The first dielectric layer has a top surface and a side surface. The redistribution structure is disposed in the first dielectric layer. The plurality of light-emitting elements is disposed on the first dielectric layer. The integrated circuit element is disposed on the first dielectric layer and adjacent to the plurality of light-emitting elements. The cover layer is disposed on the plurality of light-emitting elements and the integrated circuit element. The cover layer surrounds the plurality of light-emitting elements and the integrated circuit element. The cover layer is in direct contact with the top surface and the side surface of the first dielectric layer.

A light emitting device includes a substrate molded body composed of plate-like leads and a resin frame in which the leads are embedded and has parallel upper and back surfaces from which the leads are exposed, light emitting elements mounted on the exposed leads, and a sealing member covering the upper surface and the light emitting elements. The substrate molded body has an outer edge portion having an annular step portion recessed from the upper surface. The leads respectively have first protruding portions which protrude from lead bodies toward an outer edge of the substrate molded body and have entire end surfaces of protruding ends thereof which are exposed on the same plane as a side surface of the step portion. The sealing member has an outer edge convex portion covering the step portion of the substrate molded body.