The present disclosure relates to a display device. A display device of one embodiment is provided with at least one sensor area. The display device includes a substrate. The display device includes a thin film transistor on the substrate. The display device includes a planarization layer disposed to cover the thin film transistor. The display device includes a light emitting diode on the planarization layer. The light emitting diode including a first electrode, an emission layer on the first electrode, and a second electrode on the emission layer. The display device includes a bank configured to expose at least part of the first electrode and disposed on the planarization layer. The display device includes a sensor part disposed on a back surface of the substrate in the sensor area. The display device includes a heat dissipation panel disposed between the substrate and the first electrode.

The present disclosure relates to a display device. A display device of one embodiment is provided with at least one sensor area. The display device includes a substrate. The display device includes a thin film transistor on the substrate. The display device includes a planarization layer disposed to cover the thin film transistor. The display device includes a light emitting diode on the planarization layer. The light emitting diode including a first electrode, an emission layer on the first electrode, and a second electrode on the emission layer. The display device includes a bank configured to expose at least part of the first electrode and disposed on the planarization layer. The display device includes a sensor part disposed on a back surface of the substrate in the sensor area. The display device includes a heat dissipation panel disposed between the substrate and the first electrode.

A display device includes a first substrate on which a first sub pixel area, a second sub pixel area, and a third sub pixel area are respectively defined; a light emitting diode on the first substrate; a first refractive index layer corresponding to the first sub pixel area; a second refractive index layer corresponding to the second sub pixel area; a third refractive index layer corresponding to the third sub pixel area; and a protection layer on the first, second, and third refractive index layers, wherein at least two of the first refractive index layer, the second refractive index layer, and the third refractive index layer have different refractive indices.

A display device includes a first substrate on which a first sub pixel area, a second sub pixel area, and a third sub pixel area are respectively defined; a light emitting diode on the first substrate; a first refractive index layer corresponding to the first sub pixel area; a second refractive index layer corresponding to the second sub pixel area; a third refractive index layer corresponding to the third sub pixel area; and a protection layer on the first, second, and third refractive index layers, wherein at least two of the first refractive index layer, the second refractive index layer, and the third refractive index layer have different refractive indices.

An interposer may include a temporary substrate, a common pad disposed on the temporary substrate and light emitting diodes (LEDs) disposed on the common pad. Each of the light emitting diodes may include a first electrode, a first semiconductor layer, an emission layer, a second semiconductor layer, a second electrode, and a passivation layer. The second electrode, the second semiconductor layer, the emission layer, the first semiconductor layer and the first electrode may have a structure formed from sequential lamination. The passivation layer may enclose the second semiconductor layer, the emission layer and the first semiconductor layer. The common pad may be electrically connected to the second electrode at a lower side of the light emitting diodes. The first electrode in each of the light emitting diodes may extend to an upper portion of the passivation layer. A method for inspecting light emitting diodes disposed on a temporary substrate is also disclosed.

A method for manufacturing a light-emitting device includes providing a structure body. The structure body includes a wiring substrate, a light-emitting element, and a protection element. The wiring substrate includes a wiring part at an upper surface of the wiring substrate. The light-emitting element includes a pair of first electrodes, a first semiconductor layer, and a first element substrate. The protection element includes a pair of second electrodes, a second semiconductor layer, and a second element substrate. The pair of first electrodes and the pair of second electrodes face the upper surface of the wiring substrate. The pair of first electrodes and the pair of second electrodes are connected to the wiring part. The method includes removing at least a portion of the first element substrate of the light-emitting element and at least a portion of the second element substrate of the protection element from the structure body.

A method for manufacturing a light-emitting device includes providing a structure body. The structure body includes a wiring substrate, a light-emitting element, and a protection element. The wiring substrate includes a wiring part at an upper surface of the wiring substrate. The light-emitting element includes a pair of first electrodes, a first semiconductor layer, and a first element substrate. The protection element includes a pair of second electrodes, a second semiconductor layer, and a second element substrate. The pair of first electrodes and the pair of second electrodes face the upper surface of the wiring substrate. The pair of first electrodes and the pair of second electrodes are connected to the wiring part. The method includes removing at least a portion of the first element substrate of the light-emitting element and at least a portion of the second element substrate of the protection element from the structure body.

A strip-shaped light-emitting diode (LED) and an application device are provided. The strip-shaped LED includes a substrate, a plurality of LED chips, a plurality of electrical connection wires connected to electrodes of the LED chips, and a packaging colloid. The plurality of LED chips are linearly arranged, covered by the packaging colloid, and the packaging colloid has a horizontal fine trench between two specified adjacent LED chips. Reliability of resistance to cold and hot temperature cycles or cold and hot shocks can be improved.

A strip-shaped light-emitting diode (LED) and an application device are provided. The strip-shaped LED includes a substrate, a plurality of LED chips, a plurality of electrical connection wires connected to electrodes of the LED chips, and a packaging colloid. The plurality of LED chips are linearly arranged, covered by the packaging colloid, and the packaging colloid has a horizontal fine trench between two specified adjacent LED chips. Reliability of resistance to cold and hot temperature cycles or cold and hot shocks can be improved.

A display module includes: a substrate including a mounting surface on which a plurality of inorganic light-emitting diodes emitting light in a first direction are mounted, a side surface, and a rear surface being opposite to the mounting surface; a front cover bonded with the mounting surface and covering the mounting surface in the first direction; a metal plate bonded with the rear surface; a side cover surrounding the side surface; and a side end member covering at least one portion of the side cover and extending in a second direction being orthogonal to the first direction along the side surface, wherein the side end member includes a body extending in the second direction, and a plurality of ribs extending from the body in the first direction and arranged at intervals along the second direction.