A light emitting apparatus may include a housing having a cavity open at an upper side thereof, a light source disposed in the cavity of the housing and emitting light, and a lens disposed on the housing and including a light incidence and a light exit. The lens may include a first optical region comprising a curved surface having a diameter gradually decreasing from bottom to top and a second optical region disposed under the first optical region, the second optical region having a flat side surface. A maximum diameter of the first optical region is less than or equal to a maximum diameter of the second optical region. A light beam angle of the lens is narrower than a light beam angle of the light source, and the light beam angle of the lens is less than 90 degrees.

A packaging structure and method for packaging are provided. The packaging structure includes a substrate, a plurality of light-emitting elements, and a composite film. The light-emitting elements are disposed on the substrate, and the composite film is disposed on the substrate, covering the light-emitting elements. The composite film includes a first layer and a second layer. The first layer includes a first thermoplastic material, wherein the melt flow rate (MFR) of the first thermoplastic material is R1, and the first thermoplastic material is an ethylene-propylene copolymer, polyethylene terephthalate, or a combination thereof. The second layer includes a second thermoplastic material, wherein the melt flow rate (MFR) of the second thermoplastic material is R2, and 11(R1R2)11. The second thermoplastic material is a styrene-ethylene-butylene-styrene block copolymer, an ethylene-vinyl acetate copolymer (EVA), or a combination thereof.

A packaging structure and method for packaging are provided. The packaging structure includes a substrate, a plurality of light-emitting elements, and a composite film. The light-emitting elements are disposed on the substrate, and the composite film is disposed on the substrate, covering the light-emitting elements. The composite film includes a first layer and a second layer. The first layer includes a first thermoplastic material, wherein the melt flow rate (MFR) of the first thermoplastic material is R1, and the first thermoplastic material is an ethylene-propylene copolymer, polyethylene terephthalate, or a combination thereof. The second layer includes a second thermoplastic material, wherein the melt flow rate (MFR) of the second thermoplastic material is R2, and 11(R1R2)11. The second thermoplastic material is a styrene-ethylene-butylene-styrene block copolymer, an ethylene-vinyl acetate copolymer (EVA), or a combination thereof.

This application relates to a light-emitting device and a manufacturing method thereof, comprising a substrate, a plurality of light-emitting chips arranged on the front side of the substrate, and an encapsulation layer disposed on the substrate to cover each light-emitting chip. The encapsulation layer allows light emitted by the LED chips to pass through.

This application relates to a light-emitting device and a manufacturing method thereof, comprising a substrate, a plurality of light-emitting chips arranged on the front side of the substrate, and an encapsulation layer disposed on the substrate to cover each light-emitting chip. The encapsulation layer allows light emitted by the LED chips to pass through.

There is provided a light emitting diode, LED, filament, configured to emit LED filament light (105). The LED filament comprises an elongated carrier (110) extending in a first direction, A, comprising a first surface (112) and a second surface (114) oppositely arranged the first surface. The LED filament further comprises a first linear array (120) of a plurality of first light emitting diodes, LEDs, arranged on the first surface, wherein the plurality of first LEDs is arranged to emit ultra-violet, UV, light (121) with a first centroid wavelength, Xc1, in a wavelength range of 100-380 nm. The LED filament further comprises a second linear array (130) of a plurality of second LEDs, arranged on the second surface, wherein the plurality of second LEDs is arranged to emit violet light (131) with a second centroid wavelength, Xc.sub.2, in a wavelength range of 380-420 nm.

There is provided a light emitting diode, LED, filament, configured to emit LED filament light (105). The LED filament comprises an elongated carrier (110) extending in a first direction, A, comprising a first surface (112) and a second surface (114) oppositely arranged the first surface. The LED filament further comprises a first linear array (120) of a plurality of first light emitting diodes, LEDs, arranged on the first surface, wherein the plurality of first LEDs is arranged to emit ultra-violet, UV, light (121) with a first centroid wavelength, Xc1, in a wavelength range of 100-380 nm. The LED filament further comprises a second linear array (130) of a plurality of second LEDs, arranged on the second surface, wherein the plurality of second LEDs is arranged to emit violet light (131) with a second centroid wavelength, Xc.sub.2, in a wavelength range of 380-420 nm.

There is provided a display device including a stacked structure in which a first substrate having a display unit including a plurality of light emitting elements and a drive circuit unit provided around the display unit, and a second substrate that transmits light from the plurality of light emitting elements are stacked on each other, and a light shielding structure including a first light shielding film that covers at least a part of the drive circuit unit and a second light shielding film that covers at least a part of a region facing the drive circuit unit on a surface of the second substrate facing the first substrate.

There is provided a display device including a stacked structure in which a first substrate having a display unit including a plurality of light emitting elements and a drive circuit unit provided around the display unit, and a second substrate that transmits light from the plurality of light emitting elements are stacked on each other, and a light shielding structure including a first light shielding film that covers at least a part of the drive circuit unit and a second light shielding film that covers at least a part of a region facing the drive circuit unit on a surface of the second substrate facing the first substrate.

A light-emitting module includes: a plurality of light-emitting elements; a first substrate having an upper surface that includes an element mounting region on which the light-emitting elements are mounted, the first substrate including a plurality of first terminals; a second substrate having an upper surface that includes a substrate mounting region on which the first substrate is mounted, the second substrate including a plurality of second terminals; a plurality of wires each connected to corresponding ones of the first terminals and the second terminals; a light-shielding covering member disposed outward of the element mounting region so as to cover the plurality of wires; and a light-transmissive first projection disposed along the element mounting region between the element mounting region and the first terminals so as to be in contact with the covering member.