A light emitting device including a substrate, a plurality of light emitting elements, and a plurality of fluorescence modules is provided. The light emitting elements are disposed on the substrate in an array and electrically connected to the substrate. The fluorescence modules are disposed on the substrate and encapsulate the light emitting elements. The fluorescence modules include a first fluorescence module and a second fluorescence module. Colors of the first fluorescence module and the second fluorescence module are different. The first fluorescence module is adjacent to the second fluorescence module, and an interface between the first fluorescence module and the second fluorescence module is transparent.

A display device may include a lower substrate, a light emitting layer on the lower substrate, an encapsulating layer on the light emitting layer, a light blocking layer on the encapsulating layer and having a plurality of openings, a color conversion layer on the encapsulating layer and overlapping the plurality of openings, a spacer on the light blocking layer, an insulating layer on the light blocking layer and the color conversion layer and contacting the spacer, and a color filter layer on the insulating layer. A refractive index of the spacer may be smaller than a refractive index of the insulating layer.

A color conversion film array includes a first color conversion sub-film array and a second color conversion sub-film array, wherein each color conversion sub-film includes a photoresist and an organic fluorescent material, and may further includes inorganic oxide nanoparticles. The organic fluorescent materials are all hydrocarbons that are friendly to the environment. The manufacture of the first and second color conversion sub-film arrays merely requires exposure and development, and the process temperature is lower than 120 C., which can avoid degradation of the organic fluorescent material. The pixel density of the manufactured color conversion film array exceeds 5000 PPI.

Provided is a display device including a backplane substrate, a light emitting element layer including first electrodes disposed on the backplane substrate, light emitting elements disposed on the first electrodes, and a first oxide layer covering the light emitting elements, and a light conversion layer disposed on the light emitting element layer, the light conversion layer including color conversion layers overlapping the light emitting elements, and a second oxide layer covering lower surfaces of the color conversion layers, wherein the first oxide layer and the second oxide layer are bonded together.

A light-emitting package structure and method for producing the same. The light-emitting package structure includes a substrate, a light-emitting module, and an encapsulant. The substrate has a first top surface and a first bottom surface opposite to each other and a plurality of first side surfaces. The substrate has a first conductive layer and a second conductive layer respectively formed on the first top surface and the first bottom surface. The light-emitting module is disposed on the first conductive layer. The encapsulant covers the first conductive layer, a plurality of side surfaces of the light-emitting module, and the first top surface and the first side surfaces of the substrate.