H10H29/0361

MANUFACTURING METHOD OF ELECTRONIC DEVICE

A manufacturing method of an electronic device includes providing a first substrate, wherein the first substrate includes a circuit layer; cutting the first substrate; forming a wire on a first surface which is exposed after cutting the first substrate and on a second surface of the first substrate, wherein the first surface is adjacent to the second surface, and the wire is electrically connected to the circuit layer; disposing an electronic element on the circuit layer; bonding the first substrate after cutting and a second substrate to form an electronic module; and disposing a driving element on the second surface of the first substrate to be electrically connected to the wire.

DISPLAY DEVICE AND ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING DISPLAY DEVICE

Provided is a display device including a backplane substrate, a light emitting element layer including first electrodes disposed on the backplane substrate, light emitting elements disposed on the first electrodes, and a first oxide layer covering the light emitting elements, and a light conversion layer disposed on the light emitting element layer, the light conversion layer including color conversion layers overlapping the light emitting elements, and a second oxide layer covering lower surfaces of the color conversion layers, wherein the first oxide layer and the second oxide layer are bonded together.

LIGHT-EMITTING PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
20260114103 · 2026-04-23 ·

A light-emitting package structure and method for producing the same. The light-emitting package structure includes a substrate, a light-emitting module, and an encapsulant. The substrate has a first top surface and a first bottom surface opposite to each other and a plurality of first side surfaces. The substrate has a first conductive layer and a second conductive layer respectively formed on the first top surface and the first bottom surface. The light-emitting module is disposed on the first conductive layer. The encapsulant covers the first conductive layer, a plurality of side surfaces of the light-emitting module, and the first top surface and the first side surfaces of the substrate.

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC DEVICE
20260123161 · 2026-04-30 ·

A display device, a method for manufacturing the same, and an electronic device are provided. The display device includes a substrate, a pixel electrode layer on the substrate, a light emitting element on the pixel electrode layer and including a contact electrode, an organic layer in an island pattern shape covering a portion of a side surface of the light emitting element and a portion of the pixel electrode layer exposed by the light emitting element, a first reflective layer arranged on a side surface of the organic layer, and a protective layer protecting the light emitting element, the organic layer, and the first reflective layer.

DISPLAY DEVICE, ELECTRONIC DEVICE INCLUDING DISPLAY DEVICE, AND METHOD OF MANUFACTURING DISPLAY DEVICE
20260123154 · 2026-04-30 ·

A display device include: a first light emitting element disposed in a first pixel area, a second light emitting element disposed in a second pixel area spaced apart from the first pixel area, a first color conversion layer disposed on the first light emitting element, a second color conversion layer disposed on the second light emitting element, a first color filter layer covering the first color conversion layer, a second color filter layer covering the second color conversion layer, and a third color filter layer disposed in a first non-light emitting area between the first pixel area and the second pixel area. The third color filter layer is configured to selectively transmit a color light different from color lights selectively transmitted by the first color conversion layer and the second color conversion layer.

DISPLAY DEVICE, METHOD OF MANUFACTURING THE DISPLAY DEVICE, AND ELECTRONIC DEVICE

Provided is a display device including a light emitting element layer disposed on a substrate, a thin-film encapsulation layer disposed on the light emitting element layer, a counter substrate facing the substrate, a color filter layer disposed on a surface of the counter substrate and having light transmitting areas and a light blocking area defined, a wavelength conversion layer disposed on the color filter layer, and a filling layer disposed between the wavelength conversion layer and the thin-film encapsulation layer, wherein the wavelength conversion layer includes, a bank overlapping the light blocking area, light transmitting members disposed between portions of the bank and spaced apart from each other, and organic layers spaced apart from each other with the bank interposed between the organic layers and covering the light transmitting members, and lower surfaces of the organic layers and a lower surface of the bank are disposed on a same layer.