Devices and methods for a microLED array and a bonded CMOS driver chip. An example array includes a plurality of microLEDs having backside contacts, a plurality of through-substrate vias, a CMOS driver chip bonded to the backside contacts of the microLEDs, and an encapsulating layer forming an integrated surface of the array. At least one through-substrate via is paired with each microLED. Each through-substrate via electrically connects the paired microLED to the CMOS driver chip.

A manufacturing method of an electronic device includes providing a first substrate, wherein the first substrate includes a circuit layer; cutting the first substrate; forming a wire on a first surface which is exposed after cutting the first substrate and on a second surface of the first substrate, wherein the first surface is adjacent to the second surface, and the wire is electrically connected to the circuit layer; disposing an electronic element on the circuit layer; bonding the first substrate after cutting and a second substrate to form an electronic module; and disposing a driving element on the second surface of the first substrate to be electrically connected to the wire.

A light-emitting package structure and method for producing the same. The light-emitting package structure includes a substrate, a light-emitting module, and an encapsulant. The substrate has a first top surface and a first bottom surface opposite to each other and a plurality of first side surfaces. The substrate has a first conductive layer and a second conductive layer respectively formed on the first top surface and the first bottom surface. The light-emitting module is disposed on the first conductive layer. The encapsulant covers the first conductive layer, a plurality of side surfaces of the light-emitting module, and the first top surface and the first side surfaces of the substrate.

An LED bulb includes a bulb body, with a first set of components composed of an NPR material, and a second set of components composed of a PPR material. The first set of components include thermal encapsulants, thermal pottants, a heat sink, thermal interface materials, and LED chip encapsulants. The second set of components include a socket, a base, an LED driver, conformal coating, adhesives, reflector materials, an LED module, LEDs, primary optics, and secondary optics. The incorporation of NPR materials into LED bulb components can provide various advantages over LED bulbs that include only positive Poisson's ratio (PPR) materials. For example, NPR materials can facilitate improved heat dissipation from, and/or cooling of, integrated components of LED bulbs, among other benefits.

An LED bulb includes a bulb body, with a first set of components composed of an NPR material, and a second set of components composed of a PPR material. The first set of components include thermal encapsulants, thermal pottants, a heat sink, thermal interface materials, and LED chip encapsulants. The second set of components include a socket, a base, an LED driver, conformal coating, adhesives, reflector materials, an LED module, LEDs, primary optics, and secondary optics. The incorporation of NPR materials into LED bulb components can provide various advantages over LED bulbs that include only positive Poisson's ratio (PPR) materials. For example, NPR materials can facilitate improved heat dissipation from, and/or cooling of, integrated components of LED bulbs, among other benefits.