H01L41/333

Additive manufacturing print-heads for exotic material applications

Described herein is an additive manufacturing apparatus that is well-suited for constructing piezoelectric sensors. The additive manufacturing apparatus includes an extrusion nozzle formed of a conductive material such as aluminum. The extrusion nozzle has a channel by way of which printing material exits the extrusion nozzle, wherein a build plate is configured to receive the printing material responsive to the printing material exiting the extrusion nozzle. An arc suppressor formed of a semiconductor is coupled to the extrusion nozzle and is configured to dissipate excess charge that would otherwise exist on the extrusion nozzle when a relatively high bias voltage is applied to the extrusion nozzle. Thus, the arc suppressor mitigates arcing between the extrusion nozzle and the build plate. Arc suppressing gas is also optionally introduced into a printing region, thereby further mitigating arcing between the extrusion nozzle and the build plate.

Ultrasonic transducer with suppressed lateral mode
10795042 · 2020-10-06 · ·

An ultrasonic transducer may comprise a transducer body including a first face and a second face disposed on opposite sides of the transducer body, wherein the transducer body comprises a piezoelectric material; a first transducer edge disposed on the transducer body; and a second transducer edge disposed on the transducer body, wherein the first edge is disposed on the transducer body substantially opposite from the second edge, and wherein the first and second transducer edges intersect a perimeter of the transducer body, and wherein the first and second edge forms an angle no less than 3 degrees.

Piezoelectric device

A piezoelectric device includes a substrate that is flexible and thermally deformable, and a composite piezoelectric body disposed on the substrate. Output in accordance with deformation of the composite piezoelectric body is obtained. The composite piezoelectric body includes a piezoelectric layer containing an organic binder containing piezoelectric particles, a first electrode layer stacked on a first surface side of the piezoelectric layer, and a second electrode stacked on a second surface side of the piezoelectric layer. The substrate is insert molded and integrated with a molded resin body having a curved shape.

High intensity focused ultrasonic piezoelectric actuator and method of manufacturing the same
10584067 · 2020-03-10 · ·

Disclosed is a focused ultrasonic piezoelectric actuator having a novel type of piezoelectric device for focusing ultrasonic waves. The focused ultrasonic piezoelectric actuator includes a dome-shaped piezoelectric body for focusing ultrasonic waves and a rim configured to facilitate focusing of ultrasonic waves of the body and injection of the dome-shaped piezoelectric body during a powder injection molding process, remove warpage of the dome-shaped body during a sintering process, and reinforce focusing intensity of the ultrasonic waves. The rim is integrally formed with the body. Accordingly, in the focused ultrasonic piezoelectric actuator, a dome-shaped focused ultrasonic piezoelectric actuator for focusing ultrasonic waves using a thickness vibration mode at a MHz frequency band is easily manufactured by a powder injection molding method, and thus an ultrasonic focusing effect is maximized.

Piezoelectric element having improved sensitivity, method for manufacturing the same and piezoelectric sensor
10545059 · 2020-01-28 · ·

A piezoelectric element includes: a piezoelectric part; a first substrate and a second substrate, provided at both sides of the piezoelectric part, respectively; a first electrode layer, located between the first substrate and the piezoelectric part; and a second electrode layer, located between the electrode substrate and the piezoelectric part, wherein a surface of at least one of the first substrate and the second substrate close to the piezoelectric part is provided with a convex portion.

ULTRASONIC TRANSDUCER WITH SUPPRESSED LATERAL MODE
20200003924 · 2020-01-02 ·

An ultrasonic transducer may comprise a transducer body including a first face and a second face disposed on opposite sides of the transducer body, wherein the transducer body comprises a piezoelectric material; a first transducer edge disposed on the transducer body; and a second transducer edge disposed on the transducer body, wherein the first edge is disposed on the transducer body substantially opposite from the second edge, and wherein the first and second transducer edges intersect a perimeter of the transducer body, and wherein the first and second edge forms an angle no less than 3 degrees.

Piezoelectric material, piezoelectric element, and electronic apparatus

The present invention provides a piezoelectric material not containing lead and potassium, showing satisfactory insulation and piezoelectricity, and having a high Curie temperature. The invention relates to a piezoelectric material includes a main component containing a perovskite-type metal oxide represented by Formula (1): (Na.sub.xBa.sub.1-y)(Nb.sub.yTi.sub.1-y)O.sub.3 (wherein, 0.80x0.94 and 0.83y0.94), and an additive component containing at least one element selected from Mn and Ni, wherein the content of the Ni is 0 mol or more and 0.05 mol or less based on 1 mol of the perovskite-type metal oxide, and the content of the Mn is 0 mol or more and 0.005 mol or less based on 1 mol of the perovskite-type metal oxide.

ULTRASONIC TRANSDUCER, ULTRASONIC ENDOSCOPE, AND METHOD OF MANUFACTURING ULTRASONIC TRANSDUCER
20190350555 · 2019-11-21 · ·

An ultrasonic transducer includes a piezoelectric element that extends in a predetermined direction; a first electrode formed on a first surface of the piezoelectric element, in parallel with the direction, the first electrode including: a first portion for inputting an electrical signal to the piezoelectric element, and a first connection portion formed continuously with the first portion and intersecting the direction, wherein a first wiring is electrically connected to the first connection portion; and a second electrode disposed on a second surface, oppose to the first surface, of the piezoelectric element and spaced apart from the first electrode in the piezoelectric element, the second electrode including: a second portion for inputting an electric signal to the piezoelectric element, and a second connection portion formed continuously with the second portion, wherein a second wiring is electrically connected to the second connection portion and collectively arranged with the first wiring.

High-aspect ratio structure production method, ultrasonic probe production method using same, and high-aspect ratio structure
10283229 · 2019-05-07 · ·

A high-aspect ratio structure production method and an ultrasonic probe production method of the present invention include: forming, in a principal surface of a substrate, a plurality of pores each extending in a direction intersecting the principal surface; plugging, among the plurality of pores, one or more pores formed in a first region; and forming a recess in a second region by a wet etching process. A high-aspect ratio structure includes a grating having a plurality of convex portions, wherein each of the plurality of convex portions is provided with a plugging member plugging a plurality of pores formed therein in a thickness direction of the structure.

Ultrasonic fingerprint sensor and manufacturing method of the same

The present disclosure provides a manufacturing method of an ultrasonic fingerprint sensor. The method includes steps of: etching a plurality of through holes arranged in an array on an insulating substrate to form a frame; filling piezoelectric material into the through holes to form a plurality of piezoelectric posts corresponding to the plurality of through holes. The present disclosure also provides an ultrasonic fingerprint sensor. In the ultrasonic fingerprint sensor and the manufacturing method of the same according to the embodiment of the present disclosure, the frame is formed on the insulating substrate by etching, and the piezoelectric material is filled in the frame to form the piezoelectric posts to form the ultrasonic fingerprint sensor. The cost of the ultrasonic fingerprint sensor can be reduced because the etching apparatus is low-cost and the process is simple.